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Infrared detector
Infrared detector
from Wikipedia
Prototype of high-speed infrared detector installed on the PIONIER instrument at ESO’s Paranal Observatory.[1]

An infrared detector is a detector that reacts to infrared (IR) radiation. The two main types of detectors are thermal and photonic (photodetectors).

The thermal effects of the incident IR radiation can be followed through many temperature dependent phenomena.[2] Bolometers and microbolometers are based on changes in resistance. Thermocouples and thermopiles use the thermoelectric effect. Golay cells follow thermal expansion. In IR spectrometers the pyroelectric detectors are the most widespread.

The response time and sensitivity of photonic detectors can be much higher, but usually these have to be cooled to cut thermal noise. The materials in these are semiconductors with narrow band gaps. Incident IR photons can cause electronic excitations. In photoconductive detectors, the resistivity of the detector element is monitored. Photovoltaic detectors contain a p-n junction on which photoelectric current appears upon illumination.

An infrared detector is hybridized by connecting it to a readout integrated circuit with indium bumps. This hybrid is known as a focal plane array.

Detector materials

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See also

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References

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from Grokipedia
An infrared detector is an electro-optical device that converts incident radiation, typically in the wavelength range of 0.75 to 1000 micrometers, into an electrical signal proportional to the radiation's intensity, enabling the detection of heat or invisible light emissions from objects above . These detectors operate on two primary principles: detection, where absorbed causes a measurable rise in a material (such as a change in resistance or voltage), and photon (quantum) detection, where individual excite electron-hole pairs in a , generating a or photovoltage. detectors, including bolometers, pyroelectric sensors, and thermopiles, function at or near with broadband spectral response but slower response times exceeding milliseconds, while photon detectors, such as those based on (HgCdTe), (InSb), or (InGaAs), often require cryogenic cooling for optimal performance and offer faster responses under nanoseconds with wavelength-specific sensitivity. Key performance metrics for detectors include (output signal per unit input power), (NEP, the minimum detectable power), and normalized detectivity (D*, a accounting for detector area and bandwidth), which together determine their sensitivity and suitability for low-light or high-speed applications. Historically, early detectors emerged in the 1930s using materials like for basic photodetection, with significant advancements in the 1950s–1970s driven by technologies like InSb and HgCdTe, primarily for military systems. Infrared detectors are essential across diverse fields due to their ability to sense thermal signatures invisible to the human eye, with applications spanning military surveillance (e.g., missile tracking and thermal imaging), medical diagnostics (e.g., thermography for fever detection), environmental monitoring (e.g., gas analyzers for CO₂ at 4.3 μm), astronomy (e.g., detecting distant celestial heat sources), and industrial uses (e.g., non-contact thermometers and flame monitors). Uncooled microbolometer arrays have revolutionized consumer and automotive sectors, enabling forward-looking infrared (FLIR) systems in vehicles for pedestrian detection, while cooled photon detectors dominate high-precision scientific instruments like Fourier-transform infrared (FTIR) spectrometers for molecular analysis. Ongoing challenges include reducing cooling requirements for photon detectors to improve portability and cost, mitigating noise from background fluctuations, and enhancing quantum efficiency (the fraction of photons converted to signal) in emerging materials like quantum dots or type-II superlattices; recent advancements as of 2025 include room-temperature mid-infrared photodetectors using novel nanomaterials such as graphene and quantum dots, enabling broader adoption in portable devices. These advancements continue to expand infrared technology's role in telecommunications (e.g., fiber-optic signal monitoring at 1.3–1.55 μm) and remote sensing, underscoring their interdisciplinary impact.

History

Early discoveries

In 1800, British astronomer conducted an experiment dispersing sunlight through a prism and measuring the temperature across the using a , discovering that the highest temperatures occurred beyond the red end, in an invisible region he termed "calorific rays," later identified as infrared . This finding established infrared as a form of extending the . In 1821, observed the , where a difference between junctions of dissimilar metals generates a voltage, laying the groundwork for devices to detect infrared radiation. Building on this, in the 1820s, scientists developed thermopiles—series of thermocouples—that converted infrared-induced heat into measurable electrical signals, enabling quantitative detection of . During the 1830s, Italian physicist Macedonio Melloni advanced detection by refining the into the more sensitive thermomultiplier, which amplified signals from weak heat sources and allowed detection of rays through various media, including over distances and obstacles. Melloni's instrument demonstrated the propagation of like light, marking a key step toward practical thermal sensing. These 19th-century innovations provided the foundational tools for detection that influenced 20th-century technological developments.

