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Three-state logic
Three-state logic
Three-state logic
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In digital electronics, a tri-state or three-state buffer is a type of digital buffer that has three stable states: a high voltage output state (logical 1), a low output state (logical 0), and a high-impedance (Hi-Z) state. In the Hi-Z state, the output of the buffer is effectively disconnected from the subsequent circuit.

Tri-state buffers are commonly used in bus-based systems where multiple devices are connected to the same shared bus, because the Hi-Z state allows other devices to drive the bus without interference from the tri-state buffer. For example, in a computer system, multiple devices such as the CPU, memory, and peripherals may be connected to the same data bus. To ensure that only one device can transmit data on the bus at a time, each device is equipped with a tri-state buffer. When a device wants to transmit data, it activates its tri-state buffer, which connects its output to the bus and allows it to transmit data. When the transmission is complete, the device deactivates its tri-state buffer, which disconnects its output from the bus and allows another device to access the bus. Tri-state buffers are also useful for reducing crosstalk and noise on a bus.

Tri-state output can be incorporated into various logic gates, flip-flops, microcontrollers, or other digital logic circuits.

Operation

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A tri-state buffer behaves either like an open switch (i.e. presenting a Hi-Z output) when the enable signal B is off or as a regular non-inverting buffer (which duplicates and boosts the input onto the output) when the enable signal is on:

Unlike a simple transmission gate, a tri-state buffer when enabled additionally provides voltage level restoration to boost the input to be well within its valid logic voltage range. A tri-state buffer's behavior is given by the following truth table:

Input Output
A B C
0 0 Hi-Z
1 Hi-Z
0 1 0
1 1

Alternatively, inverting tri-state buffers when enabled will invert the input A.

Uses

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The Hi-Z state's purpose is to effectively remove a device's influence from the rest of the circuit. If multiple devices output to a shared wire, no device should drive the shared wire to one logical voltage level when another device drives the shared wire to another logical voltage level, since that competition would result in excessive current draw through the short circuit and an uncertain voltage level.

Three-state devices on many shared electronic buses present a Hi-Z output when not actively communicating, so that shared wires are available to be driven. For example, in a Serial Peripheral Interface bus in multidrop configuration, only a single peripheral chip at a time may be selected using its CS (chip select), while all other peripheral chips present a Hi-Z output to avoid corrupting the data sent by the one selected chip. Three-state buses are typically used between chips on a single printed circuit board (PCB), or sometimes between PCBs plugged into a common backplane.

Three-state buffers can also be used to implement efficient multiplexers, especially those with large numbers of inputs.[1]

Tri-state multiplexing, also known as Charlieplexing, is used to reduce the number of wires needed to drive a set of light-emitting diodes.

Output enable vs. chip select

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Many memory devices designed to connect to a bus (such as RAM and ROM chips) have both CS and OE (output enable) pins, which superficially appear to do the same thing. If CS is not asserted, the outputs are Hi-Z.

The difference lies in the time needed to output the signal. When chip select is deasserted, the chip does not operate internally, and there will be a significant delay between providing an address and receiving the data. (An advantage of course, is that the chip consumes minimal power in this case.)

When chip select is asserted, the chip internally performs the access, and only the final output drivers are disabled by deasserting output enable. This can be done while the bus is in use for other purposes, and when output enable is finally asserted, the data will appear with minimal delay. A ROM or static RAM chip with an output enable line will typically list two access times: one from chip select asserted and address valid, and a second, shorter time beginning when output enable is asserted.

Use of pull-ups and pull-downs

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When outputs are tri-stated (in the Hi-Z state) their influence on the rest of the circuit is removed, and the circuit node will be "floating" if no other circuit element determines its state. Circuit designers will often use pull-up or pull-down resistors (usually within the range of 1–100 kΩ) to influence the circuit when the output is tri-stated.

The PCI local bus provides pull-up resistors, but they would require several clock cycles to pull a signal high given the bus's large distributed capacitance. To enable high-speed operation, the protocol requires that every device connecting to the bus drive the important control signals high for at least one clock cycle before going to the Hi-Z state. This way, the pull-up resistors are only responsible for maintaining the bus signals in the face of leakage current. Intel refers to this convention as "sustained tri-state", and also uses it in the Low Pin Count bus.

