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Ivy Bridge (microarchitecture)
Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors (Core i7, i5, i3). Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors, from the former generation's 32 nm Sandy Bridge microarchitecture—also known as tick–tock model. The name is also applied more broadly to the Xeon and Core i7 Extreme Ivy Bridge-E series of processors released in 2013.
Ivy Bridge processors are backward compatible with the Sandy Bridge platform, but such systems might require a firmware update (vendor specific). In 2011, Intel released the 7-series Panther Point chipsets with integrated USB 3.0 and SATA 3.0 to complement Ivy Bridge.
Volume production of Ivy Bridge chips began in the third quarter of 2011. Quad-core and dual-core-mobile models launched on April 29, 2012 and May 31, 2012 respectively. Core i3 desktop processors, as well as the first 22 nm Pentium, were announced and available the first week of September 2012.
Ivy Bridge is the last Intel platform on which Windows older than Windows 7 and Windows Server older than Windows Server 2008 R2 are officially supported by Microsoft. It is also the earliest Intel microarchitecture to officially support Windows 10 64-bit (NT 10.0).
The Ivy Bridge CPU microarchitecture is a shrink from Sandy Bridge and remains largely unchanged. Like its predecessor, Sandy Bridge, Ivy Bridge was also primarily developed by Intel's Israel branch, located in Haifa, Israel. Notable improvements include:
The mobile and desktop Ivy Bridge chips also include some minor yet notable changes over Sandy Bridge:
Compared to its predecessor, Sandy Bridge:
Ivy Bridge's temperatures are reportedly 10 °C higher compared to Sandy Bridge when a CPU is overclocked, even at default voltage setting. Impress PC Watch, a Japanese website, performed experiments that confirmed earlier speculations that this is because Intel used a poor quality (and perhaps lower cost) thermal interface material (thermal paste, or "TIM") between the chip and the heat spreader, instead of the fluxless solder of previous generations. The mobile Ivy Bridge processors are not affected by this issue because they do not use a heat spreader between the chip and cooling system. Socket 2011 Ivy Bridge processors continue to use the solder.
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Ivy Bridge (microarchitecture)
Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors (Core i7, i5, i3). Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors, from the former generation's 32 nm Sandy Bridge microarchitecture—also known as tick–tock model. The name is also applied more broadly to the Xeon and Core i7 Extreme Ivy Bridge-E series of processors released in 2013.
Ivy Bridge processors are backward compatible with the Sandy Bridge platform, but such systems might require a firmware update (vendor specific). In 2011, Intel released the 7-series Panther Point chipsets with integrated USB 3.0 and SATA 3.0 to complement Ivy Bridge.
Volume production of Ivy Bridge chips began in the third quarter of 2011. Quad-core and dual-core-mobile models launched on April 29, 2012 and May 31, 2012 respectively. Core i3 desktop processors, as well as the first 22 nm Pentium, were announced and available the first week of September 2012.
Ivy Bridge is the last Intel platform on which Windows older than Windows 7 and Windows Server older than Windows Server 2008 R2 are officially supported by Microsoft. It is also the earliest Intel microarchitecture to officially support Windows 10 64-bit (NT 10.0).
The Ivy Bridge CPU microarchitecture is a shrink from Sandy Bridge and remains largely unchanged. Like its predecessor, Sandy Bridge, Ivy Bridge was also primarily developed by Intel's Israel branch, located in Haifa, Israel. Notable improvements include:
The mobile and desktop Ivy Bridge chips also include some minor yet notable changes over Sandy Bridge:
Compared to its predecessor, Sandy Bridge:
Ivy Bridge's temperatures are reportedly 10 °C higher compared to Sandy Bridge when a CPU is overclocked, even at default voltage setting. Impress PC Watch, a Japanese website, performed experiments that confirmed earlier speculations that this is because Intel used a poor quality (and perhaps lower cost) thermal interface material (thermal paste, or "TIM") between the chip and the heat spreader, instead of the fluxless solder of previous generations. The mobile Ivy Bridge processors are not affected by this issue because they do not use a heat spreader between the chip and cooling system. Socket 2011 Ivy Bridge processors continue to use the solder.