20th-century developments

The development of infrared detectors accelerated during , driven by military demands for and targeting systems. In , lead sulfide () detectors, initially explored in by E.W. Kutzscher, were mass-produced starting in for applications such as the Kiel IV system, offering sensitivity up to approximately 3 μm in the near-infrared range. In the United States, Robert J. Cashman advanced lead telluride (PbTe) detectors after 1944, improving performance for similar military uses. These lead salt photon detectors marked the shift toward practical semiconductor-based infrared sensing, though they required cooling for optimal operation. Post-war advancements in the late 1940s and 1950s built on these foundations, with the refinement of thermal detectors like bolometers—originally invented by Samuel P. Langley in the 19th century but enhanced for greater sensitivity—and the integration of photomultiplier tubes for image intensification. By 1945, image converter tubes, such as the RCA 1P25 developed during the war, were adapted for broader infrared viewing applications. The 1950s saw the emergence of cooled photon detectors, including early mercury cadmium telluride (HgCdTe) alloys discovered by W.D. Lawson in 1959, which allowed tunable bandgaps for mid-wave infrared (MWIR, 3-5 μm) detection, and indium antimonide (InSb) devices operational by the early 1960s in systems like the first TNO thermal imager. These innovations were propelled by military funding during the Cold War and the space race, which funded developments like PbS and PbTe seeker heads by 1955 and later transferred technology to astronomical applications. Infrared detector systems evolved through distinct generations in the latter half of the , reflecting advances in and integration. First-generation systems, from the 1950s to , relied on scanning mechanisms with single-element or linear arrays of photoconductive detectors, such as , InSb, or early HgCdTe, often cooled to 80 K, as seen in devices like the AGA Thermografiesystem 660 in 1965. Second-generation systems emerged in the , introducing staring focal plane arrays (FPAs) with two-dimensional photovoltaic arrays of HgCdTe, InSb, or (PtSi), enabled by charge-coupled devices (CCDs) invented in the late and hybrid integration with silicon readout circuits; the U.S. Common Module standard in 1975 exemplified this shift toward higher resolution and reduced scanning. By the , third-generation systems incorporated multicolor and dual-band capabilities, with photodetectors (QWIPs) invented in the mid-1980s and first demonstrated in 1987, allowing GaAs-based detection across multiple bands without tunable semiconductors. and programs, including high-volume production in the , were instrumental in these generational leaps, prioritizing performance for (FLIR) and applications. Parallel to these photon detector advancements, the saw breakthroughs in uncooled thermal detectors, particularly FPAs, which operated at without cryogenic cooling. In 1994, patented a (VOx)-based under the U.S. government's High-Density Array Development (HIDAD) program, enabling sensitive long-wave (LWIR, 8-12 μm) in compact, low-cost formats. This was licensed to companies like , leading to the production of high-resolution arrays, such as 320×240 pixel devices by the early 2000s, and facilitating the transition of from specialized military use to broader commercial, automotive, and consumer applications.

Fundamentals

Definition and overview

Infrared detectors are specialized devices designed to detect infrared radiation, which spans wavelengths from approximately 0.7 to 1000 micrometers (μm), and convert this energy into measurable electrical signals or visual images. These detectors play a crucial role in capturing electromagnetic waves beyond the visible spectrum, enabling applications that rely on thermal signatures rather than reflected light. The discovery of infrared radiation itself dates back to 1800, when astronomer William Herschel identified it through experiments measuring temperature variations in the solar spectrum. The infrared spectrum is commonly divided into several bands based on ranges, each associated with distinct detection challenges and applications: near-infrared (NIR, 0.7–1.4 μm), short-wave infrared (SWIR, 1.4–3 μm), mid-wave infrared (MWIR, 3–8 μm), long-wave infrared (LWIR, 8–15 μm), and far-infrared (FIR, 15–1000 μm). These divisions reflect the varying atmospheric transmission windows and energy levels of the radiation, influencing detector design and sensitivity. Unlike visible light detectors, which rely on reflected photons for , infrared detectors primarily sense emitted by objects at temperatures above , allowing detection in low-light or no-light conditions such as and . This capability stems from the fact that all matter with a temperature above 0 emits radiation according to blackbody principles. Key advantages include non-contact , which enables safe assessment of high-heat or hazardous environments, and the invisibility of to the , facilitating covert operations. As of 2025, infrared detectors span like remote controls and smartphones to industrial and systems, underscoring their pervasive integration across sectors. The supporting market for these technologies is valued at approximately $0.65 billion in 2025, reflecting robust demand driven by advancements in and sensing.

