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ARM Cortex-A73
View on Wikipediafrom Wikipedia
| General information | |
|---|---|
| Launched | 2016 |
| Designed by | ARM Holdings |
| Max. CPU clock rate | to 2.8 GHz |
| Physical specifications | |
| Cores |
|
| Cache | |
| L1 cache | 96–128 KiB (64 KiB I-cache with parity, 32–64 KiB D-cache) per core |
| L2 cache | 1–8 MiB |
| L3 cache | None |
| Architecture and classification | |
| Application | Mobile |
| Instruction set | ARMv8-A |
| Products, models, variants | |
| Product code name |
|
| History | |
| Predecessors | ARM Cortex-A72 ARM Cortex-A17 |
| Successor | ARM Cortex-A75 |
The ARM Cortex-A73 is a central processing unit implementing the ARMv8-A 64-bit instruction set designed by ARM Holdings' Sophia design centre. The Cortex-A73 is a 2-wide decode out-of-order superscalar pipeline.[1] The Cortex-A73 serves as the successor of the Cortex-A72, designed to offer 30% greater performance or 30% increased power efficiency.[2]
Design
[edit]The design of the Cortex-A73 is based on the 32-bit ARMv7-A Cortex-A17, emphasizing power efficiency and sustained peak performance.[3] The Cortex-A73 is primarily targeted at mobile computing.[4] In reviews, the Cortex-A73 showed improved integer instructions per clock (IPC), though lower floating point IPC, relative to the Cortex-A72.[5]
Licensing
[edit]The Cortex-A73 is available as SIP core to licensees, and its design makes it suitable for integration with other SIP cores (e.g. GPU, display controller, DSP, image processor, etc.) into one die constituting a system on a chip (SoC).
The Cortex-A73 is also the first ARM core to be modified through ARM's semi-custom 'Built on ARM' license.[6][7] The Kryo 280 was the first released semi-custom product, though the modifications made relative to the stock Cortex-A73 were not announced.[5]
Products
[edit]The HiSilicon Kirin 960, released in 2016, utilizes 4 Cortex-A73 cores (clocked at 2.36 GHz) as the 'big' cores in a big.LITTLE arrangement with 4 'little' ARM Cortex-A53 cores.[8]
The MediaTek Helio X30 utilizes 2 Cortex-A73 cores (at 2.56 GHz) as the 'big' cores in deca-core big.LITTLE arrangement with 4 Cortex-A53 and 4 Cortex-A35 'little' cores.[9]
The Kryo 280, released in March 2017 by Qualcomm in the Snapdragon 835, uses a modified Cortex-A73 core.[5][10] The SoC utilizes 8 Kryo 280 cores in a big.LITTLE arrangement as two 4-core blocks, clocked at 2.456 GHz and 1.906 GHz. The modifications made by Qualcomm relative to the stock Cortex-A73 core are unknown, and the resulting Kryo 280 core demonstrated increased integer IPC.[5] The Kryo 260 also used Cortex-A73 cores, though at lower clock speeds than the Kryo 280 and in combination with Cortex-A53 cores.[11]
The Cortex-A73 is also found in a wide range of mid-range chipsets such as the Samsung Exynos 7885, MediaTek Helio P series, and other HiSilicon Kirin models. Like the Snapdragon 636/660, most of these chipsets implement 4 A73 cores and 4 A53 cores in a big.LITTLE configuration, although some lower end models of Samsung chips implement only 2 A73 cores with 6 A53 cores.
See also
[edit]- ARM Cortex-A72, predecessor
- ARM Cortex-A75, successor
- Comparison of ARMv8-A cores, ARMv8 family
References
[edit]- ^ "Cortex-A73 Processor". ARM Holdings. Retrieved 2017-03-28.
- ^ Cutress, Ian; Tallis, Billy (29 May 2016). "Computex 2016: ARM Press Conference Live Blog". Anandtech. Archived from the original on May 31, 2016. Retrieved 29 March 2017.
- ^ Frumusanu, Andrei (29 May 2016). "The ARM Cortex A73 - Artemis Revealed". Anandtech. Archived from the original on May 31, 2016. Retrieved 29 March 2017.
