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Intel Socket G3
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| Type | rPGA |
|---|---|
| Chip form factors | Flip-chip pin grid array |
| Contacts | 946 |
| FSB protocol | DMI |
| Processor dimensions | 37.5 mm × 37.5 mm[1] |
| Processors |
|
| Predecessor | rPGA 988B |
| Successor | none |
This article is part of the CPU socket series | |
Socket G3, also known as rPGA 946B/947[1] or FCPGA 946,[2] is a socket for Intel microprocessors that supports Haswell-based mobile CPUs. Compatible SKUs have an 'M' suffix in the model number.[2]
Socket G3 is designed as a replacement for the Socket G2, which is also known as rPGA 988B. Socket G3 has holes to make contact with 946 or 947 pins of the processor's pin grid array (PGA).[1][3]
Lynx Point is the Platform Controller Hub (PCH) associated with Socket G3.[4]
Socket rPGA 947 has one extra pin hole, other than that it is identical to socket G3. It is the last pin grid array socket for Intel's mobile processors - all mobile processors in microarchitectures succeeding Haswell are exclusively available in BGA packaging. AMD also adopted the same practice, starting with their Steamroller microarchitecture.
See also
[edit]References
[edit]- ^ a b c Datasheet for Haswell M CPUs, see section 8.1, "Package Mechanical Specifications"
- ^ a b Intel ARK list of CPUs with socket FCPGA946
- ^ Test of PGA946 CPUs Intel Core i7-4700MQ
- ^ Knight, Shawn. "Leaked Intel slides detail Haswell's Lynx Point chipset". TechSpot. Retrieved 2014-01-19.
External links
[edit]Intel Socket G3
View on Grokipediafrom Grokipedia
Overview
Definition and purpose
Intel Socket G3 is a removable Pin Grid Array (rPGA) socket, also known as rPGA946B or FCPGA946, designed exclusively for mainstream mobile Intel processors.[6] Introduced in 2013 as part of Intel's 4th-generation Core processor launch, it serves as the interface between the processor and the motherboard in mobile platforms.[2] The primary purpose of Socket G3 is to provide a socketed interface that enables easy upgradeability of processors in laptops, distinguishing it from soldered alternatives.[6] It supports Haswell microarchitecture-based CPUs featuring 'M' or 'MQ' suffixes, which denote dual- and quad-core configurations optimized for mobile use.[6] Targeted at mainstream mobile computing, Socket G3 facilitates integration in ultrabooks and performance laptops, emphasizing balanced power efficiency and performance for everyday and demanding tasks.[6]Key features
Socket G3, also known as rPGA946B or FCPGA946, features a removable pin grid array (PGA) design that enables CPU upgrades and replacements without soldering, providing greater flexibility for original equipment manufacturers (OEMs) compared to the ball grid array (BGA) packages used in subsequent Intel mobile platforms.[6] This socket accommodates pins on the processor package via corresponding holes in a 37.5 mm x 37.5 mm land grid, with a 1.0 mm pitch, which simplifies assembly and maintenance processes for mobile device production.[6] The socket supports the Direct Media Interface (DMI) 2.0 protocol as the primary interconnect to the Platform Controller Hub (PCH), such as Lynx Point, operating at 5 GT/s across four lanes to deliver up to 2 GB/s bandwidth per direction.[6] It is optimized for Intel's 22 nm Haswell microarchitecture, incorporating power-efficient features like Enhanced Intel SpeedStep Technology for dynamic voltage and frequency scaling, alongside integrated graphics capabilities. Higher-end configurations feature Intel HD Graphics 4600 (GT2) based on the Generation 7.5 architecture with 20 execution units, supporting DirectX 11.1 and efficient media processing for battery-constrained mobile environments.[6][2] Power delivery aligns with mobile requirements, supporting a standard voltage range of 1.5–1.86 V and thermal design power (TDP) ratings of 37 W for dual-core variants and 47–57 W for quad-core variants, ensuring balanced performance and thermal management in laptops and ultrabooks.[6][7]History
Development background
