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22 nm process
22 nm process
22 nm process
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device
fabrication
MOSFET scaling
(process nodes)
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The "22 nm" node is the process step following 32 nm in CMOS MOSFET semiconductor device fabrication. It was first demonstrated by semiconductor companies for use in RAM in 2008. In 2010, Toshiba began shipping 24 nm flash memory chips, and Samsung Electronics began mass-producing 20 nm flash memory chips. The first consumer-level CPU deliveries using a 22 nm process started in April 2012 with the Intel Ivy Bridge processors.

Since at least 1997, "process nodes" have been named purely on a marketing basis, and have no relation to the dimensions on the integrated circuit;[1] neither gate length, metal pitch or gate pitch on a "22nm" device is twenty-two nanometers.[2][3][4][5]

The ITRS 2006 Front End Process Update indicates that equivalent physical oxide thickness will not scale below 0.5 nm (about twice the diameter of a silicon atom), which is the expected value at the 22 nm node. This is an indication that CMOS scaling in this area has reached a wall at this point, possibly disturbing Moore's law.

The 20-nanometre node is an intermediate half-node die shrink based on the 22-nanometre process.

TSMC began mass production of 20 nm nodes in 2014.[6] The 22 nm process was superseded by commercial 14 nm FinFET technology in 2014.

Technology demos

[edit]

On August 18, 2008, AMD, Freescale, IBM, STMicroelectronics, Toshiba, and the College of Nanoscale Science and Engineering (CNSE) announced that they jointly developed and manufactured a 22 nm SRAM cell, built on a traditional six-transistor design on a 300 mm wafer, which had a memory cell size of just 0.1 μm2.[7] The cell was printed using immersion lithography.[8]

The 22 nm node may be the first time where the gate length is not necessarily smaller than the technology node designation. For example, a 25 nm gate length would be typical for the 22 nm node.

On September 22, 2009, during the Intel Developer Forum Fall 2009, Intel showed a 22 nm wafer and announced that chips with 22 nm technology would be available in the second half of 2011.[9] SRAM cell size is said to be 0.092 μm2, smallest reported to date.

On January 3, 2010, Intel and Micron Technology announced the first in a family of 25 nm NAND devices.

On May 2, 2011, Intel announced its first 22 nm microprocessor, codenamed Ivy Bridge, using a FinFET technology called 3-D tri-gate.[10]

IBM's POWER8 processors are produced in a 22 nm SOI process.[11]

Shipped devices

[edit]
  • Toshiba announced that it was shipping 24 nm flash memory NAND devices on August 31, 2010.[12]
  • In 2010, Samsung Electronics began mass production of 64 Gbit NAND flash memory chips using a 20 nm process.[13]
  • Also in 2010, Hynix introduced a 64 Gbit NAND flash memory chip using a 20 nm process.[14]
  • On April 23, 2012, Intel Core i7 and Intel Core i5 processors based on Intel's Ivy Bridge 22 nm technology for series 7 chipsets went on sale worldwide.[15] Volume production of 22 nm processors began more than six months earlier, as confirmed by former Intel CEO Paul Otellini on October 19, 2011.[16]
  • On June 3, 2013, Intel started shipping Intel Core i7 and Intel Core i5 processors based on Intel's Haswell microarchitecture in 22 nm tri-gate FinFET technology for series 8 chipsets.[17] Intel's 22nm process has a transistor density of 16.5 million transistors per square millimeter (MTr/mm2).[18]