Alternatives

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Open collector output is an alternative to three-state logic. For example, the bidirectional I²C bus uses pull-up resistors on its two shared communication lines. When not transmitting, devices present a Hi-Z output to effectively "release" control over the communication lines. When all devices on the bus are Hi-Z, the only influence on the circuit is the pull-up resistors, which pull the lines high. When a device wants to transmit, it comes out of the Hi-Z state and drives the line low. Devices communicating over I²C either let the line float high, or drive it low – thus preventing any bus contention situation where one device drives a line high and another low.

Early microcontrollers often have some pins that can only act as an input, other pins that can only act as a push–pull output, and a few pins that can only act as an open collector input/output. A typical modern microcontroller has many three-state general-purpose input/output pins that can be programmed to act as any of those kinds of pins.

Usage of three-state logic is not recommended for on-chip connections but rather for inter-chip connections.[2] Three-state buffers, when used to enable multi-device communication on a data bus, can be functionally replaced by a multiplexer.[3] That will help select output from a range of devices and write one to the bus.

See also

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Notes and references

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Revisions and contributorsEdit on WikipediaRead on Wikipedia

Three-state logic

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from Grokipedia
Three-state logic, also known as tri-state logic, is a fundamental concept in digital electronics where circuit outputs can assume one of three distinct states: logic high (representing 1), logic low (representing 0), or high-impedance (Hi-Z), a floating state that electrically isolates the output as if disconnected. This third state enables multiple devices to share common signal lines, such as data buses, without causing electrical conflicts or contention that could damage components or corrupt signals. At its core, three-state logic is realized through tri-state buffers or drivers, which are specialized digital circuits featuring two primary inputs: a input and an enable (or control) input. When the enable signal is active (e.g., logic high for active-high configurations), the output mirrors the input, functioning as a standard non-inverting or inverting buffer to amplify or isolate signals. Conversely, when the enable is inactive, the output enters the Hi-Z state, drawing negligible current and behaving like an open circuit, regardless of the input. Common implementations include integrated circuits like the 74LS244 (octal buffer) or 74HC245 (bidirectional transceiver), often built using or TTL technologies for compatibility with various voltage levels. The primary advantage of three-state logic lies in its ability to support multiplexed bus architectures, where decoders or control logic ensure only one driver is active at a time on a shared line. This design reduces wiring complexity, lowers power consumption in idle states, and enhances scalability in integrated systems. In , it is indispensable for connecting , processors, and peripherals to and data buses, facilitating efficient bidirectional communication. Variations include active-low enable pins for inverted control and bidirectional buffers for read/write operations, with capabilities supporting up to 20 standard loads in TTL variants.

Fundamentals

Definition and Purpose

Three-state logic, also known as tri-state logic, refers to a type of digital circuit output that can assume one of three distinct states: a logic high (representing 1), a logic low (representing 0), or a high-impedance state (often denoted as Z), in which the output is electrically disconnected from the rest of the circuit, effectively presenting no load to connected lines. This high-impedance state allows the output to float without influencing the signal on shared lines, extending beyond the binary states of traditional two-state logic gates. The primary purpose of three-state logic is to facilitate efficient resource sharing in electronic systems, particularly by enabling multiple devices to connect to a single common signal line, or bus, without causing electrical conflicts known as bus contention. In this setup, only one device at a time actively drives the bus to a high or low state, while others remain in the high-impedance mode, preventing interference and allowing for signal multiplexing where data from various sources can be selectively routed over the same pathway. This capability is essential for reducing wiring complexity and improving scalability in integrated circuits and digital systems. Three-state logic originated in the late amid the rapid development of transistor-transistor logic (TTL) integrated circuits, which addressed the limitations of earlier two-state logic in handling increasingly complex interconnections in computing hardware. Specifically, it was introduced by Dale Mrazek at in 1967 as an enhancement to the 7400 series TTL family, originally developed by , enabling the first commercial tri-state devices for bus-oriented applications. This innovation built on the foundational binary logic gate concepts but provided a practical extension for shared communication lines in emerging digital architectures.