Socket G3 was developed as a direct evolution from Socket G2 to accommodate the pin requirements of the Haswell microarchitecture's enhanced input/output capabilities and power delivery systems.[8] This revision involved a reconfigured pin grid array, reducing the overall count to 946 pins from G2's 988 while supporting Haswell's integrated features like improved graphics and memory interfaces.[1] The strategic goal behind Socket G3 was to preserve socketed designs for mobile central processing units, enabling upgradeability in laptops amid rising demands for slimmer form factors, even as Intel began transitioning select mobile variants to soldered ball grid array packaging with Haswell.[9] This approach balanced flexibility for OEMs with preparations for the industry's shift toward permanent CPU integration to reduce thickness and costs.[10] Intel's internal timeline positioned the socket's development alongside the Haswell rollout, with announcements tied to early 2013 roadmaps.[11] Haswell's advancements, such as refined power gating and voltage regulation, necessitated these socket adjustments to align with the microarchitecture's efficiency gains.[12] Socket G3 supports quad-core mobile processors with thermal design power ratings up to 47 W standard and 57 W for extreme editions, surpassing many Ivy Bridge counterparts.[13][6] These improvements ensured reliable operation under higher workloads without compromising laptop portability.Release and adoption
Intel Socket G3 was officially released in June 2013, aligning with the launch of Intel's Haswell mobile processors at Computex Taipei.[14] This timing marked the socket's introduction as the standard for mainstream mobile platforms, enabling upgradable CPU designs in laptops during the Haswell era.[1] Initial adoption occurred rapidly among major original equipment manufacturers (OEMs), with integration into business-oriented laptops beginning in mid-2013. Dell incorporated Socket G3 into its Latitude 7000 and 5000 series starting in August 2013, HP featured it in the ProBook 400 G1 lineup from October 2013, and Lenovo deployed it across ThinkPad models like the T440 and L440 by September 2013.[15][16][17] These systems targeted enterprise and professional users, leveraging the socket's compatibility with Haswell's performance and efficiency gains. The socket's market lifespan peaked during 2013-2014 alongside the Haswell refresh cycle, supporting millions of mainstream laptop units globally. Shipments reached a high in Q3 2013, when worldwide PC volumes hit 80.3 million units amid the Haswell rollout, according to market analysis.[18] Adoption declined by 2015 as Intel transitioned Broadwell mobile processors to soldered BGA packaging, eliminating socketed designs; the last major implementations appeared in late-2014 laptop models.[9] A key driver of Socket G3's uptake was Intel's "ultrabook refresh" initiative, which highlighted Haswell's battery life improvements—up to 9 hours of continuous use and 13 days in connected standby—over prior generations, positioning it as a cornerstone for thin-and-light mobile computing.[14] This emphasis helped accelerate its integration into refresh platforms paired with chipsets like Lynx Point.[19]Technical specifications
Physical characteristics
The Intel Socket G3, also designated as rPGA946B, is a reduced pin grid array (rPGA) socket featuring 946 contacts, where the socket contains holes and the processor package provides the corresponding pins for connection.[6] A minor variant, rPGA947, includes one additional pin hole for keying purposes but is otherwise mechanically identical to the rPGA946B configuration.[6] The processor package measures 37.5 mm × 37.5 mm, with a pin pitch of 1.0 mm, enabling compatibility with standard mobile motherboard layouts while maintaining a compact footprint for laptop designs.[6] It employs a flip-chip pin grid array (FCPGA) form factor, incorporating an actuator-based locking mechanism that secures the processor without requiring direct pressure during seating, thereby reducing the risk of pin damage during installation.[1] The processor package's mass is approximately 6.4 g, and it supports a maximum static normal load limit of 111 N (25 lbf) to ensure structural integrity under thermal expansion or mechanical stress.