References

[edit]
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22 nm process

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The 22 nm process refers to a manufacturing technology node, primarily pioneered by , that utilizes a 22-nanometer feature size to fabricate integrated circuits with enhanced density and efficiency. Introduced in , it marked a significant advancement by replacing traditional 2D planar s with 3D Tri-Gate s, which feature a vertical fin surrounded by gates on three sides for superior electrostatic control and reduced leakage. This innovation enabled high-volume production starting in late 2012, sustaining through denser packing and improved scaling. Key technical features of 22 nm process include Tri-Gate that deliver up to 37% higher performance at low operating voltages and more than 50% reduction in active power consumption compared to the preceding 32 nm planar technology. The process achieved densities exceeding 2.9 billion per die in demonstrations, such as a 364 Mbit SRAM array, while maintaining compatibility with existing high-k structures from prior nodes. These improvements allowed for lower voltage operation, minimizing dynamic power and enabling more energy-efficient devices without sacrificing speed. The 22 nm process was first implemented in Intel's Ivy Bridge microprocessors, part of the Core family, which powered laptops, desktops, and servers launched in 2012. Subsequent generations, including Haswell in 2013, further refined the node for broader applications like chipsets and low-power components. While Intel led its development, variants emerged from other foundries; for instance, TSMC's 22 nm ultra-low-power (22ULP) process, derived from 28 nm technology, targeted mobile and embedded applications with optimized performance-per-watt metrics. GlobalFoundries also pursued a 22 nm fully depleted silicon-on-insulator (FD-SOI) node to compete in low-power segments. The adoption of the 22 nm process significantly influenced the by popularizing finFET-like (Tri-Gate) architectures, paving the way for sub-20 nm scaling in later nodes and driving innovations in , data centers, and embedded systems. Its legacy persists, with revived production for legacy components amid 14 nm supply constraints in 2019, and continued use in specialized applications into the , such as UMC's 22 nm embedded high-voltage (eHV) platform launched in 2024 and Samsung's 22 nm mobile display driver ICs introduced in 2025. Overall, the node exemplified a shift toward 3D transistor designs, balancing performance gains with power efficiency to meet escalating demands for portable and high-performance .

Overview

Definition and scaling

The 22 nm process node represents a generation in manufacturing where the nomenclature "22 nm" primarily denotes the targeted physical of transistors or the minimum metal half-pitch for interconnects, rather than a literal of all device dimensions. This evolved from earlier nodes, where feature sizes like and half-pitch were more closely aligned, but by the 22 nm era, it served as a and roadmap identifier for overall scaling progress. According to the International Technology Roadmap for Semiconductors (ITRS) update, the 22 nm node targeted a physical of approximately 22 nm, while metal 1 half-pitch was specified around 38 nm for units (MPUs) in 2011. This node achieved scaling through an approximate 0.7x linear dimension reduction from the preceding , which had a physical of about 27 nm and metal half-pitch near 52 nm, resulting in roughly 2x higher density per unit area. Such scaling adhered to principles by enabling more s on a chip while managing power and trade-offs, though the pace of shrinkage began to moderate due to physical limits in planar designs. In practice, implementations like Intel's 22 nm process featured typical s of 30-34 nm and a contacted poly pitch of 90 nm, providing concrete metrics for this density gain. Within the ITRS roadmap, the 22 nm node was positioned as a full technology generation succeeding the 32 nm node (introduced around 2009) and preceding the 14 nm node (around 2014), with production anticipated for 2011-2012. It marked a pivotal point emphasizing the transition from traditional planar transistors to 3D architectures, such as tri-gate FinFETs, to sustain scaling beyond classical limits while improving electrostatic control and reducing leakage. This shift addressed challenges in maintaining performance at sub-30 nm dimensions, aligning with ITRS projections for extended viability.

Historical timeline

The development of the 22 nm semiconductor process node built upon the prior evolution of planar transistor scaling, particularly Intel's introduction of the in 2009 with the Westmere family of processors, which marked the second generation of high-k metal gate technology and enabled initial production of chips integrating CPU and graphics cores. This node was followed by the industry-wide adoption of the 28 nm half-node, a transitional shrink from 32 nm that improved density and performance without a full architectural overhaul; Semiconductor Manufacturing Company () became the first foundry to offer 28 nm general-purpose technology in 2011, with variants optimized for high-performance and low-power applications entering volume production shortly thereafter. In May 2011, Intel unveiled its 22 nm process technology at the Intel Developer Forum, demonstrating the world's first 3-D tri-gate transistors designed to overcome planar scaling limitations by enhancing gate control and reducing leakage. Later that year, at the International Electron Devices Meeting (IEDM) in December 2011, Intel presented joint research papers highlighting advancements in tri-gate architectures, including scalability for low-power III-V field-effect transistors, underscoring the technology's potential for future nodes. Intel initiated high-volume manufacturing of 22 nm chips in the second quarter of 2012, with the Ivy Bridge processors representing the first commercial implementation, launching in April of that year and delivering significant improvements in performance-per-watt over the preceding 32 nm generation. In parallel, other foundries advanced their 22 nm efforts; announced its 22 nm ultra-low-power (ULP) process in 2017, targeting mobile and IoT applications, with mass production commencing in 2018 to provide a planar-compatible option derived from its 28 nm platform. Around 2014, began development of its 22FDX fully depleted silicon-on-insulator (FD-SOI) variant, culminating in the platform's official launch in July 2015 as a low-power alternative emphasizing energy efficiency for automotive and connected devices. By 2013, the 22 nm node signified the broader industry's transition away from widespread planar transistor use at leading edges, as Intel's tri-gate adoption accelerated the shift toward multi-gate 3-D structures to sustain amid diminishing returns from traditional scaling.

