Hubbry Logo
Socket 370Socket 370Main
Open search
Socket 370
Community hub
Socket 370
logo
8 pages, 0 posts
0 subscribers
Be the first to start a discussion here.
Be the first to start a discussion here.
Socket 370
Socket 370
Socket 370
View on Wikipedia
from Wikipedia
Socket 370
Release date1998
Designed byIntel
TypePGA-ZIF
Chip form factorsPlastic pin grid array (PPGA) and Flip-chip pin grid array (FC-PGA and FC-PGA2)
Contacts370[1]
FSB protocolAGTL+, AGTL
FSB frequency66, 100 and 133 MT/s
Voltage range1.05–2.1 V
Processor dimensions1.95 × 1.95 inches[2] (49.53 mm × 49.53 mm)
ProcessorsIntel Celeron Mendocino (PPGA, 300–533 MHz, 2.0 V)

Intel Celeron Coppermine (FC-PGA, 533–1100 MHz, 1.5–1.75 V)
Intel Celeron Tualatin (FC-PGA2, 900–1400 MHz, 1.475–1.5 V)
Intel Pentium III Coppermine (FC-PGA, 500–1133 MHz, 1.6–1.75 V)
Intel Pentium III Tualatin (FC-PGA2, 1000–1400 MHz, 1.45–1.5 V)

VIA Cyrix III/C3 (500–1200 MHz, 1.35–2.0 V)
PredecessorSlot 1
SuccessorSocket 423
This article is part of the CPU socket series

Socket 370, also known as PGA370, is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins.

Socket 370 was replaced by Socket 423 in 2000.

Overview

[edit]
Underside of a Mendocino-core Socket 370 Celeron, 333 MHz

Socket 370 started out as a budget-oriented platform for 66 MHz FSB PPGA Mendocino Celeron CPUs in late 1998, as the move to on-die L2 cache eliminated the need for a PCB design as seen on Slot 1.

A VIA C3 1.2 GHz Nehemiah C5XL CPGA socket-370 microprocessor

Socket 370 then became Intel's main desktop socket from late 1999 to late 2000 for 100/133 MHz FSB FC-PGA Coppermine Pentium IIIs. In 2001, the FC-PGA2 Tualatin Pentium III processors brought changes to the infrastructure which required dedicated Tualatin-compatible motherboards; some manufacturers would indicate this with a blue (instead of white) socket. These late sockets were typically compatible with Coppermine processors, but not the older Mendocino Celerons. The VIA Cyrix III, later renamed the VIA C3, also used Socket 370.

Some motherboards that used Socket 370 support Intel processors in dual CPU configurations (e. g. ABIT BP6). Other motherboards allowed the use of a Socket 370 or a Slot 1 CPU, but not at the same time.

Socket 370 slotket adapter

Slotkets are available that allows Socket 370 CPUs to be used on Slot 1 based motherboards. These devices are equipped with their own voltage regulator modules, in order to supply the new CPU with a lower core voltage, which the motherboard would not otherwise allow.

Socket 370 Intel processors mechanical load limits

[edit]

The weight of a Socket 370 CPU cooler should not exceed 180 grams (6.3 ounces). Heavier coolers may result in damage to the die when the system is improperly handled.

Most Intel Socket 370 processors (Pentium III and Celeron) had mechanical maximum load limits which were designed not be exceeded during heat sink assembly, shipping conditions, or standard use. They came with a warning that load above those limits would crack the processor die and make it unusable. The limits are included in the table below.

Location Dynamic Static
Die Surface 890 N (200 lbf) 222 N (50 lbf)
Die Edge 667 N (100 lbf) 53 N (12 lbf)

Socket 370 Intel processors with integrated heat sink mechanical load limits

[edit]

All Intel Socket 370 processors with integrated heat sink (Pentium III and Celeron 1.13–1.4 GHz) had mechanical maximum load limits which were designed not be exceeded during heat sink assembly, shipping conditions, or standard use. They came with a warning that load above those limits would crack the processor die and make it unusable. The limits are included in the table below.