Operating principles

Infrared detectors operate by converting incoming infrared radiation into a measurable electrical signal, primarily through two distinct physical mechanisms: thermal and quantum processes. In thermal detection, infrared photons are absorbed by the detector material, leading to a rise in temperature that induces physical changes, such as variations in electrical resistance or mechanical properties, without direct conversion of photons to electrons. This heating effect relies on the detector's sensitivity to temperature-induced modifications in its structure or electrical characteristics. Quantum detection, in contrast, involves the direct interaction of photons with the detector's electronic structure, where photons with sufficient energy excite electrons from the valence band to the conduction band across the material's bandgap, generating a or photovoltage. The energy of an is given by E=hcλE = \frac{hc}{\lambda}, where hh is Planck's constant, cc is the , and λ\lambda is the ; for wavelengths typically ranging from 0.78 to 1000 μm, this energy falls between approximately 0.001 and 1.8 eV, necessitating materials with narrow bandgaps to enable such transitions. The detection of infrared radiation is fundamentally tied to blackbody emission principles, as most natural and artificial sources approximate blackbodies whose follows : B(λ,T)=2hc2λ51ehc/λkT1,B(\lambda, T) = \frac{2hc^2}{\lambda^5} \frac{1}{e^{hc / \lambda k T} - 1}, where kk is Boltzmann's constant and TT is the temperature in ; this equation describes how the intensity of emission increases with temperature, particularly in the longer wavelengths relevant to thermal imaging. Quantum detectors often require cryogenic cooling, such as to temperatures below 77 K using , to suppress thermal noise generated by random electron excitations that could mimic photon-induced signals, thereby enhancing signal-to-noise ratios.

Detector types

Thermal detectors

Thermal detectors convert incident infrared radiation into heat, which induces a measurable change in the detector's physical properties, such as resistance, polarization, or mechanical displacement. This indirect detection mechanism allows them to operate without cryogenic cooling, making them suitable for a wide range of applications. Bolometers represent a primary type of thermal detector, where absorbed raises the temperature of a sensing element, causing a corresponding change in its electrical resistance. The resistance variation is typically measured using a bias current or voltage, with the of resistance (TCR) determining sensitivity. Microbolometers, a compact evolution of this technology, employ materials like (VOx) or (a-Si) and operate uncooled at . These devices are integral to (FLIR) cameras, enabling imaging in consumer and industrial settings with array formats such as 320 × 240 pixels. Pyroelectric detectors exploit the -dependent spontaneous polarization in ferroelectric materials to generate a voltage or current signal. When radiation heats the material, a change in polarization produces a measurable charge proportional to the rate of variation. Lithium tantalate (LiTaO3) is a widely used material due to its high pyroelectric coefficient (~230 μC/m²K) and low , enabling uncooled operation with responsivities exceeding 7 kV/W. These detectors are often configured in arrays for imaging applications, offering fast response times on the order of milliseconds. Thermopiles consist of multiple thermocouples connected in series, where the absorbed creates a across the junctions, producing a voltage output via the Seebeck effect. Commonly constructed using materials like and or thin-film polysilicon, thermopiles operate uncooled and provide response from near-IR to far-IR (approximately 2–20 μm). They exhibit typical voltage responsivities of 50–500 V/W and are extensively used in non-contact thermometers, such as and forehead devices, as well as in nondispersive infrared (NDIR) gas sensors for detecting species like CO₂. Golay cells provide another historical approach to thermal detection, utilizing the pneumatic expansion of a gas within a sealed chamber heated by absorbed . This expansion deflects a flexible , which is optically monitored to produce an electrical signal via a . While effective with responsivities around 1.5 × 105 V/W, Golay cells are now less common due to their bulkier design compared to solid-state alternatives, though they remain relevant for specialized measurements. A key advantage of thermal detectors is their ability to function at without cooling, facilitating compact and cost-effective systems. They exhibit spectral response covering approximately 0.1–100 μm, insensitive to specific wavelengths, which contrasts with narrower-band quantum detectors. Common configurations include uncooled focal plane arrays, powering consumer devices like handheld cameras for security and maintenance tasks.