States and Electrical Characteristics

In three-state logic, the output can assume one of three distinct states, each characterized by specific voltage levels and impedance properties. The logic high state (denoted as '1') occurs when the output is actively driven to a voltage near the supply voltage, VCC, typically +5 V in traditional TTL implementations. In this state, the output acts as a , capable of sourcing up to several milliamperes (e.g., 2.6 mA minimum for VOH = 2.4 V in buffer devices like the SN54LS125A) to maintain the line high against connected loads. The logic low state (denoted as '0') drives the output to a voltage close to ground (0 V), functioning as a current that pulls the line low. For TTL devices, the maximum low-level output voltage, VOL, is 0.4 V when sinking 12 mA (as specified for devices like the SN54LS125A), ensuring reliable low signaling without excessive . This state exhibits low , typically in the range of 50–100 Ω, allowing effective drive of capacitive or resistive loads. The high-impedance state (denoted as 'Z') renders the output effectively disconnected from the circuit, behaving as an open circuit with output impedance modeled as Zout≈∞Z_{\text{out}} \approx \infty, in contrast to the 50–100 Ω impedance of the active high or low states. This state features very (typically in the range of hundreds of kΩ to several MΩ depending on the and conditions), with off-state leakage current typically much less than 1 μA but with maximum values of up to ±20 μA in TTL and ±10 μA in implementations (e.g., at VCC = 5.5 V), preventing loading effects on shared lines driven by other devices. Electrically, these states vary between logic families. In TTL, input high voltage threshold (VIH) is at least 2 V and input low (VIL) at most 0.8 V, with output high (VOH) minimum 2.4 V and low (VOL) maximum 0.4 V, providing noise margins of about 0.4 V. implementations, such as HCT series compatible with TTL levels, offer similar thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V) but achieve higher VOH (up to 4.4 V minimum at low current) and lower VOL (0.1 V maximum), with superior noise margins exceeding 1 V due to rail-to-rail outputs. In the Z state, exhibits particularly low power dissipation, as the output transistors are off, resulting in negligible static current (typically <1 μA per gate) compared to active states where dynamic switching consumes power proportional to load capacitance and frequency.

Operation

High-Impedance Mechanism

The high-impedance state in three-state logic devices is achieved through internal circuitry that isolates the output node from the power supply and ground when the enable signal is inactive, effectively creating an open circuit with very high output impedance, typically on the order of megohms. This isolation prevents the device from sourcing or sinking current, allowing other devices to drive the shared line without contention. In CMOS implementations, a common approach uses a tri-state buffer or inverter where the output path incorporates a transmission gate formed by a PMOS transistor and an NMOS transistor in parallel, controlled by complementary enable signals. When the enable input (EN) is low, the PMOS is off (gate high) and the NMOS is off (gate low), disconnecting the logic circuitry from the output and resulting in the high-impedance (Z) state regardless of the input. For a tri-state inverter variant, additional inverter stages restore the logic level during active operation, but the enable mechanism similarly gates the output transistors to float the pin when disabled. A textual schematic breakdown illustrates this: the input feeds an inverter pair to generate the output logic; this inverted signal then drives the gates of a pull-up PMOS and pull-down NMOS in the output stage; a separate enable inverter provides EN-bar to the gate of a series PMOS and EN to the gate of a series NMOS, ensuring both are non-conducting in the Z state. In TTL devices, such as the 74LS244 octal buffer, the high-impedance state is realized by modifying the standard totem-pole output configuration with an enable transistor that disables both the upper Darlington pair (for high output) and the lower NPN transistor (for low output). When the output-enable input (G) is high, this control transistor turns off the base drives to the output stage, floating the collector-emitter path and isolating the output. The totem-pole structure normally provides low-impedance drive (high for sourcing ~400 μA, low for sinking ~8 mA), but in Z mode, the output impedance rises dramatically, mimicking an open connection. A simplified schematic description shows: the input logic drives phase-splitter transistors; the enable signal gates a PNP or additional NPN to cut off current to the output Darlington (Q3-Q4 for high) and totem-pole lower (Q5), leaving the output pin undriven. Transitioning into or out of the high-impedance state introduces propagation delays due to the time required to charge/discharge internal nodes and the output capacitance. In standard TTL like the 74LS244, the disable time from low to Z (tPLZ) is approximately 10-20 ns, and from high to Z (tPHZ) is 15-25 ns, measured under typical conditions (VCC=5 V, CL=5 pF). These delays ensure reliable bus arbitration but must be considered in high-speed designs to avoid glitches during state changes.