- ^ Sims, Gary (30 May 2016). "The Cortex-A73, a CPU that won't overheat – Gary explains". Android Authority. Retrieved 29 March 2017.
- ^ a b c d Hummrick, Matt; Smith, Ryan (22 March 2017). "The Qualcomm Snapdragon 835 Performance Preview". Anandtech. Archived from the original on March 22, 2017. Retrieved 22 March 2017.
- ^ Frumusanu, Andrei (29 May 2016). "ARM Details Built on ARM Cortex Technology License". Anandtech. Archived from the original on May 31, 2016. Retrieved 29 March 2017.
- ^ Triggs, Robert (4 January 2017). "Qualcomm's Kryo 280 and 'Built on ARM Cortex Technology' explained". Android Authority. Retrieved 29 March 2017.
- ^ "Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA". AnandTech. 2016-10-19. Archived from the original on October 20, 2016.
- ^ Humrick, Matt (27 February 2017). "MediaTek Announces Helio X30 availability: 10 CPU cores at 10nm". Anandtech. Archived from the original on February 28, 2017. Retrieved 29 March 2017.
- ^ "Get small, go big: Meet the next-gen Snapdragon 835". Qualcomm. 2016-11-17.
- ^ "Snapdragon 660 Processor". Qualcomm.
ARM Cortex-A73
View on Grokipediafrom Grokipedia
The ARM Cortex-A73 is a high-performance, power-efficient CPU core developed by Arm Holdings, implementing the Armv8-A 64-bit architecture and designed primarily for premium mobile and embedded applications such as smartphones and automotive infotainment systems.[1] Announced in May 2016 as part of Arm's premium mobile processor suite, it supports configurations of 1 to 4 symmetrical multiprocessing (SMP) cores per cluster, with multiple coherent clusters enabled via AMBA 4 ACE interconnect technology, enabling scalable big.LITTLE heterogeneous processing when paired with efficiency cores like the Cortex-A53 or Cortex-A35.[2][3]
Key architectural features include per-core L1 instruction and data caches, a shared L2 unified cache per cluster, and support for advanced instruction sets such as AArch64 (64-bit), AArch32 for backward compatibility with Armv7, TrustZone security, Neon advanced SIMD and DSP extensions, VFPv4 floating-point unit, and hardware virtualization.[3] The core achieves clock speeds up to 2.8 GHz in mobile process nodes, delivering the highest peak and sustained performance in its low-power class while offering up to 30% improved power efficiency over predecessors like the Cortex-A72, making it suitable for battery-constrained devices with demanding workloads in augmented reality, photography, and computing.[1][3]
In terms of integration and power management, the Cortex-A73 features a compact footprint as the smallest Armv8-A premium processor at the time of release, with low-power L2 wait-for-interrupt (WFI) states, dynamic retention modes for L2 RAMs, and compatibility with Arm's Mali GPUs, TrustZone security IP, and CoreSight SoC-400 debug/trace components via standard AMBA interfaces.[1][3] Targeted at system-on-chip (SoC) designs in slim form factors, it has been widely adopted in flagship mobile SoCs for enhanced user experiences in immersive applications, though later Cortex-A series cores have since succeeded it in Arm's portfolio for even greater efficiency and AI capabilities.[1]
Overview and Specifications
Introduction
The ARM Cortex-A73 is a high-performance central processing unit (CPU) core implementing the ARMv8-A 64-bit instruction set architecture. Announced by ARM Holdings on May 30, 2016, at Computex in Taipei, it was positioned as a key component of the company's premium mobile processor portfolio for 2017 devices.[2][4] Designed from scratch by ARM's team at the Sophia Antipolis design center in France, the core emphasized mobile-focused optimizations for efficiency and sustained operation.[5] Serving as the successor to the Cortex-A72 in ARM's high-performance mobile lineup, the A73 was later followed by the Cortex-A75 as its direct replacement.[6] This progression marked an evolution toward more capable processors for power-constrained environments, building on the big.LITTLE heterogeneous computing approach by pairing with efficiency cores like the Cortex-A53 or A35. Targeted primarily at premium smartphones and tablets, the Cortex-A73 also supported emerging applications such as augmented reality (AR), virtual reality (VR), and advanced computational photography.[2] Its design prioritized sustained peak performance without thermal throttling, enabling operation at frequencies up to 2.8 GHz on 10 nm processes while delivering 30% better efficiency than its predecessor.[7]Technical Specifications