Location of integrated heat sink Dynamic Static
surface 890 N (200 lbf) 667 N (100 lbf)
edge 556 N (125 lbf) N/A
corner 334 N (75 lbf) N/A

See also

[edit]

References

[edit]
[edit]
Revisions and contributorsEdit on WikipediaRead on Wikipedia

Socket 370

View on Grokipedia
from Grokipedia
Socket 370, also known as PGA370, is a 370-pin (ZIF) developed by for connecting processors to motherboards using a (PGA) configuration. Introduced in 1998 as a cost-effective alternative to the interface, it initially supported plastic (PPGA) packaging for processors (Mendocino core) before expanding to flip-chip (FC-PGA) for Coppermine-core processors in 1999 and FC-PGA2 formats for Tualatin-core chips in 2001. The socket facilitated Intel's transition to more affordable desktop and entry-level systems during the late 1990s and early 2000s, serving as the primary interface for consumer and value-oriented computing until the advent of in 2001. It supports (FSB) speeds ranging from 66 MHz to 133 MHz, with core voltages ranging from 1.45 V to 2.0 V depending on the processor model, and a maximum of approximately 30 watts. Compatible processors include the Celeron (Mendocino, Coppermine, and Tualatin cores) and (Coppermine and Tualatin cores), with clock speeds from 300 MHz up to 1.4 GHz; third-party options like VIA Cyrix III and VIA C3 were also supported on compatible motherboards. Key features encompass the AGTL+ signaling protocol for efficient bus communication, integrated thermal monitoring via a on the processor, and compatibility with chipsets such as , 815, and VIA Apollo Pro series, enabling dual-processor configurations in some workstation setups. Despite its limitations—such as the absence of , multi-core support, or native —Socket 370 played a pivotal role in popularizing advanced features like (SSE) in mainstream PCs.

Introduction

Definition and Overview

Socket 370, also known as PGA370, is a 370-pin (PGA) CPU socket developed by for mounting desktop processors directly onto motherboards. It supports (PGA) package interfaces, including Flip-Chip PGA (FC-PGA) and Plastic PGA (PPGA), enabling electrical and mechanical connection through pins on the underside of the processor package. The primary purpose of Socket 370 was to provide a cost-efficient alternative to the cartridge-based design, particularly for budget and mainstream systems by eliminating the need for additional packaging components. This direct socket mounting simplified assembly and reduced manufacturing expenses while maintaining compatibility with Intel's processor architecture. At its core, Socket 370 operates using a (ZIF) lever mechanism, which allows processors to be installed and removed without applying force to the pins, minimizing damage risk. It primarily supports single-processor configurations, though some motherboards enabled dual-processor setups, with a staggered pin layout that ensures proper orientation and prevents incorrect insertion. The socket measures approximately 50 × 50 , accommodating the processor package dimensions of about 49.5 × 49.5 . It was introduced for processors such as the and families.

Historical Development

Socket 370 was introduced by in 1998 as a cost-effective replacement for the interface used in processors. The socket's development was driven by the need to lower manufacturing expenses for budget-oriented systems, transitioning from the more complex cartridge-based design to a simpler (PGA) package that reduced material costs and streamlined production. This shift aligned with the surging demand for affordable personal computers during the late 1990s , enabling broader for entry-level desktops. The first implementations of Socket 370 appeared in early 1999, coinciding with the adoption of Mendocino-core processors, which marked Intel's initial deployment of on-die L2 cache in a low-end offering. By late 1999, the socket expanded to support Coppermine processors operating at 100/133 MHz speeds, solidifying its role as Intel's primary desktop interface for mainstream systems. In 2001, revisions to Socket 370 accommodated the Tualatin-core variants of both and , extending compatibility through minor pinout adjustments without requiring entirely new sockets. Socket 370's lifecycle concluded around 2001-2002, as phased out production in favor of for the architecture, reflecting the end of the P6 . Emerging amid the PC industry's rapid growth in the late , the socket positioned competitively against AMD's platform, which debuted in 2000 and targeted similar mid-range segments with enhanced performance features.