[6] The pins are arranged in a square grid pattern, optimized to align with the processor's pin grid array, distributing power, ground, and signal connections evenly across the interface without land-side capacitors for a streamlined profile.[6] This design is lead-free and halogenated flame retardant-free, adhering to environmental standards for modern electronics.[6] For thermal management, the socket is engineered for direct contact with the processor's integrated heat spreader (IHS), facilitating efficient heat transfer and supporting thermal dissipation up to 57 W TDP through thermal monitoring mechanisms.[6] The monolithic die configuration further aids in uniform thermal distribution across the package.[6]Electrical and interface details
The Intel Socket G3, also known as rPGA 946B or FCPGA 946, employs the Direct Media Interface (DMI) 2.0 protocol for high-speed communication between the processor and the Platform Controller Hub (PCH), utilizing four lanes to achieve a bandwidth of up to 5 GT/s per lane, equivalent to 2 GB/s in each direction.[1][6] Voltage specifications for the socket include a core voltage (VCC) range of 0.75 V to 1.52 V during active and idle modes, with dynamic adjustment via the Serial Voltage Identification (SVID) protocol, while the I/O voltage (VDDQ) is set at 1.35 V ±5% for DDR3L memory support; these are supplied through integrated voltage regulator modules (VRMs) on the motherboard to ensure stable power delivery.[6] Power distribution relies on dedicated VCC pins for the processor core and VSS pins for ground, facilitating efficient power management features such as dynamic frequency scaling via Intel Turbo Boost Technology in compatible processors.[6] For signal integrity, the 946-pin configuration allocates resources including up to 16 PCIe lanes supporting generations 1 through 3 (2.5 to 8 GT/s), USB 3.0 connectivity routed through the PCH, and an integrated dual-channel DDR3L memory controller operating at up to 1600 MT/s; half-swing low-power modes are implemented for DMI and PCIe to minimize electromagnetic interference and power consumption.[6][1] Electrical compatibility is limited to Haswell architecture processors, with no support for prior generations due to changes in signaling and power requirements, though the socket maintains compatibility within Haswell SKUs via the rPGA 946B/947 package.[6]Compatible hardware
Supported processors
Intel Socket G3 exclusively supports mobile processors from Intel's 4th generation Core family based on the Haswell microarchitecture, fabricated on a 22 nm process and packaged in the rPGA946B form factor.[6] These processors are designed for mainstream laptop platforms, featuring dual-core and quad-core configurations with hyper-threading on higher-end models, and TDP values ranging from 37 W to 57 W.[6] All models integrate Intel HD Graphics, with Core i7 and i5 variants equipped with HD 4600 (20 execution units) and lower tiers using HD 4400 (20 execution units) or HD Graphics (10 execution units).[6] The Core i7 series includes high-performance dual-core and quad-core options, such as the dual-core i7-4600M (2 cores/4 threads, 2.9 GHz base/3.6 GHz turbo, 4 MB cache, 37 W TDP) and i7-4610M (2/4, 3.0/3.7 GHz, 4 MB, 37 W), as well as quad-core models like the i7-4700MQ (4/8, 2.4/3.4 GHz, 6 MB cache, 37 W TDP), i7-4710MQ (4/8, 2.5/3.5 GHz, 6 MB, 37 W), i7-4900MQ (4/8, 2.8/3.8 GHz, 8 MB, 47 W), i7-4910MQ (4/8, 2.9/3.9 GHz, 8 MB, 47 W), and Extreme Edition i7-4940MX (4/8, 3.1/4.0 GHz, 8 MB, 57 W unlocked to 67 W).[6][1] Additional quad-core i7 variants in the HQ and H suffixes, such as i7-4770HQ (4/8, 2.2/3.4 GHz, 8 MB, 47 W) and i7-4710HQ (4/8, 2.5/3.5 GHz, 6 MB, 47 W), target performance-oriented mobile systems.[6] The Core i5 series consists of dual-core processors, exemplified by the i5-4200M (2/4, 2.5/3.1 GHz, 3 MB cache, 37 W), i5-4300M (2/4, 2.6/3.3 GHz, 3 MB, 37 W), i5-4330M (2/4, 2.8/3.5 GHz, 3 MB, 37 W), i5-4340M (2/4, 2.9/3.6 GHz, 3 MB, 37 W), and i5-4570M (2/4, 3.2/3.6 GHz, 4 MB, 37 W, vPro-enabled); higher-power H variants like i5-4200H (2/4, 2.8/3.5 GHz, 3 MB, 47 W) and i5-4210H (2/4, 2.9/3.5 GHz, 3 MB, 47 W) are also supported.