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LGA 1150
LGA 1150
LGA 1150
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LGA 1150
Release date2013 (2013)
TypeLGA-ZIF
Chip form factorsFlip-chip
Contacts1150
FSB protocolPCI Express
Processor dimensions37.5 × 37.5 mm
1,406.25 mm²
Processors
PredecessorLGA 1155
SuccessorLGA 1151
Memory supportDDR3
This article is part of the CPU socket series
LGA 1150 features a Fully Integrated Voltage Regulator.

LGA 1150,[1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.[2]

It is the successor of LGA 1155 and was itself succeeded by LGA 1151 in 2015.

Most motherboards with the LGA 1150 socket support varying video outputs (VGA, DVI or HDMI – depending on the model) and Intel Clear Video Technology.

Full support of Windows on LGA 1150 platform starts on Windows 7. Official Windows XP support is limited to selected CPUs, chipsets and only for embedded and industrial systems.

Intel's Platform Controller Hub (PCH) for the LGA 1150 CPUs is codenamed Lynx Point.[3] Intel Xeon processors for socket LGA 1150 use the Intel C222, C224, and C226 chipsets.[4]

Heatsink

[edit]

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm[5] for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.

Haswell chipsets

[edit]
See also: Lynx Point

First generation

[edit]
PCH name[6][7] H81 C222 B85 C224 Q85 Q87 C226 H87 Z87
Overclocking CPU ratio (ASRock, ECS, Biostar, Gigabyte, Asus, MSI[8][9][10][11][12][13]) + GPU CPU + GPU + RAM
Haswell Refresh CPUs support Yes (may require BIOS update before CPU installation)
Broadwell CPUs support No Yes (may require BIOS update before CPU installation) No Yes (may require BIOS update before CPU installation) No Yes (may require BIOS update before CPU installation) No
Allows using built-in GPU Yes No Yes No Yes
Maximum DIMM slots[14] 2 (Up to 16384MB supported) 4 (Up to 32768MB supported)
Maximum
USB ports 		2.0 8 10 8
3.0 2 4 6
Maximum SATA ports 2.0 2 4 2 0
3.0 2 4 6
CPU-attached PCI Express[14][a] 1 × PCIe 2.0 ×16 1 × PCIe 3.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4
Chipset-attached PCI Express[14][b] 6 × PCIe 2.0 ×1 8 × PCIe 2.0 ×1
Conventional PCI support Although chipsets may not support conventional PCI, motherboard manufacturers can include support through the addition of third-party bridges.
Intel Rapid Storage Technology (RAID) No Enterprise No Enterprise No Yes Enterprise Yes
Smart Response Technology No Yes
Intel Anti-Theft Technology Yes
Intel Active Management, Trusted Execution, VT-d Technologies and Intel vPro Platform Eligibility No VT-d available only No VT-d available only No Yes No Not supported, but ASRock Z87 Extreme6 supports VT-d[15]
Release date August–September 2013 June 2, 2013[16]
Chipset TDP 4.1 W[17]
Chipset lithography 32 nm[18][19]

Second generation

[edit]

On May 12, 2014, Intel announced the release of two 9-series chipsets, H97 and Z97.[20] Differences and new features of these two chipsets, compared to their H87 and Z87 counterparts, are the following:[21][22][23][24]

  • Support for Haswell Refresh CPUs out of the box
  • Support for the fifth generation of Intel Core CPUs, built around the Broadwell microarchitecture
  • Support for SATA Express, M.2[25] and Thunderbolt, though only if implemented by the motherboard's manufacturer
  • Two of the six SATA ports can be converted to two PCIe lanes and used to provide M.2 or SATA Express connectivity.[26] Intel refers to this variable configuration as Flex I/O or Flexible I/O.[27]

Motherboards based on H97 and Z97 chipsets were available for purchase the same day chipsets were announced.[28]

PCH name[29] H97 Z97
Overclocking CPU + GPU CPU + GPU + RAM
Haswell Refresh CPUs support Yes
Broadwell CPUs support Yes
Maximum DIMM slots 4
Maximum USB 2.0/3.0 ports 8 / 6
Maximum SATA 2.0/3.0 ports 0 / 6
CPU-attached PCI Express 1 × PCIe 3.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4
Chipset-attached PCI Express 8 × PCIe 2.0 ×1
Conventional PCI support No
Intel Rapid Storage Technology (RAID) Yes
Smart Response Technology Yes
Intel Anti-Theft Technology Yes
Intel Active Management, Trusted Execution, VT-d and vPro Technology No
Release date May 12, 2014
Chipset TDP 4.1 W
Chipset lithography 22 nm[30]