Technical Specifications

Physical Characteristics

Socket 370 employs a 370-pin configuration arranged in a staggered grid layout, facilitating compatibility with (PGA) processor packages. This includes approximately 200 signal pins for data transfer and control functions, 74-75 pins for VCC core power, 74-77 pins for VSS ground, 15-20 pins for VTT termination voltage, and a small number of reserved or no-connect pins to accommodate future expansions or tolerances. To prevent incorrect installation, the socket incorporates alignment keys at positions A1 and AN1, which act as plugs that mate with corresponding notches on the processor package, ensuring proper orientation. The socket's construction utilizes a durable body to house the pin , with gold-plated contacts providing low-resistance electrical connectivity and resistance. A (ZIF) lever-operated clamp secures the processor without bending pins, allowing for repeated installations during assembly or upgrades. This design supports high reliability in desktop environments. Physically, the socket measures approximately 49.5 mm by 49.5 mm, matching the footprint of earlier sockets like while adding pins for advanced signaling. It integrates seamlessly into layouts via through-hole mounting, and is compatible with standard retention mechanisms, such as those used in Intel's boxed processor coolers, which employ mounting holes for and support. Early iterations of Socket 370 were optimized for plastic (PPGA) packages, as seen in initial processors, emphasizing cost-effective manufacturing. Subsequent revisions adapted to flip-chip (FC-PGA) packages, incorporating an integrated on the processor side to enhance thermal dissipation while maintaining the same socket interface. These evolutions ensured across processor generations without altering the core physical structure.

Electrical and Interface Details

Socket 370 provides electrical support for a range of core voltages (VCC) tailored to compatible processors, typically spanning 1.1 V to 1.7 V, with specific implementations varying by generation: early Mendocino-core s operate at up to 2.0 V, while Coppermine and Tualatin models use 1.20 V to 1.76 V as defined by the processor's VID pins. The socket also requires a termination voltage (VTT) of 1.25 V ±9% for AGTL signaling in Tualatin processors or 1.50 V ±9% for AGTL+ in earlier models, ensuring proper on the . This voltage flexibility allows the socket to accommodate 's evolving P6-based architectures without requiring hardware modifications to the interface. The bus architecture employs a 64-bit data path (D[63:0]#) synchronized to the Front Side Bus (FSB), which operates at official speeds of 66 MHz, 100 MHz, or 133 MHz, though many motherboards enable compatibility with 150 MHz via configurations. is maintained through parity checking mechanisms, including parity (AP[1:0]#) and data error-checking pins (DEP[7:0]#) that support error-correcting code (ECC) for reliable transfers. Signaling follows the AGTL+ (Advanced GTL+) standard for the majority of Socket 370 implementations, which uses open-drain drivers with external pull-up resistors to VTT, reducing power consumption and compared to earlier GTL protocols. Power delivery is optimized through a distributed array of pins—approximately 74-75 for VCC core and 74-77 for VSS ground, interspersed across the 370-pin grid—to minimize voltage droop and inductive noise during high-frequency operations. Maximum power dissipation reaches up to 37.5 W for high-end processors like the 1.13 GHz Pentium III, with dedicated low-pass filtering required for phase-locked loop (PLL) supplies to ensure stable clock generation. Interface protocols inherit P6 architecture features, including the Advanced Programmable Interrupt Controller (APIC) via signals like LINT[1:0], PICCLK, and PICD[1:0] for multi-processor interrupt handling. Thermal monitoring is facilitated by dedicated DI (THERMDN) and DTS (THERMDP) pins connected to an on-die thermal diode, enabling external sensors to measure junction temperature and trigger protective mechanisms like THERMTRIP#.