Technical features

Transistor architecture

The 22 nm process introduced a pivotal advancement in transistor architecture through Intel's adoption of Fin Field-Effect Transistors (FinFETs) in a tri-gate configuration, marking the industry's first commercial implementation of 3D transistor structures for logic devices. This design features a vertical fin serving as the channel, with the wrapping around three sides—top and two lateral surfaces—for superior channel control compared to traditional 2D planar MOSFETs. The dimensions typically include a height of approximately 30 nm and a width of 8-10 nm, enabling fully depleted operation that minimizes leakage while maximizing performance in high-volume manufacturing. In contrast to planar transistors, the tri-gate FinFET significantly reduces short-channel effects such as drain-induced barrier lowering and improves electrostatic integrity by increasing the gate-to-channel coupling, allowing for better at advanced nodes. This architectural shift results in enhanced due to the expanded effective channel perimeter, which can be approximated by the formula
Cgate=ϵox⋅Lgate(2Hfin+Wfin)tox,C_{\text{gate}} = \epsilon_{\text{ox}} \cdot \frac{ L_{\text{gate}} (2 H_{\text{fin}} + W_{\text{fin}} ) }{ t_{\text{ox}} },
where ϵox\epsilon_{\text{ox}} represents the oxide , HfinH_{\text{fin}} and WfinW_{\text{fin}} are the height and width, toxt_{\text{ox}} is the oxide thickness (or for high-k dielectrics, approximately 0.9 nm), and LgateL_{\text{gate}} is the gate length. The increased supports higher drive currents and faster switching speeds, with NMOS transistors achieving approximately 1.0 mA/μm under typical operating conditions. Intel's tri-gate FinFET differs from double-gate variants explored in other implementations, where the gate controls only two sides of the fin, potentially offering simpler fabrication but reduced electrostatic control. To further optimize performance, embedded silicon-germanium (eSiGe) stressors are integrated into the source and drain regions of PMOS transistors, providing a that boosts mobility by about 30% and enhances overall PMOS drive strength. These innovations collectively enable the 22 nm tri-gate architecture to deliver up to 37% performance improvement at low voltages relative to the preceding 32 nm planar .

Materials and parameters

The 22 nm process utilizes high-k metal gate (HKMG) technology to enable continued gate dielectric scaling beyond traditional SiO₂, incorporating hafnium oxide (HfO₂) as the primary high-k dielectric material paired with or metal gates. This stack achieves an of approximately 0.9 nm, which reduces gate leakage by orders of magnitude compared to SiO₂ while maintaining equivalent to thinner physical oxides. The HKMG approach, integrated with the Tri-Gate FinFET structure, supports low gate leakage for both high-performance and low-power variants. Strain engineering enhances charge carrier mobility in the channel, with tensile strained silicon applied to n-channel MOSFETs (NMOS) via raised source/drain regions and a fifth-generation process, while p-channel MOSFETs (PMOS) employ embedded silicon-germanium (SiGe) for compressive strain. Contact resistance is minimized using nickel-platinum (NiPt) silicide at the source and drain, achieving values around 10−9 Ω⋅cm210^{-9} \, \Omega \cdot \mathrm{cm}^2, which improves drive current and overall transistor efficiency. Key transistor parameters include a nominal supply voltage (VDD_{DD}) of 0.75–1.0 V for logic operation, enabling power-efficient switching, with off-state leakage current (Ioff_{off}) controlled below 10 pA/μm for thin-gate devices to meet low requirements. Ring oscillator stage delays reach approximately 10 ps, reflecting improved speed over prior nodes at matched voltages and power. Interconnects feature ultra-low-k carbon-doped oxide (CDO) dielectrics with a (k) of about 2.2 for the first six metal layers to reduce , using (Cu) metallization with thin barrier liners for all levels. Self-aligned vias enable resistances below 5 Ω, supporting high-density routing without excessive signal delay.

