Package on a package

Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. PoP allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of being slightly taller. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.

Two widely used configurations exist for PoP:

During PCB assembly, the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top. The packages of a PoP stack become attached to each other (and to the PCB) during reflow soldering.

PoP packaging can be done by the chip manufacturer (such as Samsung or TSMC), or can be done by the OEM (such as Meizu).

The package on a package technique tries to combine the benefits of traditional packaging with the benefits of die-stacking techniques, while avoiding their drawbacks.

Traditional packaging places each die in its own package, a package designed for normal PCB assembly techniques that place each package directly on the PCB side-by-side. The 3D die-stacking system in package (SiP) techniques stacks multiple die in a single package, which has several advantages and also some disadvantages compared to traditional PCB assembly.

In embedded PoP techniques, chips are embedded in a substrate on the bottom of the package. This PoP technology enables smaller packages with shorter electrical connections and is supported by companies such as Advanced Semiconductor Engineering (ASE).

The most obvious benefit is motherboard space savings. PoP uses much less PCB area, almost as little as stacked-die packages.