Enable and Disable Processes

In three-state logic, the enable process activates the output buffer through an enable signal, typically denoted as EN, which can be configured as active-high or active-low. When asserted—for instance, logic high for active-high designs—the buffer connects the input data signal D to the output Q, driving it to a logic low (0) or high (1) state accordingly, thereby allowing the device to participate in bus communication. This activation requires adherence to timing parameters such as setup time (the minimum duration the data must be stable before the enable transition) and hold time (the minimum duration after the transition), with examples in 3.3 V CMOS buffers like the SN74LVC1G125 specifying a setup time of approximately 2 ns. The propagation delay from enable assertion to output stabilization is also critical, around 4 ns typical in such devices. The disable process occurs when the enable signal is deasserted, causing the output to transition to the high-impedance state (Z), effectively isolating the device from the bus and preventing it from influencing other connected components. This deassertion typically takes a disable time (t_dis) of 4.6 ns or less in high-speed buffers at 3.3 V, during which the output impedance rises to several megaohms, mimicking an open circuit. However, if multiple tri-state devices share a bus and their enable signals are not properly synchronized, brief contention may arise, where outputs momentarily drive conflicting levels, potentially leading to increased current draw or logic errors. To mitigate this, disable timing must overlap minimally with other devices' enable periods, often managed through clocked control. Control logic for three-state outputs commonly employs simple combinational gates, such as AND or OR structures integrated within the buffer, to combine the enable signal with the data input. The output behavior can be represented symbolically as: if EN = 1, then Q = D; if EN = 0, then Q = Z (where Z denotes ). This logic ensures the device only drives the bus when enabled, as illustrated in the following truth table for an active-high enable configuration:
ENDQ
100
111
00Z
01Z
Such tables are standard in device specifications, confirming that the output remains in Z regardless of input when disabled. To prevent glitches—transient voltage spikes that could corrupt data during state transitions—the enable signal must exhibit monotonic behavior, rising or falling smoothly without oscillations through the threshold region. Non-monotonic enables can cause partial activation of the buffer, leading to unintended output glitches or contention on shared lines; thus, clean signal generation via synchronized clocks or debounced controls is essential for reliable operation.

Applications

Shared Bus Systems

In shared bus systems, three-state logic enables multiple devices to connect to a common data or address line through tri-state drivers, where each driver can be actively driving a high or low signal or enter a high-impedance state to isolate itself from the bus. This architecture prevents electrical conflicts by ensuring only one driver is enabled at any given time, allowing bidirectional communication on a single set of wires. For instance, in microprocessor systems, the address and data buses utilize this setup, with the CPU and peripherals like memory chips sharing the lines via tri-state buffers controlled by enable signals derived from address decoding and control lines. Bus arbitration mechanisms coordinate access to ensure exclusive use of the shared lines, typically employing bus controllers or daisy-chain grant signals to prioritize and sequence active drivers. In an 8-bit microprocessor like the , the system relies on control signals such as RD (read) and WR (write) to enable the CPU's tri-state data bus buffer, while peripheral devices use decoded address lines to activate their drivers selectively, avoiding simultaneous activation. This time-division multiplexing approach allows devices to take turns driving the bus, enhancing effective throughput by supporting multiple contributors without dedicating separate wires for each, thus optimizing pin count and system expandability. The adoption of three-state logic in shared buses proved pivotal in early computing, as seen in the Altair 8800 microcomputer introduced in 1975, where the S-100 bus employed tri-state drivers like the 8T97 for expandable I/O and memory interfaces, facilitating modular system design. However, improper arbitration can lead to contention risks, where multiple drivers activate simultaneously, causing a short-circuit current surge—potentially up to 100 mA in TTL-based implementations—resulting in excessive power dissipation, device damage, or undefined bus voltages that corrupt data transmission.

