Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules with more kinetic energy; collisions between molecules distributes this kinetic energy until an object has the same kinetic energy throughout. Thermal conductivity, frequently represented by k, is a property that relates the rate of heat loss per unit area of a material to its rate of change of temperature. Essentially, it is a value that accounts for any property of the material that could change the way it conducts heat. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it. In the absence of an opposing external driving energy source, within a body or between bodies, temperature differences decay over time, and thermal equilibrium is approached, temperature becoming more uniform.

Every process involving heat transfer takes place by only three methods:

A region with greater thermal energy (heat) corresponds with greater molecular agitation. Thus when a hot object touches a cooler surface, the highly agitated molecules from the hot object bump the calm molecules of the cooler surface, transferring the microscopic kinetic energy and causing the colder part or object to heat up. Mathematically, thermal conduction works just like diffusion. As temperature difference goes up, the distance traveled gets shorter or the area goes up thermal conduction increases:

Where:

Conduction is the main mode of heat transfer for solid materials because the strong inter-molecular forces allow the vibrations of particles to be easily transmitted, in comparison to liquids and gases. Liquids have weaker inter-molecular forces and more space between the particles, which makes the vibrations of particles harder to transmit. Gases have even more space, and therefore infrequent particle collisions. This makes liquids and gases poor conductors of heat.

Thermal contact conductance is the study of heat conduction between solid bodies in contact. A temperature drop is often observed at the interface between the two surfaces in contact. This phenomenon is said to be a result of a thermal contact resistance existing between the contacting surfaces. Interfacial thermal resistance is a measure of an interface's resistance to thermal flow. This thermal resistance differs from contact resistance, as it exists even at atomically perfect interfaces. Understanding the thermal resistance at the interface between two materials is of primary significance in the study of its thermal properties. Interfaces often contribute significantly to the observed properties of the materials.

The inter-molecular transfer of energy could be primarily by elastic impact, as in fluids, or by free-electron diffusion, as in metals, or phonon vibration, as in insulators. In insulators, the heat flux is carried almost entirely by phonon vibrations.

Metals (e.g., copper, platinum, gold, etc.) are usually good conductors of thermal energy. This is due to the way that metals bond chemically: metallic bonds (as opposed to covalent or ionic bonds) have free-moving electrons that transfer thermal energy rapidly through the metal. The electron fluid of a conductive metallic solid conducts most of the heat flux through the solid. Phonon flux is still present but carries less of the energy. Electrons also conduct electric current through conductive solids, and the thermal and electrical conductivities of most metals have about the same ratio.^{[clarification needed]} A good electrical conductor, such as copper, also conducts heat well. Thermoelectricity is caused by the interaction of heat flux and electric current. Heat conduction within a solid is directly analogous to diffusion of particles within a fluid, in the situation where there are no fluid currents.