See also

[edit]

Notes

[edit]

References

[edit]
Revisions and contributorsEdit on WikipediaRead on Wikipedia

LGA 1150

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from Grokipedia
LGA 1150, also known as Socket H3, is a land grid array (LGA) CPU socket designed by Intel with 1,150 pins for desktop and entry-level server processors. Introduced in June 2013 as the successor to LGA 1155, it supports Intel's 4th-generation Core processors based on the Haswell microarchitecture and 5th-generation Core processors using Broadwell, along with compatible Pentium, Celeron, and Xeon E3 models. The socket employs an Independent Loading Mechanism (ILM) to apply uniform pressure on the processor's integrated heat spreader, ensuring reliable electrical contact and thermal performance, with a nominal stackup height of 7.781 mm from the motherboard to the top of the heat spreader. Compatible chipsets include the 8-series (such as H87, Z87, B85, and Q87) for initial Haswell support and the 9-series (H97 and Z97) for enhanced features like Broadwell compatibility and additional options. Key features encompass integrated graphics, dual-channel DDR3 memory support up to 1,600 MHz (with DDR3L for Broadwell), 3.0 lanes, and 2.0 for connectivity. Processors for LGA 1150 typically range from dual-core and models to quad-core (and unlocked variants with for eight threads) Core i7 processors, with up to 88 W. It was succeeded by in August 2015, marking the transition to Skylake processors and DDR4 memory support. The socket's design emphasized compatibility with existing motherboard layouts from prior generations while introducing a fully integrated voltage regulator on the processor package to improve power delivery efficiency. Production of LGA 1150 processors ended in , but the socket remains relevant in legacy systems and budget upgrades due to its widespread adoption.

Introduction

Overview

The LGA 1150, also known as Socket H3, is a (LGA) CPU socket featuring 1150 pins arranged in a 40x40 grid with central depopulation for desktop and entry-level server processors. It serves as the interface between compatible processors and motherboards, utilizing an Independent Loading Mechanism (ILM) to ensure secure and uniform contact. Introduced in June 2013 alongside Intel's 4th-generation Core processor family (Haswell), the LGA 1150 primarily supports these processors, along with select 5th-generation Core models (Broadwell) via updates on compatible motherboards. It enables key features such as integrated graphics processing and dual-channel DDR3 support up to 1600 MHz. The socket reached end-of-life around 2015, transitioning to with the launch of Skylake processors. Compared to its predecessor, , the LGA 1150 offers improved power efficiency through Haswell's architectural enhancements, delivering 6-10% better performance at lower power consumption levels. It accommodates processors with (TDP) ratings up to 84 W for standard models and 88 W for unlocked variants like the Core i7-4790K. Positioned for consumer desktops, all-in-one PCs, and workstations, as well as entry-level servers via Xeon E3 compatibility, the LGA 1150 excludes mobile and high-end server applications. It pairs with 8-series and 9-series chipsets for broad system integration.

Development and Release

The LGA 1150 socket was developed as the successor to the LGA 1155, specifically to accommodate Intel's Haswell microarchitecture on a 22 nm process node, introducing significant changes to the pinout configuration. Unlike its predecessor, which relied on external voltage regulation, LGA 1150 incorporated support for Haswell's Fully Integrated Voltage Regulator (FIVR), shifting power delivery on-die and necessitating a redesigned pin layout to optimize signal integrity for the integrated memory controller (IMC) and PCIe lanes. This evolution enabled improved power efficiency and bandwidth capabilities while maintaining backward incompatibility to ensure platform stability. Key design objectives for LGA 1150 focused on enhancing overall platform efficiency, including better thermal management through refined power delivery and support for DDR3-1600 memory speeds in dual-channel configurations to balance performance and cost. The socket was engineered to handle Haswell's increased transistor density while preparing for unlocked overclocking capabilities, particularly with upcoming chipsets that would expand multiplier adjustments and base clock tuning. These goals addressed the limitations of prior sockets by prioritizing scalability for enthusiast users without compromising mainstream compatibility. Intel officially announced LGA 1150 alongside the Haswell processors on June 4, 2013, at , with initial retail availability following in late June for the first wave of desktop CPUs and motherboards based on the Z87 chipset. Shipments of Z87-equipped motherboards began in Q3 2013, aligning with the broader Haswell rollout to retail channels. The socket debuted paired with the Haswell launch, featuring the Core i7-4770K as the flagship unlocked processor to drive early adoption among performance-oriented builders. However, initial platform stability for future upgrades, such as Broadwell processors, required updates from motherboard vendors to address compatibility hurdles like power state mismatches. Intel halted development of new LGA 1150 chipsets after the 9-series releases in Q2 , with the Z97 providing enhanced features like direct memory overclocking support. The last processors for the socket, from the Broadwell family, arrived in Q2 2015, marking the end of active support as transitioned to for subsequent architectures.