The ARM Cortex-A73 implements the ARMv8-A instruction set architecture, supporting both 64-bit AArch64 execution and 32-bit AArch32 legacy mode for backward compatibility with ARMv7 software.[3] Its microarchitecture features an out-of-order, superscalar design with a 2-wide decode stage, enabling a sustained throughput of up to two instructions per cycle.[8] The core supports configurations of 1 to 4 cores per cluster, with shared L2 cache and compatibility for multiple clusters in heterogeneous big.LITTLE systems, often paired with efficiency cores like the Cortex-A53.[3] It is single-threaded per core, lacking hardware multithreading capabilities.[1] Maximum clock frequencies reach up to 2.8 GHz when implemented on advanced process nodes.[1] Optimized for 16 nm FinFET processes and scalable to smaller nodes such as 10 nm, the Cortex-A73 delivers efficient performance in mobile and embedded applications.[7] It includes support for key extensions, such as hardware virtualization from the ARMv8-A base, along with optional cryptography accelerations for AES and SHA algorithms, and CRC32 via ARMv8.1 compatibility in select implementations.[3][9]Design and Microarchitecture
Core Design
The ARM Cortex-A73 core was engineered with a primary focus on achieving a balance between high sustained performance and low power consumption, particularly for mobile applications, while delivering up to a 25% reduction in area compared to the Cortex-A72 on the same process node.[7] This design philosophy prioritized efficiency in premium smartphones and other battery-constrained devices, enabling higher clock speeds up to 2.8 GHz without excessive thermal throttling. The core implements the ARMv8-A architecture, emphasizing sustained workloads over peak bursts to support immersive experiences like gaming and augmented reality.[1] The Cortex-A73 employs a cluster-based configuration supporting up to four cores per cluster, initially designed for big.LITTLE heterogeneous systems.[8] This allows for scalable multi-core setups, such as pairing A73 cores with efficiency cores like the Cortex-A53, using a shared L2 cache and AMBA 4 ACE interconnect for coherent memory access. The core's out-of-order execution framework underpins its ability to handle complex instruction streams efficiently.[10] Branch prediction in the Cortex-A73 features advanced algorithms with a two-level global history buffer, contributing to up to 10% better performance at iso-frequency compared to the Cortex-A72.[7][11] The load/store unit supports up to three loads and two stores per cycle, enhanced by store forwarding optimizations to reduce latency in data-dependent operations.[10] For integer operations, the core features dual pipelines equipped with arithmetic logic units (ALUs), barrel shifters, and multipliers, enabling parallel execution of scalar instructions to maintain high throughput.[8] The floating-point and SIMD capabilities are handled by a NEON unit providing 128-bit vector processing, though it exhibits lower instructions per cycle (IPC) compared to integer units due to simplified scheduling mechanisms.[10] This design choice trades some vector performance for overall power savings, aligning with the core's mobile optimization goals while still supporting advanced media and graphics workloads.[8]Pipeline and Execution Units
The ARM Cortex-A73 implements a superscalar, out-of-order pipeline optimized for energy efficiency in mobile computing, featuring an 11-stage integer pipeline that supports clock speeds up to 2.8 GHz.[12] The front end includes a four-stage fetch unit delivering instructions to a 2-wide decode stage, which processes variable-length ARM instructions by splitting them into two parallel streams. Subsequent rename and dispatch stages follow, enabling up to two instructions to be dispatched per cycle to the execution units, with the overall design sustaining a maximum throughput of two instructions per cycle.[8][5][13] The execution units consist of two integer arithmetic logic units (ALUs) for basic operations, one complex integer unit dedicated to multiply and divide operations, a dedicated branch unit, and shared pipelines for floating-point and NEON SIMD processing, with the latter featuring dual pipes for improved vector throughput.[13] The branch unit incorporates an indirect branch predictor that tracks up to 256 targets overall, supporting up to 16 possible targets per indirect branch to enhance control flow accuracy in speculative execution.[13] Reordering is managed through a slot-based execution model with theoretically unlimited capacity, eschewing a traditional fixed-size reorder buffer to facilitate deep speculation without hard limits on instruction window size.[13] In practice, this enables extensive out-of-order execution, though constrained by downstream resources such as scheduler queues. The pipeline supports resource limits including 11 in-flight stores after an unresolved branch—a reduction from the prior Cortex-A72's 15—and up to 4 outstanding L1 instruction cache misses.[10]Memory Hierarchy