Manufacturing aspects

Lithography and fabrication

The 22 nm process relied on using 193 nm argon fluoride (ArF) light sources to pattern features, achieving a (NA) of 1.35 through water immersion between the lens and wafer. This approach extended the resolution of optical beyond traditional dry processes, enabling half-pitch features down to approximately 38 nm in a single exposure, though was essential for denser structures. Double patterning was employed for critical layers, such as the first metal (M1) interconnect, to achieve tight pitches around 80 nm without excessive edge placement errors, while higher metal layers used single patterning for cost efficiency. Quadruple patterning was not standard but could be applied selectively for complex metal lines in some implementations to resolve sub-20 nm features. Extreme ultraviolet (EUV) lithography was not adopted at introduction due to its technological immaturity, including insufficient source power and mask defectivity, making immersion the viable choice for high-volume manufacturing. Etching and deposition techniques were pivotal for precision at this scale. Atomic layer deposition (ALD) was used to form the high-k metal gate (HKMG) stack, depositing thin, conformal layers of hafnium-based dielectrics (e.g., HfO₂) with equivalent oxide thickness below 1 nm, followed by metal work function tuning. Self-aligned contacts (SAC) were integrated to minimize misalignment in source/drain connections, using dielectric spacers to define contact areas precisely amid aggressive transistor pitches. Fin formation for tri-gate transistors employed sidewall image transfer (also known as spacer-transfer lithography), where sacrificial spacers were patterned via lithography and etching to double fin density, achieving fin pitches of about 60 nm with minimal critical dimension variation. Wafer processing occurred on 300 mm silicon , with processes optimized for throughput and defect control. Initial yields were challenging due to the complexity of 3D structures but reached production levels comparable to prior nodes, supported by advanced . Thermal budgets were tightly managed below 1000°C in key steps to preserve embedded strain in source/drain regions, enhancing carrier mobility without relaxation during HKMG integration. Intel's implementation featured a gate-last process flow, where a sacrificial polysilicon gate was removed after source/drain formation, allowing independent optimization of the channel strain and gate stack. This sequence—fin patterning, dummy gate deposition, spacer formation, raised source/drain , then HKMG replacement—minimized diffusion and thermal exposure, critical for maintaining short-channel control in tri-gate devices.

Innovations and challenges

The 22 nm process marked a pivotal shift in semiconductor manufacturing by introducing Intel's 3D tri-gate architecture as a primary to surmount the electrostatic control limitations of planar s at advanced nodes. This , where the gate wraps around three sides of a raised fin, enhanced gate-to-channel coupling, mitigating short-channel effects and enabling fully depleted operation for improved drive current and reduced off-state leakage. Compared to the preceding 32 nm planar process, the tri-gate s delivered a 37% boost at equivalent power consumption, particularly at low operating voltages around 0.7 V, while also allowing over 50% lower active power at constant levels. A key challenge in implementing tri-gate FinFETs at 22 nm was fin variability, stemming from the nanoscale dimensions and constraints, which could introduce up to 10% variation in fin widths using 193 nm with double patterning. -to-fin spacing, approximately 52 nm (derived from a 60 nm fin pitch and ~8 nm fin width), further exacerbated potential inconsistencies, with such dimensional fluctuations contributing to variation in circuit speed due to impacts on effective channel width and mobility. Mitigation relied on advanced (OPC) techniques integrated into the flow, achieving local fin control below 1 nm to stabilize characteristics and minimize yield losses. Later variants, such as the 22FFL process introduced around 2017, tightened the fin pitch to 45 nm for enhanced density in mobile and RF applications. Power density emerged as another significant hurdle at 22 nm, where dynamic power scaled quadratically with supply voltage and linearly with (proportional to V2⋅fV^2 \cdot f), but subthreshold leakage was effectively reduced relative to the 32 nm node through tri-gate design and other countermeasures, enabling lower operating voltages. The tri-gate innovation addressed this by steepening the , thereby curbing leakage; complementary approaches, such as adaptive body biasing to dynamically adjust threshold via body voltage, were explored in parallel processes like fully depleted SOI variants to further optimize power efficiency. Interconnects at 22 nm also presented RC delay challenges, accounting for about 15% of overall circuit delay due to rising resistance from thinner lines and higher-k , which began to rival switching times in critical paths. While initial 22 nm implementations used low-k materials to mitigate , later process variants incorporated air-gap integration—voids replacing in non-critical regions—to reduce effective and cut RC by up to 18%, enhancing without new materials.