Processor Compatibility

Supported Processor Families

Socket 370 primarily supported Intel's entry-level Celeron processors and mainstream Pentium III processors, both derived from the P6 microarchitecture, providing binary compatibility with earlier Intel x86 processors such as the Pentium II. These families evolved through multiple cores, enhancing performance via on-die L2 cache integration and support for advanced instruction sets. The family, positioned as budget-oriented processors, began with the Mendocino core in 1998, featuring clock speeds from 300 MHz to 533 MHz, a 66 MHz (FSB), and 128 KB of on-die L2 cache at full core speed, marking a shift from off-die cache designs in prior models. Subsequent Coppermine-128 variants, introduced in 2000, utilized a 0.18-micron process and extended speeds up to 1.1 GHz, retaining the 128 KB L2 cache while supporting 66 MHz and 100 MHz FSB options for improved in compatible systems. The Tualatin-core processors, released in 2001 on a 0.13-micron process, offered clock speeds from 1.0 GHz to 1.4 GHz with 256 KB L2 cache and 100 MHz FSB support, providing further efficiency improvements for entry-level systems. The Pentium III family served as the high-performance counterpart, starting with the Coppermine core in 1999, which offered clock speeds from 500 MHz to 1.13 GHz, 256 KB of on-die L2 cache, and FSB support at 100 MHz or 133 MHz to enable higher data throughput. Later Tualatin-core models, released in 2001 and fabricated on a 0.13-micron process, pushed speeds up to 1.4 GHz with 512 KB L2 cache, maintaining 100 MHz and 133 MHz FSB compatibility while incorporating enhancements for better efficiency. All Socket 370 processors were based on the P6 microarchitecture, which emphasized dynamic execution with out-of-order processing and a superscalar design for improved instruction-level parallelism, ensuring seamless execution of legacy x86 software. Later iterations, particularly from the Coppermine core onward, integrated over 70 Streaming SIMD Extensions (SSE) instructions to accelerate vectorized floating-point and multimedia operations. The following table summarizes key compatibility details for clock speeds and FSB support across these families:
Processor FamilyCoreClock Speed RangeL2 CacheFSB Support
CeleronMendocino300–533 MHz128 KB66 MHz
CeleronCoppermine-128533 MHz–1.1 GHz128 KB66/100 MHz
CeleronTualatin1.0–1.4 GHz256 KB100 MHz
Pentium IIICoppermine500 MHz–1.13 GHz256 KB100/133 MHz
Pentium IIITualatin1.0–1.4 GHz512 KB100/133 MHz
These configurations allowed flexible system builds, with higher FSB variants requiring support for optimal performance.

Package Variants and Revisions

The Socket 370 platform initially supported the Plastic Pin Grid Array (PPGA) package, primarily for the Mendocino-core processors introduced in late 1998. This early variant featured a plastic lid without an integrated , relying on direct contact for thermal management, which limited its suitability for higher-performance applications. The PPGA design was optimized for cost-effective entry-level systems, accommodating clock speeds up to 533 MHz on a 66 MHz . With the launch of the Coppermine-core and processors in 1999, transitioned to the Flip-Chip (FC-PGA) package for Socket 370. This flip-chip configuration improved electrical performance and heat transfer by exposing the die directly to the socket interface, though it lacked an integrated in its initial form, necessitating updated retention clips on compatible motherboards for secure installation. The FC-PGA package supported higher frequencies up to 1.13 GHz and speeds of 100/133 MHz, enabling better overall system scalability. The Tualatin-core Pentium III processors, released in 2001 on a 0.13-micron process, introduced the FC-PGA2 package variant, which incorporated an integrated for enhanced thermal dissipation at elevated power levels. This revision required modifications to the (VRM), aligning with VRM 8.5 specifications to deliver core voltages of 1.45 V to 1.5 V, including support for 1.475 V operation. Many existing motherboards needed BIOS updates to tolerate these voltage levels and ensure stable operation with the updated signaling. Compatibility challenges arose across these variants, as early PPGA-compatible Socket 370 implementations (often denoted as revision 370M) could not directly support FC-PGA or FC-PGA2 processors without adapters, due to differences in pinout and mechanical retention. Similarly, Coppermine-era boards (revision 370C) typically required adapters or full upgrades for Tualatin FC-PGA2 CPUs, as the latter's AGTL+ signaling and VRM demands exceeded prior designs. Adapters like the PowerLeap series bridged these gaps but often demanded modifications for full functionality.

Mechanical and Thermal Considerations

Load Specifications for Standard Processors

The static load limits for standard processors without an (IHS), such as PPGA or FC-PGA packaged (Mendocino core), define maximum downward forces applied to the exposed die surface to prevent deformation or fracture. According to specifications, the static load is up to 222 N (50 lbf) on the die surface and 53 N (12 lbf) on the die edge. These limits ensure the die and package substrate remain intact under during assembly and handling. Dynamic load limits for these processors include up to 890 N (200 lbf) on the die surface and 445 N (100 lbf) on the die edge, accommodating operational and shipping conditions. Testing typically involves half-sine wave pulses for shock and profiles, though specific tolerances are not detailed in processor datasheets. Installation guidelines for Socket 370 motherboards recommend applying 0.6-0.8 Nm torque to retention brackets for even pressure distribution, as deviations can induce uneven stress leading to pin damage or socket wear. Proper torque application using calibrated tools is essential for secure seating without over-compression.