The ARM Cortex-A73 implements a hierarchical memory system consisting of private L1 caches per core and a shared L2 cache within the processor cluster, optimized for low-latency access in power-constrained environments. This design prioritizes hit rates and bandwidth for typical mobile workloads while maintaining compatibility with the ARMv8-A architecture's memory model. The caches use 64-byte line sizes throughout, enabling efficient burst transfers from lower levels. The Level 1 (L1) instruction cache is fixed at 64 KiB and organized as 4-way set-associative with Virtually Indexed Physically Tagged (VIPT) indexing. It incorporates parity bits for single-error detection, allowing the system to invalidate corrupted lines and refetch from lower levels without halting execution. The L1 data cache is configurable to either 32 KiB (8-way set-associative) or 64 KiB (16-way set-associative), also VIPT, and operates as write-back to minimize bus traffic. It supports non-temporal stores through a dedicated store buffer that bypasses the cache for full-line writes not present in L1, directing them straight to the L2 cache to avoid pollution in streaming scenarios.[11][14] The Level 2 (L2) cache is unified, serving both instruction and data requests, and is configurable from 256 KiB to 8 MiB per cluster in powers-of-two increments. It employs 16-way set-associativity and maintains inclusivity with respect to the L1 caches, ensuring that all L1 content is also present in L2 for simplified coherency management across cores. Optional Error Correction Code (ECC) protection is available for both tags and data arrays. The Cortex-A73 does not feature an on-core L3 cache; higher-level caching is handled by external system caches in the SoC, such as those integrated in multi-cluster configurations.[15][16] Memory management is facilitated by an integrated Memory Management Unit (MMU) compliant with the ARMv8 architecture, supporting hierarchical page tables with a base granule size of 4 KB. It includes Large Physical Address Extension (LPAE) for up to 40-bit physical addressing, enabling efficient virtual-to-physical translation in systems with large memory footprints. The L1 data cache delivers up to 32 bytes per cycle in load bandwidth, complemented by a hardware prefetcher that identifies and prefetches sequential access streams—up to eight concurrent streams—to reduce latency for linear data patterns common in multimedia and graphics workloads.[17][14]Performance and Efficiency
Integer and Floating-Point Performance
The ARM Cortex-A73 features a superscalar out-of-order pipeline capable of sustaining approximately 2.0 instructions per cycle (IPC) for integer operations, with potential uplifts to 2.5 IPC in optimized workloads. This represents a 30% performance improvement over the Cortex-A72 in integer-intensive tasks akin to SPECint benchmarks, driven by enhancements in branch prediction and execution resource allocation.[7][8] Floating-point performance is comparatively lower, achieving 1.5-2.0 IPC due to narrower pipelines in the floating-point unit (FPU), which prioritize efficiency for mobile multimedia processing over raw throughput. The core's dual-pipe FPU supports fused multiply-add operations with a latency of 7 cycles, balancing latency-sensitive tasks in graphics and signal processing. Integer throughput reaches up to 2 operations per cycle for adds and multiplies across two ALU ports, while divides incur approximately 12 cycles of latency, reflecting a design trade-off for power-sensitive environments.[13] The NEON SIMD extension delivers 4 single-precision (32-bit) floating-point operations per cycle via its 128-bit vector pathways, enabling effective acceleration for graphics and video workloads but limiting scalability for high-performance computing applications. Under thermal constraints, the Cortex-A73 sustains over 90% of peak performance, minimizing frequency throttling observed in prior cores through optimized power delivery and microarchitectural efficiencies. Its reordering capacity further enables high IPC by tolerating dependencies in integer streams.[18]Power Consumption and Efficiency