Commercial implementations

Intel's adoption

Intel pioneered the commercial adoption of the 22 nm process node, introducing it into high-volume manufacturing in late 2011 at its D1X fabrication facility in , with full production ramp-up occurring throughout 2012. This marked Intel's first use of 3D Tri-Gate transistors, a FinFET that enhanced performance and power efficiency compared to prior planar designs, building on internal research that began with the invention of the Tri-Gate structure in 2002 and progressed through demonstrations and optimizations over the subsequent decade. The core 22 nm process was optimized for reduced power consumption while maintaining high performance, enabling variants tailored to specific applications. High-performance configurations supported central processing units (CPUs) such as the Ivy Bridge family, which integrated over 1 billion transistors per die—reaching up to 2.9 billion in multi-core models—to deliver improved clock speeds and efficiency. In parallel, low-power variants were developed for embedded and mobile uses, including the Atom processor line with the microarchitecture, which achieved up to three times the performance or five times lower power draw relative to prior generations. Key milestones included the shipment of initial Ivy Bridge units in Q2 2012, comprising about 25% of 's total volume by mid-year, and ongoing yield optimizations that positioned 22 nm as the company's highest-yielding process to date by 2013.

Other foundries

While Intel pioneered the 22 nm process for high-performance logic applications, other leading foundries adopted the node later and tailored it primarily for specialty uses such as ultra-low power mobile devices, IoT, and analog/RF components, often with lower production volumes compared to Intel's scale. These implementations emphasized cost-effective scaling from prior nodes like 28 nm, prioritizing power efficiency over density for niche markets. TSMC introduced its 22 nm Ultra-Low Power (22ULP) process as a bulk technology derived from its 28 nm high-performance compact (28HPC) platform, targeting mobile and wearable applications with a focus on analog and RF integration. The process offers approximately 10% area reduction, over 30% speed improvement, or more than 30% power savings relative to 28HPC, enabling efficient designs for battery-constrained devices. began in 2016, following risk production in prior years, and it saw adoption in low-power SoCs rather than high-volume digital logic. GlobalFoundries launched the 22FDX platform in 2015 as a fully depleted silicon-on-insulator (FD-SOI) , providing FinFET-comparable and energy efficiency at costs similar to 28 nm planar processes, optimized for IoT sensors and ICs. It incorporates embedded non-volatile memory (eNVM) options such as eMRAM and resistive RAM for secure, low-latency storage in edge devices, with body to dynamically adjust and power down to 0.4 V operating voltages. The ultra-thin SOI layer enables reduced variability and better analog matching compared to bulk alternatives, though production volumes remained modest post-2015 due to ecosystem maturity challenges. Samsung employed its 22 nm process starting around 2013 for specialty applications like display driver ICs (DDIs) and image sensors, using planar architectures alongside early FinFET explorations to support /LCD panels in mobile devices. This node facilitated low-power DDIs with integrated touch and sensing functions, achieving for displays by the mid-2010s, but with emphasis on integration density for panels rather than broad logic scaling. Overall, these efforts lagged Intel's 2012 rollout by 1-3 years and focused on differentiated, lower-volume markets, reflecting strategic priorities in power-sensitive and analog domains over general-purpose .

Applications and products

Microprocessors and SoCs

The 22 nm process enabled Intel's first major commercial deployment in high-performance microprocessors through the Ivy Bridge microarchitecture, introduced in April 2012. These processors utilized tri-gate transistors for improved power efficiency and performance density compared to the preceding 32 nm planar designs. A representative example is the Core i7-3770K, a quad-core processor with hyper-threading for eight threads, a 3.5 GHz base clock boosting to 3.9 GHz, 8 MB of L3 cache, and a 77 W thermal design power (TDP), fabricated on a 160 mm² die containing approximately 1.4 billion transistors. Ivy Bridge delivered roughly 10-20% higher overall performance than Sandy Bridge processors at equivalent power levels, driven by the tri-gate architecture's efficiency gains, which allowed for higher clock speeds or reduced consumption in CPU-bound tasks. Integrated graphics saw even larger advances, with the HD Graphics 4000 providing up to twice the performance of Sandy Bridge's HD 3000 in 3D workloads, supporting DirectX 11 and enhancing capabilities. Intel extended the 22 nm node with the Haswell microarchitecture in June 2013, serving as a refresh that refined Ivy Bridge's design while retaining the same process for cost-effective scaling. Haswell emphasized integrated GPU enhancements, upgrading to the HD Graphics 4600 with up to 1.2 GHz dynamic frequency and improved execution units for 50-100% better graphics performance over Ivy Bridge in select applications. Processors like the Core i7-4770 featured four cores, eight threads, a 3.4 GHz base clock boosting to 3.9 GHz, 8 MB L3 cache, and an 84 W TDP, further optimizing for power-sensitive desktops and laptops. In system-on-chip (SoC) applications, applied 22 nm to the Bay Trail platform in late 2013, targeting tablets and hybrid devices with low-power Atom processors based on the . The Atom Z3770, for instance, integrated four cores clocked up to 2.4 GHz, 2 MB L2 cache, and Gen7 , achieving up to double the CPU performance and triple the throughput of prior 32 nm Atom SoCs like Clover Trail while supporting extended battery life in and Android systems. This marked a key transition for Intel's mobile SoCs from 32 nm, enabling competitive entry into the tablet market. Beyond , TSMC's 22 nm processes supported low-power SoC variants from other vendors, though mainstream mobile SoCs remained on 28 nm during the core 22 nm era; later wearable platforms like the Snapdragon W5+ Gen 1 incorporated 22 nm always-on co-processors for efficient low-power operations alongside 4 nm main dies.