Memory and I/O Interfaces

In memory chips such as RAM and ROM, tri-state outputs enable multiple devices to share a bidirectional data bus with the CPU by allowing the memory to drive the bus only during read operations and enter a high-impedance (Z) state during write cycles, preventing interference as the CPU asserts data onto the bus. For instance, the 74LS245 octal bus transceiver, a staple in TTL-based systems, facilitates this bidirectional communication by using an enable signal to switch between transmission directions and tri-state the outputs when idle, ensuring efficient data flow between the CPU and memory without bus contention. In peripheral I/O devices like UARTs and ADCs, three-state logic is employed to manage data flow on shared buses, where the output enters the Z state during input modes to avoid loading the bus and allow other devices to drive it. In UART implementations within microcontrollers, the transmit pin can be tristated when not actively sending data, isolating it from the bus to support multi-device configurations. Similarly, in ADCs such as the ADC12L063, an output enable (OE) pin high asserts the high-impedance state on data outputs during non-conversion periods, minimizing bus interference while the device samples inputs. A key example in DRAM interfaces involves the coordination of column address strobe (CAS), row address strobe (RAS), and OE signals to place outputs in the Z state during refresh cycles, ensuring the memory array refreshes without driving invalid data onto the bus. This tri-state behavior during CAS-before-RAS refresh sequences isolates the outputs, allowing internal row activation without external visibility and maintaining data integrity across the system. The high-impedance Z state contributes to power efficiency by turning off output drivers in idle memory banks, reducing dynamic power dissipation since no current flows through the bus when the device is not actively driving it. This isolation minimizes leakage and switching losses, particularly beneficial in multi-bank configurations where unused banks remain powered down without bus loading. Three-state logic in memory interfaces has evolved from TTL implementations in the 1970s, which offered robust bus sharing but higher power use, to low-voltage CMOS (LVCMOS) variants in modern DDR memory, enabling sub-nanosecond switching speeds while maintaining compatibility with high-speed data rates up to several gigahertz. This progression supports denser integrations and lower overall system power in contemporary architectures like DDR4 and beyond.

Control Mechanisms

Output Enable Signal

The output enable (OE) signal serves as a dedicated control input in three-state logic devices, allowing the outputs to switch between an active driving state and a high-impedance (tri-state) state. In integrated circuits such as octal buffers, the OE pin determines whether the device drives the output bus or isolates it electrically. For instance, in the 74HC244 buffer, a low logic level on the OE input (active-low polarity) enables the noninverting outputs to drive the connected lines based on the input signals, while a high level places the outputs in the high-impedance state, preventing any loading on the bus. This polarity is common in the HC CMOS family, though it can vary across logic families, with some devices using active-high OE for enabling outputs. In bidirectional applications, the OE signal is frequently integrated with a direction (DIR) control pin in transceiver devices to manage data flow over shared buses. For example, in the 74AC245 octal transceiver, the OE input must be asserted (low in this case) to enable the three-state outputs, while the DIR pin separately controls whether data flows from A to B ports or vice versa, enabling efficient bidirectional communication without bus contention. This combination allows multiple devices to share a common data path, with OE ensuring only one transceiver drives the bus at a time. Timing specifications for the OE signal are crucial, particularly in synchronous systems where precise control of bus access is required to avoid glitches or timing violations. In the 74HC series, the maximum enable time (t_en) from OE low to output high or low is 28 ns, and the disable time (t_dis) to high-impedance is 38 ns, measured at 5 V supply over -40°C to +85°C with a 15 pF load; these delays ensure compatibility in clocked environments but must be factored into setup and hold times. Such parameters are defined in JEDEC standards for logic families to promote interoperability across devices. A notable design consideration involves the configuration of the OE pin; permanently tying it to the active level (e.g., low in active-low devices) defeats the tri-state capability, causing the outputs to remain continuously enabled and imposing constant electrical loading on the bus, which can lead to increased power consumption and signal integrity issues. Proper dynamic control of OE, often via a microcontroller or address decoder, is essential to realize the benefits of three-state logic in multi-device systems.