The ARM Cortex-A73 core is engineered for high efficiency within the constrained mobile power envelope, delivering the highest performance while maintaining low energy usage suitable for battery-powered devices. Compared to its predecessor, the Cortex-A72, it achieves up to 30% better power efficiency, enabling either 30% higher performance at the same power level or 30% reduced power consumption at equivalent performance levels. This efficiency stems from architectural optimizations such as aggressive clock gating and power-optimized RAM designs, which minimize dynamic power dissipation during operation.[1][7] In terms of power envelope, the Cortex-A73 operates effectively at around 0.5-1.0 W per core when clocked at 2.5 GHz on a 10 nm process, representing over 20% lower power draw than the A72 for integer workloads and even greater savings for floating-point and memory-intensive tasks at iso-frequency. Its thermal design supports sustained high-performance operation without frequent throttling, facilitated by dynamic voltage and frequency scaling (DVFS) that adjusts supply voltage and clock speed in real-time to balance performance and heat generation. Leakage power is controlled through advanced power gating techniques, allowing inactive core sections to enter low-power retention states, which further enhances efficiency during idle or lightly loaded scenarios.[7][19] The core's area efficiency contributes significantly to overall SoC power optimization, occupying up to 46% less die area than the A72 when implemented on the same process node, with a footprint of about 0.65 mm² on 10 nm technology—making it the smallest premium Armv8-A core at the time. This compact design enables denser integration of multiple cores in big.LITTLE configurations, promoting better power balancing across performance and efficiency clusters. Process scaling is optimized for advanced nodes like 7-10 nm, where it achieves peak efficiency through reduced leakage and improved transistor density, though it scales reliably to 16 nm and even 28 nm for cost-sensitive applications without substantial efficiency loss.[7][5]Comparisons with Related Cores
The ARM Cortex-A73 provides approximately 30% higher sustained performance than its predecessor, the Cortex-A72, primarily through improvements in integer instruction throughput while maintaining similar floating-point capabilities.[7] This uplift stems from enhanced branch prediction and reordering mechanisms that allow better handling of sustained workloads, though the A72 may achieve a slightly higher peak IPC in short bursts due to its design focus on bursty performance.[13] In real-world benchmarks, devices with the A73, such as those using the Qualcomm Snapdragon 835, demonstrate 10-20% gains over A72-based systems in web loading and multi-threaded tasks, reflecting the A73's emphasis on thermal stability over raw peak speed.[20] Compared to its successor, the Cortex-A75, the A73 delivers 20-25% lower overall performance at equivalent frequencies and power envelopes, as the A75 introduces a wider 3-wide out-of-order execution pipeline for better parallelism.[21] The A75 achieves this with roughly the same energy efficiency, offering up to 25% higher SPECint 2006 scores at 1W per core and 30% at 2W, making it more suitable for demanding mobile applications.[21] However, the A73's narrower 2-wide design and large reordering capacity provide advantages in power-constrained scenarios where the A75's added complexity can lead to higher leakage.[22] In the context of 2025 contemporaries like the Cortex-A78, the A73 lags significantly, scoring around 415 in Geekbench 5 single-core tests compared to the A78's 934, underscoring its legacy status in modern high-performance computing.[23][24] This gap highlights generational advances in the A78, including improved vector processing and larger caches, which double the effective throughput in integer-heavy workloads.[24] For multi-core scaling, a 4-core A73 cluster at 1.844 GHz achieves a PassMark CPU Mark of about 1,368, positioning it as adequate for mid-range devices from 2017-2020 but insufficient for current demands.[25] This score reflects efficient scaling within big.LITTLE configurations, where the A73 pairs with efficiency cores to balance loads without excessive thermal throttling. Recent 2024-2025 microbenchmark analyses reveal that the A73's reordering limits, despite being theoretically large, cap its IPC in complex workloads due to small ALU schedulers (6 entries) and narrow fetch bandwidth, often resulting in sustained IPC below 2.0 in SPECint-like integer tasks.[13] These constraints, analyzed in implementations like the Amlogic S922X, emphasize the core's efficiency focus over peak throughput, limiting its relevance in today's wider architectures.[13]Licensing and Implementations