[6][1] Lower-end offerings in the Core i3, Pentium, and Celeron lines are limited to dual-core designs without turbo boost on most models, including the i3-4000M (2/4, 2.4 GHz, 3 MB cache, 37 W), i3-4100M (2/4, 2.5 GHz, 3 MB, 37 W), Pentium 3550M (2/2, 2.3 GHz, 2 MB, 37 W), Celeron 2950M (2/2, 2.0 GHz, 2 MB, 37 W), and Celeron 2970M (2/2, 2.2 GHz, 2 MB, 37 W).[6][1] Most processors launched in Q2 or Q3 2013, with refresh models in Q1 or Q2 2014.[6] The table below provides a comprehensive overview of all supported models:| Model | Cores/Threads | Base/Turbo Clock (GHz) | Cache (MB) | TDP (W) | Release Quarter |
|---|---|---|---|---|---|
| i7-4600M | 2/4 | 2.9/3.6 | 4 | 37 | Q3 2013 |
| i7-4610M | 2/4 | 3.0/3.7 | 4 | 37 | Q3 2013 |
| i7-4700HQ | 4/8 | 2.4/3.4 | 6 | 47 | Q2 2013 |
| i7-4700MQ | 4/8 | 2.4/3.4 | 6 | 37 | Q2 2013 |
| i7-4702HQ | 4/8 | 2.2/3.2 | 6 | 47 | Q2 2013 |
| i7-4702MQ | 4/8 | 2.2/3.2 | 6 | 37 | Q2 2013 |
| i7-4710HQ | 4/8 | 2.5/3.5 | 6 | 47 | Q1 2014 |
| i7-4710MQ | 4/8 | 2.5/3.5 | 6 | 37 | Q1 2014 |
| i7-4712HQ | 4/8 | 2.3/3.3 | 6 | 47 | Q1 2014 |
| i7-4712MQ | 4/8 | 2.3/3.3 | 6 | 37 | Q1 2014 |
| i7-4760HQ | 4/8 | 2.1/3.3 | 6 | 47 | Q1 2014 |
| i7-4770HQ | 4/8 | 2.2/3.4 | 8 | 47 | Q2 2014 |
| i7-4800MQ | 4/8 | 2.7/3.7 | 6 | 47 | Q2 2013 |
| i7-4810MQ | 4/8 | 2.8/3.8 | 6 | 47 | Q1 2014 |
| i7-4870HQ | 4/8 | 2.5/3.7 | 8 | 47 | Q2 2014 |
| i7-4900MQ | 4/8 | 2.8/3.8 | 8 | 47 | Q2 2013 |
| i7-4910MQ | 4/8 | 2.9/3.9 | 8 | 47 | Q1 2014 |
| i7-4930MX | 4/8 | 3.0/3.9 | 8 | 57 | Q2 2013 |
| i7-4940MX | 4/8 | 3.1/4.0 | 8 | 57 | Q1 2014 |
| i7-4960HQ | 4/8 | 2.6/3.8 | 8 | 47 | Q3 2013 |
| i7-4980HQ | 4/8 | 2.8/4.0 | 8 | 47 | Q2 2014 |
| i5-4200H | 2/4 | 2.8/3.5 | 3 | 47 | Q3 2013 |
| i5-4200M | 2/4 | 2.5/3.1 | 3 | 37 | Q3 2013 |
| i5-4210H | 2/4 | 2.9/3.5 | 3 | 47 | Q2 2014 |
| i5-4300M | 2/4 | 2.6/3.3 | 3 | 37 | Q3 2013 |
| i5-4330M | 2/4 | 2.8/3.5 | 3 | 37 | Q3 2013 |
| i5-4340M | 2/4 | 2.9/3.6 | 3 | 37 | Q1 2014 |
| i5-4570M | 2/4 | 3.2/3.6 | 4 | 37 | Q2 2014 |
| i3-4000M | 2/4 | 2.4 | 3 | 37 | Q3 2013 |
| i3-4100M | 2/4 | 2.5 | 3 | 37 | Q3 2013 |
| Pentium 3550M | 2/2 | 2.3 | 2 | 37 | Q3 2013 |
| Celeron 2950M | 2/2 | 2.0 | 2 | 37 | Q3 2013 |
| Celeron 2970M | 2/2 | 2.2 | 2 | 37 | Q1 2014 |
Associated chipsets and platforms
The Intel 8 Series chipsets, codenamed Lynx Point, serve as the primary Platform Controller Hubs (PCHs) for Socket G3 platforms, enabling integration with Haswell mobile processors in laptop systems.[20] These mobile-oriented chipsets include the HM86 for mainstream consumer applications, the QM87 for business and enterprise use with enhanced manageability features, and the QS87 for premium configurations offering advanced security and vPro support.[21] All variants connect to the CPU via a DMI 2.0 interface providing up to 20 Gb/s bidirectional bandwidth across four lanes.[21] Platform features emphasize balanced performance and power efficiency for mobile environments, supporting dual-channel DDR3L-1600 memory up to 32 GB total capacity using non-ECC SODIMM modules.[22] Storage connectivity includes SATA 6 Gb/s ports, with up to four such ports on the HM86 and six on the QM87 and QS87 variants, alongside RAID and AHCI modes via Intel Rapid Storage Technology.[21] Expansion capabilities incorporate PCIe 3.0 lanes from the CPU (up to 16) combined with up to eight PCIe 2.0 lanes from the PCH, configurable for peripherals like discrete GPUs or storage controllers.[21] Motherboard designs for Socket G3 typically adopt custom laptop form factors optimized for thin-and-light or performance-oriented chassis, positioning the socket adjacent to integrated or discrete cooling solutions to handle thermal design powers (TDPs) ranging from 37 W to 57 W. These layouts prioritize compact routing for power delivery and signal integrity, often incorporating soldered components to minimize size while supporting upgradeable CPU sockets in select high-end models.