Chip Select Differentiation

The chip select (CS), also known as chip enable (CE), is a control signal that activates an entire integrated circuit or memory device for operation, enabling its internal logic to respond to address and other control inputs. Typically active low, the CS signal selects the device among multiple components in a system, powering or clocking the chip's core functionality without directly influencing the state of its output pins. For instance, in memory chips, asserting CS low allows the device to decode addresses and prepare for read or write cycles. In contrast to the output enable (OE) signal, which specifically tri-states only the output pins to facilitate bus sharing by placing them in a high-impedance state when inactive, CS governs the overall device activation, including power distribution and internal clocking to the entire chip. OE focuses on data flow control from outputs during read operations, whereas CS ensures the device is fully operational before any such control takes effect; both signals are often employed together, with CS enabling the chip and OE managing the output tri-stating for efficient shared bus access. This separation allows systems to maintain low power by deselecting idle chips via CS while using OE for fine-grained output control. A representative example occurs in static random-access memory (SRAM) devices, where CS must be asserted low to power the chip and enable internal operations, while OE low subsequently drives data onto the output pins during a read cycle (with write enable high). If CS remains high, the SRAM ignores all inputs, including OE assertions, resulting in outputs staying in high-impedance mode regardless of OE state, thus preventing unintended bus interference. In multi-chip systems, the CS signal is generated by an address decoder that interprets higher-order address bits to uniquely select the target device, ensuring only the appropriate SRAM or memory bank responds to system commands. This decoding mechanism expands addressable memory space efficiently without address overlap. Although some designs integrate CS and OE controls for simplified logic—where CS assertion implicitly enables output paths—they remain logically distinct to support partial tri-stating scenarios, such as selecting a chip for internal writes while keeping outputs disabled via OE. This independence enhances flexibility in bus arbitration and power management.

Pull-up and Pull-down Resistors

In three-state logic systems, pull-up and pull-down resistors are essential external components used to establish a defined logic level on bus lines when all connected drivers are placed in the high-impedance (Z) state, thereby avoiding floating nodes that can lead to undefined voltages, increased noise susceptibility, or unintended oscillations. When no active driver is asserting the bus, a pull-up resistor connected between the bus line and the positive supply voltage (VCC) forces a default logic high state, while a pull-down resistor connected between the bus line and ground (GND) enforces a default logic low state; this ensures stable operation and prevents issues such as excessive power dissipation from leakage currents interpreting the floating state as an intermediate voltage. These are particularly critical in shared bus architectures where multiple tri-state devices may alternate control, as the high-impedance mode leaves the line electrically disconnected from any driver. Typical resistor values for tri-state bus applications range from 1 kΩ to 10 kΩ, selected to balance signal integrity, power efficiency, and switching speed; for instance, higher values like 10 kΩ to 50 kΩ minimize static power consumption (where current I = VCC/R) in low-activity systems, while lower values around 2.2 kΩ achieve faster rise times relative to higher values (actual times depending on bus capacitance, typically 20–100 pF, yielding tens to hundreds of ns at 5 V). The choice considers the RC time constant formed with bus capacitance, which should be less than the minimum propagation delay of the drivers to avoid signal distortion. In configurations for tri-state logic, these resistors are placed at the bus termination or near receiver inputs to weakly bias idle lines, ensuring the default state persists until an active driver overrides it with sufficient strength. Despite their utility, pull-up and pull-down resistors introduce drawbacks, including elevated static power dissipation proportional to the supply voltage and resistor value (e.g., several milliamps at 5 V with a 1 kΩ resistor), as well as prolonged rise or fall times due to the resistive charging/discharging of parasitic capacitances, which can limit applicability in high-speed designs. Best practices recommend their use primarily in weakly driven or low-speed tri-state buses, such as those operating below 10 MHz, where driver output strength is modest; for initialization sequences, a temporary low-impedance resistor (e.g., 3 kΩ) can preset the bus state before transitioning to higher values for normal operation, and integrated alternatives like bus-hold circuits should be considered for enhanced reliability without external components.

