Mini Small Outline Package

The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.

Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.^[1]

The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions^[1] and 3mm × 4mm for the 12 and 16 pin version.^[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.^[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.^[2][1]

• μMAX or micro max - Maxim name for the MSOP package.^[4][2]
• μMAX-EP or micro max exposed pad - Maxim name for the MSOP package with exposed pad.^[2][4]
• MSE - Linear Technology name for the MSOP package with exposed pad.^[2]

• List of electronic component packaging types

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