ASM International N.V. (with ASM standing for Advanced Semiconductor Materials) is a Dutch-headquartered multinational corporation that designs, manufactures, sells, and services equipment used in the fabrication of semiconductor devices. Its products are utilized by semiconductor manufacturers in fabrication plants for processes such as atomic layer deposition, epitaxy, chemical vapor deposition, and diffusion.

The company was founded by Arthur del Prado (1931-2016) in 1964. From 2008 until 2020, son of Arthur del Prado, Chuck del Prado was CEO. ASM pioneered important aspects of many established wafer-processing technologies used in industry, including lithography, deposition, ion implantation, single-wafer epitaxy, and in recent years atomic layer deposition. Semiconductor equipment companies ASML, ASM Pacific Technology (ASMPT) and Besi are former divisions of ASM.

ASM headquarters is located in Almere, the Netherlands. The company has R&D sites in Almere (the Netherlands), Helsinki (Finland), Leuven (Belgium, near IMEC), Phoenix (Arizona), Tama (Japan), and Dongtan (South Korea). Manufacturing primarily occurs in Singapore and Dongtan (South-Korea). ASM also has sales & service offices across the globe, including United States, South Korea, China, Taiwan, Japan, Singapore and Israel. As of 2021, it has 3,312 staff, located in 14 countries.

The shares of the company are listed on the Euronext Amsterdam. In March 2020, ASM was promoted to the AEX index. ASM has a minority stake in ASM Pacific Technology, a Hong Kong–based company active in semiconductor assembly, packaging and surface-mount technology.

To create a semiconductor chip, many individual steps are performed using various types of wafer processing equipment, including photolithographic patterning, depositing thin layers, etching to remove material, thermal treatments, and other steps. ASM's systems are designed for deposition processes, when thin films, or layers, of various materials are grown or deposited onto the wafer. Many different thin-film layers are deposited to complete the full sequence of process steps necessary to manufacture a chip.

ASM's technology development is driven by its customers' goal to build faster, cheaper, and more powerful semiconductor chips with reduced energy consumption. This goal drives the need to shrink the dimensions of components on the chip, targeting to double the number of components per unit area on a chip every two years (Moore's law). As part of this scaling of dimensions, ASM supplies its customers – chip manufacturers – with machines that deposit ever thinner films of semiconductor materials. ASM also develops deposition processes for new materials to be used in semiconductor fabrication.

During the past 15 years, an increasing array of new materials has been introduced in the fabrication of chips. These new materials were required to achieve the necessary performance improvements of chips, as outlined by Moore's Law. For instance, in 2007 in a MOSFET transistor, the silicon oxidegate dielectric was replaced with a high-κ, a material that has a higher electrical resistance than silicon oxide. In this particular case, ASM pioneered the chemical process and the new deposition method called atomic layer deposition during nearly a decade of R&D. In addition, increasingly precise deposition methods are required as components on a chip such as transistors moved from planar to 3D structures, like FinFETs in the past decade. ASM has a leading position in single wafer atomic layer deposition (ALD).

ASM offers a number of methods and accompanying machines to deposit these thin films of materials. The company tries to expand the applicability of its deposition technologies and machines as much as possible. R&D is critical in that effort. In 2021, the company spent 151 million euro on R&D (or 9% of its annual revenues). R&D activities stretch from basic research of new materials to the application of new materials in chip manufacturing.