Alternatives

Open-Collector Configurations

Open-collector configurations in logic circuits feature outputs that can actively sink current to ground to produce a logic low state but remain open-circuited when inactive, preventing the sourcing of current for a high state. This design necessitates an external pull-up resistor connected to the supply voltage to establish the high logic level when the output is open. In contrast to three-state logic, which allows outputs to actively drive high, low, or enter a full high-impedance state for complete disconnection from the bus, open-collector outputs only pull low or float, enabling multiple devices to share a signal line without contention. This shared-line capability supports wired-OR logic, where the line remains high unless any connected output asserts low, effectively performing a logical OR function across the outputs. Open-collector designs offer simplicity over three-state by eliminating the need for an enable signal to achieve the "off" state, as the open circuit inherently floats the output, and they were lower cost in the TTL era due to reduced internal complexity without active high-drive circuitry. However, they cannot actively drive the line high, leading to slower rise times determined by the of the external and load capacitance, and they consume additional power through the even when outputs are inactive. Historically, open-collector outputs were prevalent in early TTL integrated circuits, such as the 74LS06 hex inverter buffer in the 74LSxx series, for applications requiring wired-OR functionality and high current sinking before three-state buffers became standard in the late .

Modern Low-Power Variants

In modern technologies, open-drain configurations serve as a low-power alternative to traditional three-state logic, particularly in serial bus protocols like and SMBus. Unlike open-collector designs rooted in bipolar technology, open-drain outputs employ NMOS transistors in a CMOS process, enabling operation at lower voltages such as 3.3 V while maintaining compatibility with pull-up resistors for bus arbitration. This approach reduces static power dissipation by avoiding the need for active high-drive circuitry during idle states, making it suitable for battery-powered devices. Totem-pole outputs, featuring complementary PMOS and NMOS drivers, have evolved in system-on-chip (SoC) designs to incorporate modes that emulate tri-state isolation without full high-impedance switching. In these configurations, isolates the output stage during low-activity periods, minimizing leakage while allowing rapid reactivation for data transfer. This is common in embedded SoCs where dynamic is critical, as the totem-pole structure provides strong drive for active signaling but enters a near-zero-current state in . Advanced field-programmable gate arrays (FPGAs) employ multi-strength drivers in their configurable I/O blocks to extend tri-state functionality with programmable impedance levels. For instance, (now ) UltraScale devices support tri-state (Z) modes alongside weak and strong drive options, allowing designers to adjust output current from a few mA up to 16 mA per pin while optimizing for power in multi-device buses. This flexibility reduces contention risks and power overhead in shared interfaces. Differential signaling standards like (LVDS) offer non-tri-state alternatives for high-speed bus applications, using paired complementary lines to transmit data with inherent noise rejection and lower power than single-ended tri-state schemes. LVDS operates at voltage swings of about 350 mV around a 1.2 V common mode, achieving data rates up to several Gbps while consuming less than 10 mW per channel, thus bypassing tri-state leakage issues in point-to-multipoint topologies. The evolution from 5 V TTL-based tri-state logic to 1.8 V and 1.2 V variants in nanometer-scale processes has significantly lowered Z-state leakage currents, often to below 10 pA per pin, through thinner gate oxides and high-k dielectrics that enhance subthreshold control. This scaling enables tri-state buffers in mobile and IoT devices without excessive . In testing contexts, the IEEE 1149.1 () standard incorporates tri-state variants in boundary-scan chains, where outputs are disabled during shift operations to isolate pins and verify interconnects without bus conflicts. Despite these advances, tri-state logic faces limitations in deep-submicron technologies below 65 nm, where gate leakage and subthreshold currents can exceed 1 µA per buffer in high-impedance mode, contributing up to 20% of total chip power in dense arrays. To address this in analog-digital hybrid circuits, switched-capacitor techniques provide isolation without tri-state , using clocked capacitors to sample and transfer signals while minimizing DC leakage paths. These circuits achieve effective impedance control through charge redistribution, suitable for low-power data converters. As of 2025, tri-state-inspired isolation is integrated into AI accelerators via dynamic , where fine-grained switches create Z-like states for inactive neural processing units, reducing idle power by over 50% in multi-core designs. This trend supports energy-efficient inference in edge systems, with hardware-managed gating ensuring seamless reactivation for burst workloads.