Analog and power devices

In analog and power device applications, the 22 nm process enables specialized semiconductors that prioritize efficiency, integration, and performance in non-digital domains such as displays, power regulation, and sensing. These implementations leverage the node's balance of power reduction and analog/RF capabilities, derived from high-k (HKMG) architectures or fully depleted silicon-on-insulator (FD-SOI) variants, to support compact, low-voltage operations in consumer and industrial systems. A key adoption is in display driver integrated circuits (DDIs) for mobile devices, where System LSI has integrated the 22 nm process to drive and panels. This DDI achieves 16% overall power reduction compared to prior nodes, with up to 30% savings in logic circuits (from 1 V to 0.8 V operation), through optimized integration and reduced leakage, enabling brighter, more efficient displays without compromising refresh rates. For , GlobalFoundries' 22FDX FD-SOI platform stands out, supporting DC-DC converters with ultra-low quiescent currents (300 nA) and high light-load efficiency (75% at 10 μA). The technology incorporates varactors and transistors with transition frequencies (fT) over 350 GHz, allowing precise and high-frequency switching in compact footprints. These features make 22FDX suitable for automotive electronic control units (ECUs), where it meets Grade 1 qualifications for operation up to 150 °C , enhancing reliability in power distribution for engine management and advanced driver-assistance systems. In sensors and RF components, TSMC's 22ULP process facilitates image sensors (CIS) and millimeter-wave (mmWave) circuits, targeting ultra-low power IoT and applications. For CIS, 22ULP underpins image signal processors in stacked back-illuminated sensors, delivering and low readout noise for resolutions up to 12 MP in compact modules. In mmWave RF, the process supports low-noise amplifiers for efficient and in and modules, with general power reductions of 20–30% versus 28 nm equivalents.

Legacy and impact

Performance comparisons

The 22 nm process marked a substantial advancement over the preceding 32 nm node, primarily through the introduction of tri-gate transistors, which enabled a 37% performance increase at low voltages or over 50% power reduction while maintaining constant performance, according to Intel's engineering data. Transistor density rose to approximately 2.4 times that of the 32 nm process, with 22 nm achieving around 16.5 million transistors per square millimeter compared to 7.1 million for 32 nm, allowing for greater integration in comparable die sizes. This scaling also contributed to improved power efficiency, with 22 nm designs demonstrating over 50% reduction compared to 32 nm equivalents in representative low-power applications. In comparison to the subsequent 14 nm node, the 22 nm process offered cost advantages for mid-range devices due to lower fabrication complexity and yield maturity, despite 14 nm providing approximately 2.5 times the (or about 150% increase) of the 22 nm process through refined FinFET optimizations. Benchmarks illustrated these gains: for instance, Ivy Bridge processors on 22 nm delivered SPECint2006 scores approximately 20% higher than on 32 nm at similar power envelopes, reflecting combined architectural and process improvements. Thermal reached up to 100 W/cm² in high-performance 22 nm implementations, necessitating advanced cooling solutions but underscoring the node's capability for dense, efficient operation. Economically, the 22 nm process reduced costs per transistor through higher yields and density scaling, lowering per-wafer expenses compared to 32 nm. These metrics highlight the 22 nm node's balanced trade-offs in performance, power, and cost relative to adjacent generations, with brief benefits from early FinFET-like tri-gate structures enhancing gate control without the full complexity of later nodes.