Licensing Model
The ARM Cortex-A73 has been available as a synthesizable intellectual property (SIP) core since its announcement in May 2016, licensed on a royalty-based model from Arm Holdings.[7] This traditional licensing approach involves upfront fees for access to the IP, followed by royalties calculated on the number of chips shipped by the licensee.[26] Exact pricing details are protected under non-disclosure agreements, but estimates for initial mobile licensee fees range from $1 million to $2 million, with royalties typically at 1-2% of the chip's selling price.[27] Arm provides multiple customization levels for the Cortex-A73: a standard core license for direct implementation of the reference design, semi-custom options through the "Built on Cortex" program that allow limited modifications such as pipeline tweaks while maintaining Arm architectural compatibility, and full custom designs via architectural licenses for extensive alterations. The core integrates seamlessly with Arm's CoreLink interconnects, such as the CCI-550, to enable cache coherency in multi-cluster system-on-chip (SoC) configurations.[28] The Cortex-A73 is backward-compatible with the broader Armv8 ecosystem, implementing the Armv8-A architecture and supporting TrustZone for secure execution environments.[1]Custom and Standard Implementations
The ARM Cortex-A73 core was employed in standard configurations by several licensees, enabling direct integration without significant architectural alterations. HiSilicon's Kirin 960, released in 2016, featured four Cortex-A73 performance cores clocked at 2.4 GHz alongside four Cortex-A53 efficiency cores in a big.LITTLE arrangement, fabricated on TSMC's 16 nm process.[29][30] Similarly, MediaTek's Helio X30, launched in early 2017, incorporated two Cortex-A73 cores at up to 2.6 GHz, paired with four Cortex-A53 cores at 2.2 GHz and four Cortex-A35 cores at 1.8 GHz, all on a TSMC 10 nm process to enhance power efficiency.[31][32] Licensees also pursued semi-custom implementations under ARM's "Built on ARM Cortex Technology" model, which permits targeted modifications such as adjustments to dispatch widths, branch predictors, or cache configurations while retaining the core microarchitecture. A prominent example is Qualcomm's Kryo 280 in the Snapdragon 835 SoC, released in 2017, which utilized eight customized Cortex-A73 cores—all configured as performance cores without smaller variants—optimized for Samsung's 10 nm FinFET process to achieve higher sustained performance through tweaks like expanded execution resources.[33][34][35] This approach leveraged the Cortex-A73's baseline design but allowed process-specific tuning, such as improved clock gating and resource allocation, to balance efficiency and throughput on advanced nodes.[33] These implementations commonly integrated the Cortex-A73 in heterogeneous big.LITTLE clusters with efficiency cores like the Cortex-A53 or A35, often paired with ARM's Mali GPUs for graphics processing; for instance, the Kirin 960 used a Mali-G71 MP8, while the Helio X30 opted for an Imagination PowerVR 7XT.[30][31] Post-2017, evolutions included minor silicon optimizations for finer process nodes, as seen in HiSilicon's Kirin 970 of 2017, which retained four Cortex-A73 cores at 2.4 GHz with four Cortex-A53 cores at 1.8 GHz on TSMC's 10 nm node, incorporating refinements like enhanced power management for better thermal stability.[36][37][38] Such adaptations extended the core's viability in premium mobile SoCs through the late 2010s, aligning with the licensing model's flexibility for incremental enhancements.[1]Applications and Legacy
Usage in Mobile SoCs