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  17. https://electronics.stackexchange.com/questions/560309/bus-contention-when-addressing-tristate-buffers-by-decoder-output
  18. https://www.sciencedirect.com/topics/computer-science/tristate-buffer
  19. https://www.ti.com/lit/gpn/SN74LS245
  20. https://electronics.stackexchange.com/questions/2443/tristate-a-pin
  21. https://community.nxp.com/t5/S32K/S32K146-How-to-Tristate-UART-TxD-Pin/m-p/986174
  22. https://www.ti.com/lit/gpn/ADC12L063
  23. https://compas.cs.stonybrook.edu/~nhonarmand/courses/sp15/cse502/res/dramop.pdf
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  25. https://www.analog.com/en/resources/glossary/three-state.html
  26. https://www.ic-components.com/blog/cmos-vs-ttl-evolution%2Cprinciples%2Cand-application-decisions-in-modern-electronics.jsp
  27. https://www.ti.com/lit/SDYU001
  28. https://assets.nexperia.com/documents/data-sheet/74HC_HCT244.pdf
  29. https://www.jedec.org/standards-documents/dictionary/terms/output-enable-1-general
  30. https://www.ti.com/lit/gpn/cd74ac245
  31. https://www.jedec.org/standards-documents/dictionary/terms/enable-time-high-level-three-state-or-h-type-open-circuit-outpu
  32. https://www.ti.com/lit/szza036
  33. https://www.infineon.com/dgdl/Infineon-CY7C1010DV33_2-Mbit_%28256_K_8%29_Static_RAM-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec2d3eb37cb
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  38. https://e2e.ti.com/support/logic-group/logic/f/logic-forum/751472/faq-how-do-i-size-pull-up-or-pull-down-resistors
  39. https://www.ti.com/lit/an/szza036c/szza036c.pdf
  40. http://bitsavers.informatik.uni-stuttgart.de/components/ti/_dataBooks/1981_TI_1981_Supplement_to_The_TTL_Data_Book_for_Design_Engineers_2ed.pdf
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  42. https://www.ti.com/lit/pdf/sbaa565
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  44. https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/SoC/microsemi_smartfusion2_igloo2_fpga_low_power_design_user_guide_ug0444_v5.pdf
  45. https://www.amd.com/content/dam/xilinx/support/documents/user_guides/ug571-ultrascale-selectio.pdf
  46. https://www.xilinx.com/support/documents/sw_manuals/xilinx2022_1/ug899-vivado-io-clock-planning.pdf
  47. https://www.ti.com/lit/pdf/snla184
  48. https://www.analog.com/en/resources/technical-articles/understanding-lvds-failsafe-circuits.html
  49. https://www.ti.com/lit/pdf/scya049
  50. https://www.ti.com/lit/an/ssya002c/ssya002c.pdf
  51. https://cdrdv2-public.intel.com/654590/an039.pdf
  52. https://www.sciencedirect.com/science/article/abs/pii/S0167926007000041
  53. https://www.spiedigitallibrary.org/proceedings/Download?urlId=10.1117%252F12.498181&downloadType=proceedings%2520article&isResultClick=True
  54. https://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-21.pdf
  55. https://arxiv.org/html/2508.02536v2
  56. https://dl.acm.org/doi/10.1145/3725843.3756097
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