Load Specifications for Integrated Heat Sinks

The load specifications for integrated heat sinks in Socket 370 systems apply to processors with an Integrated Heat Spreader (IHS), such as FC-PGA2-packaged and (Coppermine and Tualatin cores). These ensure the integrity of the processor package, IHS, and PGA370 socket during installation, transport, and operation, with emphasis on uniform pressure distribution. Intel guidelines support heat sinks up to approximately 180 g when using appropriate retention mechanisms to avoid uneven loading. Static load limits for the IHS allow up to 445 N (100 lbf) applied uniformly to the IHS top surface, the maximum force without compromising the die or substrate. Transient maximum limits are 556 N (125 lbf) for IHS edges and 334 N (75 lbf) for corners to account for stress concentrations. Dynamic maximum load is 890 N (200 lbf) on the IHS surface. Attachment methods include clip-based retention systems using the socket's plastic tabs or screw-mounted designs for aftermarket coolers. Intel recommends maximum torque of 1.0 Nm for threaded fasteners to prevent socket warping and ensure compliance. Uniform pressure is critical to avoid exceeding local tolerances. Dynamic considerations for systems with attached heat sinks include vibration tolerance and shock resistance evaluated under industry standards, with heatsink clips designed to withstand 30-50 G shocks (11 ms duration). These ratings assume proper securing to minimize resonance.

Adoption and Legacy

Motherboard and System Integration

Socket 370 motherboards primarily utilized Intel's 440BX, 810, 815, and 820 chipsets for core functionality, providing robust support for the socket's front-side bus (FSB) speeds of 66 MHz, 100 MHz, and 133 MHz. The 440BX chipset, introduced in 1998, offered scalable performance for early Socket 370 implementations, enabling compatibility with Celeron and Pentium III processors through its AGPset architecture and emphasis on high-bandwidth memory access. Similarly, the 810 and 815 chipsets, released in 1999, integrated graphics and memory controllers tailored for budget-oriented Socket 370 systems, with the 815 supporting up to 512 MB of SDRAM across up to three DIMM slots while incorporating Dynamic Video Memory Technology (DVMT) for flexible graphics allocation. The 820 chipset extended this with Rambus DRAM support but maintained Socket 370 compatibility for Pentium III processors, focusing on enhanced I/O throughput. Third-party options, such as VIA's Apollo Pro 133A chipset from 1999, provided alternatives with broader memory capacity—up to 1.5 GB of PC133 SDRAM—and AGP 4x interface, appealing to enthusiasts seeking higher FSB stability without Intel's integrated graphics limitations. Typical Socket 370 motherboard layouts featured 2 to 4 slots for unbuffered SDRAM, accommodating configurations from 32 MB to 1.5 GB depending on the , with VIA-based boards often maximizing capacity for cost-effective upgrades. Expansion options included one AGP slot for graphics cards and 4 to 5 PCI slots for peripherals, alongside occasional ISA slots for legacy compatibility; budget models with 810 or 815 chipsets integrated 2D/3D graphics via an onboard supporting resolutions up to 1600x1200 at 85 Hz, along with audio for basic multimedia. These designs adhered to the form factor, ensuring straightforward integration into standard PC chassis with 20-pin power connectors. At the system level, Socket 370 found widespread adoption in value-oriented desktops from manufacturers like and between 1999 and 2002, powering entry-level business and home systems with modest power demands met by 250 W or higher power supplies providing at least 20 A on the +5 V rail. For instance, the 2100 series utilized the Intel 810E chipset in a Socket 370 configuration, supporting and processors alongside integrated graphics for everyday computing tasks. Compaq's Deskpro EN small form factor models, based on the Intel 815E, similarly integrated Socket 370 for compact office environments, emphasizing reliability over high-end performance. Upgrade paths for Socket 370 systems often involved flashing to enable support for later processors, such as transitioning from Mendocino Celerons to Coppermine IIIs, which required updates to handle reduced core voltages and extended FSB options. However, common issues arose from FSB mismatches, where processors rated at 133 MHz would underclock on 66/100 MHz boards without manual jumper adjustments, potentially leading to instability or failure to boot if the motherboard's voltage regulation did not align with the CPU's specifications. These upgrades extended the socket's viability in aging systems but were limited by chipset constraints on maximum RAM and bus speeds.