Transition to successors

The transition from the 22 nm process to the 14 nm node marked a pivotal advancement in semiconductor scaling, driven by the need for continued performance gains amid physical limitations. Intel introduced its 14 nm process with the Broadwell microarchitecture in late 2014, representing a refinement of the tri-gate transistor technology first deployed at 22 nm, which evolved into more mature FinFET structures for improved gate control and reduced leakage. This shift enabled denser integration and lower power consumption, with initial products like the Core M processor targeting ultrathin devices. By 2015, the adoption became industry-wide, as competitors such as TSMC and Samsung ramped up 16 nm and 14 nm production, respectively, while early trials of extreme ultraviolet (EUV) lithography began to address patterning challenges for sub-14 nm features. The primary reasons for this transition stemmed from the need to further improve scaling beyond the 22 nm tri-gate introduction, where physical limits in feature size and yielded for continued performance gains due to quantum effects and resolution limits with 193 nm immersion tools. The 22 nm node served as a critical bridge to sub-20 nm regimes, introducing 3D architectures that mitigated short-channel effects and extended , but escalating manufacturing complexity—such as higher defect densities and cost—necessitated the move to FinFET-dominant processes for sustained economic viability. As of 2025, the 22 nm process continues in legacy applications, particularly in automotive and (IoT) sectors, where its balance of performance, power efficiency, and cost supports mature ecosystems without requiring the latest nodes. , for instance, utilizes its 22FDX platform for system-on-chips targeting 77 GHz and 120 GHz frequencies in advanced driver-assistance systems (ADAS), enabling collaborations like that with indie Semiconductor to accelerate adoption in vehicles. This ongoing production underscores 22 nm's significant role in specialized markets, prioritizing reliability over cutting-edge scaling. The 22 nm process profoundly influenced by delivering power-efficient processors that powered the proliferation of smartphones, tablets, and laptops during the , with architectures like Intel's Ivy Bridge and Haswell enabling thinner designs and longer battery life. The 22 nm process saw widespread adoption, with billions of chips shipped across the industry by 2020, cementing its role in the mobile boom and establishing a foundation for subsequent nodes.