[21] OEM integrations were prevalent in 2013-2014 laptop platforms, such as Intel's Haswell Ultrabook reference designs from manufacturers like Dell and Lenovo, which leveraged these chipsets for features including optional Thunderbolt 2 connectivity via add-in controllers. Such systems emphasized hybrid graphics switching and extended battery life through technologies like Intel Rapid Start.[21] Input/output capabilities are routed primarily through the PCH-DMI link, providing up to four USB 3.0 ports (5 Gb/s) and ten USB 2.0 ports on the HM86, with the QM87 and QS87 supporting up to six USB 3.0 ports alongside eight USB 2.0 ports for a total of 14.[22] Display support includes HDMI 1.4a and DisplayPort 1.2 outputs, compatible with integrated Intel HD Graphics for multi-monitor setups up to 4096x2304 resolution.[21]Legacy
Differences from predecessor
The Intel Socket G3, also known as rPGA946B, represents a redesign from its predecessor, Socket G2 (rPGA988B), primarily through a reduction in pin count from 988 to 946 pins, allowing for optimized signal routing and reduced complexity in the package. This change accommodated the Haswell microarchitecture's fully integrated voltage regulator (FIVR), which consolidates power delivery to just two main rails (VCC and VDDQ) compared to the multiple rails (Vcc, VccIO, VDDQ, VccSA, and others) required by Ivy Bridge processors on Socket G2. The pin reallocation supported improved power efficiency by minimizing external voltage regulation needs, enabling dynamic scaling via the SVID interface with VID ranges of 0.5000V to 3.0400V for VCC.[6][23] In terms of interface support, Socket G3 maintained compatibility with PCIe 3.0 up to 16 lanes (configurable as 1x16, 2x8, or 1x8 + 2x4), matching Socket G2's capabilities, but with reallocated pins that enhanced signal integrity for higher I/O bandwidth demands in Haswell, including Direct Media Interface 2.0 at 5 GT/s. The design shift also addressed interference issues in the Ivy Bridge layout by streamlining power and ground pin distribution, contributing to Haswell's overall ~10-20% improvement in power efficiency for mobile applications. However, these optimizations came at the cost of backward compatibility, as the reduced pin count and altered pin positions— including Haswell-specific keying notches—prevent Socket G2 processors from physically fitting into G3 sockets, and vice versa, to avoid insertion errors and potential damage.[6][23][1] Socket G3 uses an actuator-based locking mechanism to secure the processor.[1]Transition to successors
Socket G3 marked the end of Intel's PGA-based mobile sockets, with support limited to Haswell processors launched in 2013 and discontinued in late 2014 through product change notifications for quad-core mobile SKUs. No subsequent generations, including Broadwell released in 2015, were compatible, as Intel shifted entirely to soldered BGA packaging to prioritize thinner device designs in the mobile segment. The transition to BGA addressed key limitations of PGA sockets in ultrathin laptops, where the absence of a socket reduced overall height by eliminating mechanical components, enabling slimmer profiles without compromising structural integrity.[24] BGA also enhanced reliability by minimizing connection points prone to failure from vibrations or thermal cycling in portable devices, while lowering manufacturing costs for OEMs through simplified assembly and fewer discrete parts.[25] These benefits aligned with Intel's focus on system-on-chip integration for efficiency in battery-powered systems. Direct successors adopted soldered BGA packaging for higher-performance mobile variants, such as BGA-1364 for Broadwell-H processors like the Core i7-5700HQ and BGA-1440 for Skylake-H equivalents, all soldered directly to the motherboard.[26][27] This change eliminated user-upgradeable CPU options in new platforms, locking consumers to the original processor; however, legacy Socket G3 systems retain aftermarket upgrade potential limited to Haswell-compatible parts.[28] By 2015, Intel's mobile roadmap emphasized BGA as the standard for premium laptops, reflecting broader industry adoption to support ultrabook and 2-in-1 form factors.[29]References
- https://en.wikichip.org/wiki/intel/cores/skylake_h