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Memory timings
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Memory timings
Memory timings or RAM timings describe the timing information of a memory module or the onboard LPDDRx. Due to the inherent qualities of VLSI and microelectronics, memory chips require time to fully execute commands. Executing commands too quickly will result in data corruption and results in system instability. With appropriate time between commands, memory modules/chips can be given the opportunity to fully switch transistors, charge capacitors and correctly signal back information to the memory controller. Because system performance depends on how fast memory can be used, this timing directly affects the performance of the system.
The timing of modern synchronous dynamic random-access memory (SDRAM) is commonly indicated using four parameters: CL, TRCD, TRP, and TRAS in units of clock cycles; they are commonly written as four numbers separated with hyphens, e.g. 7-8-8-24. Variations include:
These parameters (as part of a larger whole) specify the clock latency of certain specific commands issued to a random access memory. Lower numbers imply a shorter wait between commands (as determined in clock cycles). The Intel systems also have Gear 2 (Gear type 0) and Gear 4 (Gear type 1).
What determines absolute latency (and thus system performance) is determined by both the timings and the memory clock frequency. When translating memory timings into actual latency, timings are in units of clock cycles, which for double data rate memory is half the speed of the commonly quoted transfer rate. Without knowing the clock frequency it is impossible to state if one set of timings is "faster" than another.
For example, DDR3-2000 memory has a 1000 MHz clock frequency, which yields a 1 ns clock cycle. With this 1 ns clock, a CAS latency of 7 gives an absolute CAS latency of 7 ns. Faster DDR3-2666 memory (with a 1333 MHz clock, or 0.75 ns exactly; the 1333 is rounded) may have a larger CAS latency of 9, but at a clock frequency of 1333 MHz the amount of time to wait 9 clock cycles is only 6.75 ns. It is for this reason that DDR3-2666 CL9 has a smaller absolute CAS latency than DDR3-2000 CL7 memory.
For DDR3 and newer (DDR4, DDR5), the four timings described earlier are not the only relevant timings and give a very short overview of the performance of memory. The full, manufacturer-verified timings of a memory module are stored inside of a module's Serial Presence Detect (SPD) chip. On DDR3 and DDR4 DIMM modules, this chip is a PROM or EEPROM flash memory chip and contains the JEDEC-standardized timing table data format. See the SPD article for the table layout among different versions of DDR and examples of other memory timing information that is present on these chips.
On some DIMM modules, there are also "verified" overclocking profiles in the SPD using XMP or Expo formats. They indicate faster timing information (and higher voltages) that the manufacturer has verified to work with the module: higher voltages tend to reduce memory latency (time-to-stabilize) at a cost of more heat production. The BIOS on a PC may allow the user to choose among JEDEC profiles, XMP/Expo profiles, or define their own timing adjustments in an effort to increase performance (with possible risk of decreased stability).
On Alder Lake CPUs and later, tRCD and tRP are no longer linked, while before Intel did not allow to set them to different values.
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Memory timings
Memory timings or RAM timings describe the timing information of a memory module or the onboard LPDDRx. Due to the inherent qualities of VLSI and microelectronics, memory chips require time to fully execute commands. Executing commands too quickly will result in data corruption and results in system instability. With appropriate time between commands, memory modules/chips can be given the opportunity to fully switch transistors, charge capacitors and correctly signal back information to the memory controller. Because system performance depends on how fast memory can be used, this timing directly affects the performance of the system.
The timing of modern synchronous dynamic random-access memory (SDRAM) is commonly indicated using four parameters: CL, TRCD, TRP, and TRAS in units of clock cycles; they are commonly written as four numbers separated with hyphens, e.g. 7-8-8-24. Variations include:
These parameters (as part of a larger whole) specify the clock latency of certain specific commands issued to a random access memory. Lower numbers imply a shorter wait between commands (as determined in clock cycles). The Intel systems also have Gear 2 (Gear type 0) and Gear 4 (Gear type 1).
What determines absolute latency (and thus system performance) is determined by both the timings and the memory clock frequency. When translating memory timings into actual latency, timings are in units of clock cycles, which for double data rate memory is half the speed of the commonly quoted transfer rate. Without knowing the clock frequency it is impossible to state if one set of timings is "faster" than another.
For example, DDR3-2000 memory has a 1000 MHz clock frequency, which yields a 1 ns clock cycle. With this 1 ns clock, a CAS latency of 7 gives an absolute CAS latency of 7 ns. Faster DDR3-2666 memory (with a 1333 MHz clock, or 0.75 ns exactly; the 1333 is rounded) may have a larger CAS latency of 9, but at a clock frequency of 1333 MHz the amount of time to wait 9 clock cycles is only 6.75 ns. It is for this reason that DDR3-2666 CL9 has a smaller absolute CAS latency than DDR3-2000 CL7 memory.
For DDR3 and newer (DDR4, DDR5), the four timings described earlier are not the only relevant timings and give a very short overview of the performance of memory. The full, manufacturer-verified timings of a memory module are stored inside of a module's Serial Presence Detect (SPD) chip. On DDR3 and DDR4 DIMM modules, this chip is a PROM or EEPROM flash memory chip and contains the JEDEC-standardized timing table data format. See the SPD article for the table layout among different versions of DDR and examples of other memory timing information that is present on these chips.
On some DIMM modules, there are also "verified" overclocking profiles in the SPD using XMP or Expo formats. They indicate faster timing information (and higher voltages) that the manufacturer has verified to work with the module: higher voltages tend to reduce memory latency (time-to-stabilize) at a cost of more heat production. The BIOS on a PC may allow the user to choose among JEDEC profiles, XMP/Expo profiles, or define their own timing adjustments in an effort to increase performance (with possible risk of decreased stability).
On Alder Lake CPUs and later, tRCD and tRP are no longer linked, while before Intel did not allow to set them to different values.