References

  1. https://www.intc.com/news-events/press-releases/detail/655/intel-reinvents-transistors-using-new-3-d-structure
  2. https://download.intel.com/newsroom/kits/22nm/pdfs/22nm-Details_Presentation.pdf
  3. https://semiengineering.com/22nm-process-war-begins/
  4. https://www.tsmc.com/english/dedicatedFoundry/technology/logic
  5. https://hothardware.com/news/intel-revives-zombie-22nm-pentium-g3420-haswell-cpu
  6. https://www.umc.com/en/News/press_release/Content/technology_related/20240620
  7. https://semiconductor.samsung.com/news-events/tech-blog/22nm-mobile-display-driver-ic-makes-low-power-the-norm/
  8. https://ic.unicamp.br/~cortes/mo601/artigos_referencias/roadmap_22nm_iwai_mar09.pdf
  9. https://www.semiconductors.org/wp-content/uploads/2018/08/2011Interconnect.pdf
  10. https://people.eecs.berkeley.edu/~pister/147fa14/Resources/Intel22nm.pdf
  11. https://www.intc.com/news-events/press-releases/detail/828/moores-law-marches-on-at-intel
  12. https://www.tsmc.com/english/dedicatedFoundry/technology/logic/l_28nm
  13. https://download.intel.com/newsroom/kits/22nm/pdfs/Intel_Transistor_Backgrounder.pdf
  14. https://www.iqep.com/media/press-releases/2011/intel-and-iqe-present-three-joint-papers-at-the-iedm-conference-in-washington-dc/
  15. https://www.crn.com/news/components-peripherals/232900757/intel-launches-first-22-nm-ivy-bridge-processors
  16. https://gf.com/gf-press-release/globalfoundries-launches-industrys-first-22nm-fd-soi-technology-platform/
  17. https://spectrum.ieee.org/moores-law-milestones
  18. https://briefs.techconnect.org/wp-content/volumes/TCB2015v4/pdf/448.pdf
  19. https://ieeexplore.ieee.org/document/6330644
  20. https://www.researchgate.net/publication/261261820_Intel_Ivy_Bridge_unveiled_-_The_first_commercial_tri-gate_high-k_metal-gate_CPU
  21. https://pmc.ncbi.nlm.nih.gov/articles/PMC5313396/
  22. https://www.sciencedirect.com/topics/computer-science/gate-dielectric
  23. https://www.researchgate.net/publication/235342295_Scaling_the_MOSFET_gate_dielectric_From_high-k_to_higher-k_Invited_Paper
  24. https://www.eetimes.com/intels-22-nm-process-gives-mosfet-switch-a-facelift/
  25. https://www.researchgate.net/publication/236954044_Silicides_for_22nm_and_Beyond
  26. https://iopscience.iop.org/article/10.1149/1.3572315
  27. https://semiengineering.com/193i-lithography-takes-center-stage-again/
  28. https://download.intel.com/newsroom/kits/chipmaking/pdfs/Sand-to-Silicon_22nm-Version.pdf
  29. https://www.intechopen.com/chapters/62046
  30. https://ieeexplore.ieee.org/document/6417117
  31. https://www.researchgate.net/publication/253540090_Enabling_22-nm_Logic_Node_with_Advanced_RET_Solutions
  32. https://blog.stuffedcow.net/2012/10/intel32nm-22nm-core-i5-comparison/
  33. http://scis.scichina.com/en/2016/061402.pdf
  34. https://semiengineering.com/interconnect-challenges-grow-2/
  35. https://www.researchgate.net/publication/283505423_Low-k_interconnect_stack_with_metal-insulator-metal_capacitors_for_22nm_high_volume_manufacturing
  36. https://www.imec-int.com/en/imec-magazine/imec-magazine-september-2017/how-to-solve-the-back-end-of-line-rc-delay-problem
  37. https://www.intc.com/news-events/press-releases/detail/719/intel-announces-multi-billion-dollar-investment-in
  38. https://www.realworldtech.com/intel-22ffl-process/
  39. https://www.intc.com/news-events/press-releases/detail/507/intel-launches-low-power-high-performance-silvermont
  40. https://www.eetimes.com/intel-says-25-of-shipments-will-be-on-22-nm-in-q2/
  41. https://www.intc.com/filings-reports/all-sec-filings/content/0000050863-14-000078/exhibit99_2.pdf
  42. https://semiengineering.com/foundries-prepare-for-battle-at-22nm/
  43. https://www.tsmc.com/english/dedicatedFoundry/technology/logic/l_22nm
  44. https://pr.tsmc.com/static/campaign/2019april/tsmc_eu/technology.html
  45. https://gf.com/gf-press-release/globalfoundries-delivers-industrys-first-production-ready-emram-22fdx-platform-iot/
  46. https://www.eetimes.com/globalfoundries-launches-own-fdsoi-processes/
  47. https://www.intel.com/content/www/us/en/products/sku/65523/intel-core-i73770k-processor-8m-cache-up-to-3-90-ghz/specifications.html
  48. https://www.techpowerup.com/155994/ivy-bridge-official-benchmarks-markedly-better-performance-than-sandy-bridge
  49. https://www.intel.com/content/www/us/en/products/sku/75122/intel-core-i74770-processor-8m-cache-up-to-3-90-ghz/specifications.html
  50. https://arstechnica.com/gadgets/2013/06/haswell-is-here-intel-announces-first-4th-generation-core-cpus/
  51. https://www.intc.com/news-events/press-releases/detail/496/intel-readies-bay-trail-for-holiday-2013-tablets-and
  52. https://www.intel.com/content/www/us/en/products/platforms/details/bay-trail.html
  53. https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-W5-Plus-Gen-1-Wearable-Platforms-product-brief.pdf
  54. https://gf.com/technology-platforms/fdx-fd-soi/
  55. https://my.dolphin-design.fr/pm/dcdc-ulp-22fdx-1-8-5-5-0-5-3-3-01a_gf_22_fdx/
  56. https://gf.com/gf-press-release/globalfoundries-and-nxp-to-deliver-next-generation-22fdx-solutions-for-automotive-iot-and-smart-mobile/
  57. https://gf.com/blog/how-gf-fdx-and-finfet-solutions-are-powering-the-next-generation-of-wi-fi/
  58. https://www.techinsights.com/blog/sony-isp-112-mm-pixel-pitch-12-mp-stacked-back-illuminated-cmos-image-sensor-standard
  59. https://arstechnica.com/gadgets/2014/08/broadwell-is-coming-a-look-at-intels-low-power-core-m-and-its-14nm-process/
  60. https://www.tel.com/museum/magazine/material/150227_report04_01/03.html
  61. https://spie.org/Publications/Proceedings/Volume/9422
  62. https://www.renesas.com/en/blogs/semiconductor-process-technology-history-trends-and-evolution
  63. https://gf.com/gf-press-release/indie-semiconductor-and-globalfoundries-announce-strategic-collaboration-to-accelerate-automotive-radar-adoption/
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