Quantum detectors

Quantum detectors, also referred to as detectors, function by absorbing that excite electrons across the bandgap or between quantized levels, generating a measurable electrical signal through direct photon-electron interactions. This contrasts with detectors by offering higher sensitivity and faster response times, particularly in narrow bands, though often requiring cryogenic cooling to suppress dark current and generation. Photoconductive detectors operate on the principle of increased electrical conductivity when photons generate free charge carriers that enhance current flow under an applied bias voltage. Lead sulfide () detectors are widely used for near- detection in the 1–3 μm range, while lead selenide (PbSe) extends sensitivity to 1.5–4.7 μm, both benefiting from polycrystalline thin-film structures that allow room-temperature operation in some configurations. Photovoltaic detectors generate a or photovoltage without external , leveraging p-n junction diodes where photon absorption creates electron-hole pairs separated by the built-in electric field. (InSb) photovoltaic detectors are a benchmark for mid-wave infrared applications, offering high quantum efficiency and detectivity up to 5.5 μm, typically requiring cooling to 77 K for optimal performance. Similarly, (HgCdTe) photovoltaic detectors are widely used for both mid-wave (3–5 μm) and long-wave (8–12 μm) infrared detection, with compositionally tunable cutoffs extending to over 20 μm, achieving background-limited detectivities exceeding 10^{10} cm Hz^{1/2}/W when cooled to 77 K. Quantum well infrared photodetectors (QWIPs) exploit inter-subband transitions in artificially confined s, where electrons are excited from bound ground states to higher energy levels within the conduction band of heterostructures. Fabricated using mature (GaAs)/aluminum gallium arsenide (AlGaAs) materials, QWIPs enable tunable detection in the mid- to long-wave (4–20 μm) with high uniformity in focal plane arrays, though they require grating structures for light coupling due to polarization selection rules. Quantum detectors are frequently designed for operation in atmospheric transmission windows to maximize signal propagation, such as the mid-wave infrared band (3–5 μm) and long-wave infrared band (8–12 μm), where and absorption is minimal. While cooled modes, exemplified by (HgCdTe) devices at 77 K, achieve background-limited performance with detectivities exceeding 10^10 cm Hz^{1/2}/W, uncooled variants like certain PbS/PbSe photoconductors offer portability at the cost of lower sensitivity.

Materials

Materials for thermal detectors

Thermal detectors, such as bolometers and pyroelectrics, convert incident infrared radiation into measurable temperature-induced changes in material properties like electrical resistance or polarization. The choice of materials is critical for achieving high sensitivity, low , and compatibility with uncooled operation, with selection based on figures of merit including the temperature coefficient of resistance (TCR) for resistive sensors or the pyroelectric coefficient for polarization-based devices. Vanadium oxide (VOx), particularly in its semiconducting forms like VO2 or mixed stoichiometries, is a preferred material for microbolometers due to its high TCR of approximately 2–3%/K at , which enables efficient conversion of to electrical signals. This property supports sensitive in the long-wave (LWIR) band of 8–14 μm, where atmospheric transparency is optimal for applications like thermal . VOx films are typically deposited via or reactive evaporation to achieve uniform resistivity (around 0.1–1 Ω·cm) and stability, though controlling oxygen content during fabrication is essential to maintain optimal TCR without phase transitions that could degrade performance. Amorphous silicon (a-Si) serves as a cost-effective alternative to VOx in uncooled microbolometer focal plane arrays, offering a TCR of about 2%/K alongside compatibility with standard processes for large-scale integration. Its lower processing temperature (below 400°C) reduces on supporting structures, making it suitable for high-volume production of arrays with pixel pitches as small as 17 μm. While a-Si's TCR is slightly inferior to VOx, its electrical noise is often lower, and hydrogen passivation during (PECVD) enhances stability and uniformity across arrays exceeding 1 megapixel. For pyroelectric detectors, ferroelectric materials such as barium titanate (BaTiO3) and lead zirconate titanate (PZT) are employed, leveraging their high pyroelectric coefficients—up to 40 nC/cm²·K for optimized PZT compositions—to generate charge from temperature fluctuations induced by modulated IR radiation. BaTiO3 provides lead-free options with coefficients around 10–50 nC/cm²·K depending on poling and doping, while PZT variants near the morphotropic phase boundary achieve superior values through sol-gel or sputtering deposition, enabling detectivities (D*) exceeding 109 cm·Hz1/2/W in thin-film forms. These materials require precise poling to align domains and minimize dielectric losses (tan δ < 0.02), ensuring responsive operation at frequencies up to 100 Hz without cryogenic cooling. Superconducting transition edge sensors (TES) utilize materials like niobium (Nb) or aluminum (Al), often in bilayer configurations (e.g., Al-Mn or Nb-Al), to provide ultra-sensitive bolometry through a sharp resistance transition at cryogenic temperatures (around 100–500 mK). Nb offers high critical temperature (Tc ~9 K) for wiring and ground planes, while Al enables low-Tc sensing elements with steep dR/dT slopes exceeding 108 Ω/K, achieving noise-equivalent powers (NEP) below 10-18 W/√Hz for far-infrared detection. These sensors demand dilution refrigeration but excel in photon-noise-limited applications like astronomy. Emerging two-dimensional materials, such as graphene, are being explored for thermal detectors due to their exceptional thermal sensitivity and low noise, enabling bolometers with NEP as low as 10^{-19} W/√Hz at room temperature as of 2025. Fabrication of thermal detector arrays presents significant challenges in MEMS integration, particularly for scaling to micro-scale pixels while maintaining thermal isolation and material integrity. Depositing VOx or a-Si thermistors on suspended membranes requires precise control of film stress (to avoid buckling) and etch selectivity during surface micromachining with sacrificial layers like amorphous silicon or polyimide, often leading to yield issues from non-uniformity or contamination. For pyroelectrics and TES, integrating ferroelectric or superconducting layers involves high-vacuum lithography and low-temperature annealing to prevent degradation, with vacuum packaging essential to minimize convective losses—yet achieving hermetic seals at wafer-scale remains a key bottleneck for commercial viability.

