Plating

Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.

Thin-film deposition has plated objects as small as an atom, therefore plating finds uses in nanotechnology.

There are several plating methods, and many variations. In one method, a solid surface is covered with a metal sheet, and then heat and pressure are applied to fuse them (a version of this is Sheffield plate). Other plating techniques include electroplating, vapor deposition under vacuum and sputter deposition. Recently, plating often refers to using liquids. Metallizing refers to coating metal on non-metallic objects.

In electroplating, an ionic metal is supplied with electrons to form a non-ionic coating on a substrate. A common system involves a chemical solution with the ionic form of the metal, an anode (positively charged) which may consist of the metal being plated (a soluble anode) or an insoluble anode (usually carbon, platinum, titanium, lead, or steel), and finally, a cathode (negatively charged) where electrons are supplied to produce a film of non-ionic metal.

Electroless deposition, also known as chemical or auto-catalytic plating, is a non-galvanic plating method that involves several simultaneous reactions in an aqueous solution, which occur without the use of external electrical power. The reaction is accomplished when hydrogen is released by a reducing agent, normally sodium hypophosphite (Note: the hydrogen leaves as a hydride ion) or thiourea, and oxidized, thus producing a negative charge on the surface of the part. The most common electroless deposition method is electroless nickel plating, although silver, gold and copper layers can also be applied in this manner, as in the technique of angel gilding.

Gold plating is a method of depositing a thin layer of gold on the surface of glass or metal, most often copper or silver.

Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. Therefore, a layer of a suitable barrier metal, usually nickel, has to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.

Metals and glass may also be coated with gold for ornamental purposes, using a number of different processes usually referred to as gilding.