Transition and Obsolescence

Socket 370 began its phase-out in mid-2001 following the introduction of the processor in November 2000, which shifted 's focus toward newer architectures and interfaces. The socket's support lingered briefly with the release of Tualatin-core and processors, the last of which entered production in early 2002 at speeds up to 1.4 GHz. By April 2004, officially discontinued desktop processors, marking the end of any formal support for Socket 370 systems. The socket was succeeded primarily by , an mPGA design introduced in late 2001 for the and subsequent processors. This transition was driven by the need for a higher pin count—478 pins compared to Socket 370's 370—to accommodate increased power delivery, support for memory, and features like Technology introduced in models starting in 2002. enabled broader compatibility with evolving chipsets like the 845 series, which prioritized DDR over the used in some earlier platforms. In the broader market, Socket 370 faced declining relevance by 2000 as AMD's processors on (also known as Socket 462) began outperforming Intel's offerings in key benchmarks, capturing significant share in the performance segment. This competition, combined with Intel's pivot to the , accelerated the socket's obsolescence among mainstream consumers. Despite this, Socket 370's legacy endures through its role in enabling cost-effective -era systems that powered early 2000s for offices and homes. Today, it garners interest among retro enthusiasts for emulating historical software environments, though no official Intel support has existed since 2004.

References

  1. https://download.intel.com/design/PentiumIII/datashts/24526408.pdf
  2. https://www.cpu-world.com/Sockets/Socket_370_(PGA370).html
  3. https://www.cnet.com/tech/tech-industry/new-intel-design-to-cut-costs/
  4. https://www.theregister.com/1998/09/15/senior_intel_executive_confirms_370pin/
  5. https://www.vogonswiki.com/index.php/Socket_8_/_Slot_1_/_Socket_370_Motherboards
  6. https://www.computerhope.com/jargon/s/sock370.htm
  7. https://theretroweb.com/misc/documentation/24441002-65bd98a4cbe09754855163.pdf
  8. https://www.peconnectors.com/sockets-pga-cpu-and-memory/hws11638/
  9. https://datasheets.chipdb.org/Intel/x86/Celeron/29859604.pdf
  10. https://www.cpu-world.com/CPUs/Pentium-III/index.html
  11. https://www.cpu-world.com/CPUs/Celeron/TYPE-Celeron_(Mendocino).html
  12. https://www.cpu-world.com/CPUs/Celeron/TYPE-Celeron_(Coppermine).html
  13. https://www.cpu-world.com/CPUs/Celeron/TYPE-Celeron_(Tualatin).html
  14. https://www.cpu-world.com/CPUs/Pentium-III/TYPE-Pentium_III_(Tualatin).html
  15. https://www.kentie.net/article/deskproupgrade/
  16. https://ixbtlabs.com/articles/celeron1200mhz/index.html
  17. https://theretroweb.com/motherboard/manual/e-usl3n-63486ee689fc4017583997.pdf
  18. https://download.intel.com/design/intarch/applnots/27332504.pdf
  19. https://download.intel.com/design/intarch/applnots/27329605.pdf
  20. https://download.intel.com/design/chipsets/datashts/29835102.pdf
  21. https://www.tomshardware.com/picturestory/784-intel-chipset-history-2.html
  22. http://www.bitsavers.org/components/viaTechnologies/VT82C693A_Apollo_Pro133_199907.pdf
  23. https://dl.dell.com/manuals/all-products/esuprt_desktop/esuprt_dimension_desktops/dimension-2100_user%27s%2520guide_en-us.pdf
  24. https://theretroweb.com/motherboards/s/compaq-187500-001
  25. https://www.techpowerup.com/cpu-specs/pentium-iii-1400s.c1276
  26. https://www.os2museum.com/wp/the-tualatin-story/
  27. https://www.lenovo.com/us/en/glossary/socket-478/
  28. https://www.techpowerup.com/cpu-specs/pentium-4-ht-3-2e.c265
  29. https://dfarq.homeip.net/amd-athlon-amds-game-changing-cpu-from-1999/
  30. https://www.vogons.org/viewtopic.php?t=105988
Add your contribution
Related Hubs
User Avatar
No comments yet.