Materials for quantum detectors

Quantum infrared detectors rely on semiconductor materials with precisely engineered bandgaps to enable absorption and carrier generation at specific wavelengths. Among these, (HgCdTe, often abbreviated as MCT) stands out as a cornerstone material due to its direct bandgap that can be continuously tuned from approximately 0.1 eV to 1.5 eV by adjusting the cadmium composition xx in the formula \ceHg1xCdxTe\ce{Hg_{1-x}Cd_xTe}. This compositional flexibility allows HgCdTe to be optimized for key atmospheric windows, making it the dominant material for mid-wave (MWIR, 3–5 μm) and long-wave (LWIR, 8–12 μm) detection in photovoltaic configurations. For instance, compositions with x0.20.4x \approx 0.2–0.4 yield bandgaps suitable for MWIR applications, while lower xx values around 0.2 target LWIR performance. Another established material is (InSb), a with a fixed bandgap of approximately 0.17 eV at , which corresponds to sensitivity in the 3–5 μm MWIR range. detectors benefit from high and achieve quantum efficiencies exceeding 80%, often approaching 100% internally with appropriate antireflection coatings, enabling efficient photon-to-electron conversion. Its use is particularly prevalent in cooled focal plane arrays for high-performance imaging. To address limitations in traditional bulk materials, such as high dark currents in LWIR detection, type-II superlattices like InAs/GaSb have emerged as advanced alternatives. These heterostructures feature spatially separated and wavefunctions, resulting in an effective bandgap tunable for LWIR (8–12 μm and beyond) while suppressing Auger recombination rates compared to equivalent bulk HgCdTe. This reduction in non-radiative recombination enhances and uniformity in large-format arrays. Lead salt compounds, including lead sulfide (PbS) and lead selenide (PbSe), offer additional options for shorter-wavelength quantum detection. , with sensitivity in the near-infrared (up to ~3 μm), and PbSe, extending into the mid-infrared (up to ~7 μm), both exhibit high absorption coefficients on the order of 10410^410510^5 cm1^{-1}, allowing thin films to achieve strong absorption. These polycrystalline materials are valued for their compatibility with photoconductive modes and cost-effective deposition. In recent developments, colloidal quantum dots (QDs), particularly QDs, represent an emerging class of materials for quantum detectors. These solution-processable nanocrystals enable bandgap tuning via quantum confinement, supporting room-temperature operation and integration into flexible substrates for wearable or conformable sensing applications. Their versatility has led to detectors spanning near- to mid- with improved stability through ligand engineering. Additionally, two-dimensional materials such as black phosphorus and transition metal dichalcogenides (e.g., MoS2) are gaining attention for quantum IR detection due to tunable bandgaps and high carrier mobilities, enabling SWIR to MWIR sensitivity in thin, flexible devices as of 2025.

Performance characteristics

Key metrics

The performance of infrared detectors is evaluated through several key metrics that quantify their sensitivity, , and speed. Detectivity, denoted as DD^*, serves as a primary for sensitivity, independent of detector area and bandwidth. It is defined as D=AΔfNEPD^* = \frac{\sqrt{A \Delta f}}{NEP}
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