The ARM Cortex-A73 core found widespread adoption in mobile system-on-chips (SoCs) from major vendors during the late 2010s, particularly in configurations pairing 2 to 4 high-performance A73 cores with efficiency-oriented ARM Cortex-A53 cores to balance power and performance in smartphones. These setups typically operated the A73 cores at clock speeds between 2.0 and 2.5 GHz, enabling sustained operation in big.LITTLE architectures for demanding tasks like multitasking and gaming while conserving battery life.[1] HiSilicon integrated the Cortex-A73 into its flagship Kirin series, starting with the Kirin 960 in 2016, which featured four A73 cores at 2.36 GHz alongside four A53 cores at 1.84 GHz and powered devices such as the Huawei Mate 9. The follow-up Kirin 970, launched in 2017, retained a similar octa-core configuration with four A73 cores at 2.36 GHz and four A53 cores at 1.84 GHz, but added a dedicated neural processing unit (NPU) for AI acceleration, appearing in models like the Huawei Mate 10 series.[39][36][37] Qualcomm employed A73-based Kryo 280 cores in the Snapdragon 835 SoC of 2017, configuring four such cores at up to 2.45 GHz with four A53 cores at 1.9 GHz, which drove premium devices including the Samsung Galaxy S8. In the mid-range segment, the Snapdragon 660 (2017) used four A73 cores at 2.2 GHz paired with four A53 cores at 1.84 GHz, while the Snapdragon 636 (2018) featured four A73 cores at 1.8 GHz paired with four A53 cores at 1.6 GHz, appearing in various budget Android handsets.[40][41] MediaTek incorporated the Cortex-A73 into both premium and mid-range offerings, with the Helio X30 in 2018 adopting a unique deca-core design of two A73 cores at 2.56 GHz, four A53 cores at 2.2 GHz, and four ultra-efficient Cortex-A35 cores at 1.9 GHz, though it saw limited uptake in major flagships like select Meizu models. The Helio P series variants, such as the P60 (2018), shifted to four A73 cores at 2.0 GHz with four A53 cores at 2.0 GHz, targeting affordable devices with AI capabilities via an integrated processing unit.[42][32][43] Samsung utilized the Cortex-A73 in mid-range Exynos SoCs, notably the Exynos 7885 from 2017, which combined two A73 cores at 2.2 GHz with six A53 cores at 1.6 GHz and powered Galaxy A and J series devices like the Galaxy A8 (2018). Overall, the Cortex-A73 achieved peak integration in Android smartphones from 2017 to 2019, forming the performance backbone of numerous flagships and mid-tier models across these vendors.[44][45]Current Status and Legacy in 2025
By 2020, the Cortex-A73 had been phased out of flagship mobile SoCs in favor of newer architectures like the Cortex-A77 and custom designs, as manufacturers shifted toward higher-performance cores for premium devices.[13] As of 2025, it persists primarily in low-end Android Go devices and embedded systems, where its mature design supports basic tasks like web browsing and light multimedia without demanding advanced power budgets.[46] Ongoing adoption in 2025 centers on budget IoT applications, such as smart appliances and security gateways via processors like the Synaptics SL1680, which integrates quad-core Cortex-A73 at 2.1 GHz for efficient edge computing.[47] In automotive contexts, it serves as a foundational element for in-vehicle infotainment (IVI) and digital cockpit systems, enabling reliable performance in cost-sensitive setups like the Rockchip RK3572 for single-board computers.[1] Legacy maintenance continues for older handsets, with re-spins on 28 nm processes sustaining availability in entry-level markets.[48] The Cortex-A73's impact lies in enabling efficient mobile computing throughout the 2010s by prioritizing sustained performance under thermal constraints, which influenced ARM's transition to the DynamIQ big.LITTLE framework starting with the Cortex-A75 in 2017.[1] Its efficiency techniques, including out-of-order retirement and compact resource structures, were inherited by successors like the A75 and A76, which built on its two-wide decode pipeline to achieve 20-30% performance gains at similar power levels.[10] In 2024 microarchitecture studies, the core's design—featuring a verification queue limited to 11 stores after branches—provided historical insights into trade-offs between reordering capacity and power efficiency in ARM's evolution.[10] Implementations remain vulnerable to certain security issues, such as CVE-2024-10929, requiring updates to Trusted Firmware-A and Linux for protection.[49] With limited representation in new ARM-based chips shipped in 2025, the Cortex-A73's market share reflects its niche in cost-optimized, low-volume segments rather than broad innovation.[48]References
- https://en.wikichip.org/wiki/mediatek/helio/mt6799
- https://en.wikichip.org/wiki/hisilicon/kirin/970
- https://en.wikichip.org/wiki/qualcomm/snapdragon_6
- https://en.wikichip.org/wiki/samsung/exynos/7885