Technical Specifications

Electrical Characteristics

The LGA 1150 socket comprises 1150 pins arranged in a configuration, providing connections for I/O signals, power delivery, and ground references to support Intel's 4th and 5th generation Core processors. These include dedicated pins for , ground planes to minimize noise, and power/VID lines for dynamic , enabling efficient electrical interfacing between the processor and . Power specifications for the socket emphasize variable core voltage supply via the VID interface, with VCC ranging from 0.55 V to 1.52 V depending on processor SKU and load conditions, allowing for adaptive to optimize and . The design accommodates standard (TDP) ratings up to 84 W for locked processors, while unlocked "K-series" models can reach 125 W under , supported by motherboard-integrated modules (VRMs) for stable delivery. Electrical parameters such as mated loop below 3.6 nH and end-of-life averaging 19 mΩ ensure reliable power distribution and over the socket's lifespan. Interface support includes 16 lanes of PCIe 3.0 directly from the CPU, operating at up to 8 GT/s for graphics and expansion cards, alongside a DMI 2.0 link to the at 5 GT/s in x4 configuration for peripheral connectivity. Memory interfacing is limited to dual-channel DDR3/DDR3L at speeds up to 1600 MT/s, with no native DDR4 compatibility, relying on differential signaling pairs for . High-speed I/O employs differential pairs with controlled impedance—typically 90 ±10 ohms differential for and 100 ±10 ohms differential for 6 Gb/s passthrough via the . Compatibility considerations include the need for a update on Haswell-era motherboards to enable support for Broadwell processors, due to and initialization differences. Proper power sequencing, governed by signals like PWRGOOD and SUSCLK, is essential during processor insertion to avoid electrical damage, ensuring orderly ramp-up of voltages and clocks before full operation.

Mechanical Design

The LGA 1150 socket features a surface-mount (LGA) design with a 40 by 40 grid configuration, including a 24 by 16 central depopulation area, resulting in 1150 active contacts arranged in two offset L-shaped sections. The contact pitch measures 0.9144 mm (equivalent to 36 mils), with the land pattern sized at 36 mils by 36 mils per section and offsets of 0.9144 mm in the X-direction and 3.114 mm in the Y-direction between sections. The socket housing is constructed from thermoplastic material meeting V-0 flame rating standards, providing a compact form factor suitable for desktop integration. Contact interfaces consist of gold-plated lands on the underside of the compatible processor package, which mate with high-strength contacts in the socket plated with a minimum of 0.381 μm over 1.27 μm underplate. These spring-like contacts ensure reliable electrical and mechanical connection without requiring insertion force on the processor, facilitated by the (ZIF) mechanism via a load and plate assembly. The design supports up to 20 insertion and removal cycles for the socket and 15 cycles for the pick-and-place (PnP) cover, ensuring durability during typical installation and maintenance. The retention mechanism employs an Independent Loading Mechanism (ILM) with four corner mounting holes on the socket body, secured using screws torqued to a minimum of 8 inch-pounds (approximately 0.9 Nm) and a maximum of 10 inch-pounds (approximately 1.13 Nm) to apply even pressure without damaging components. This ILM generates a static compressive load ranging from 311 N minimum to 600 N maximum on the processor's (IHS), promoting stable contact. Keying features include a at Pin 1 for orientation, two protruding posts on the socket that align with notches on the processor substrate corners, and four alignment walls at the socket corners to prevent misinsertion and incorrect orientation. These elements ensure precise placement during assembly, reducing the risk of damage from improper handling. Durability is enhanced by the socket's ability to support a maximum heatsink mass of 500 grams while maintaining alignment under operational loads, with orientation posts and walls providing anti-wobble stability to withstand vibrations and minor shocks in desktop environments. The overall mechanical design prioritizes reliability for the 1150-pin interface, balancing compactness with robust handling characteristics.

Compatible Processors

Haswell Processors

The Haswell microarchitecture, introduced as Intel's fourth-generation Core processor family, is fabricated on a 22 nm process node utilizing tri-gate transistors for enhanced power efficiency and performance. It supports up to four cores in typical desktop configurations, with hyper-threading on higher-end models for up to eight threads, and integrates Intel HD Graphics 4600 (or Iris Pro 5200 on select variants) directly on the die. Key architectural advancements include support for AVX2 instructions, which extend vector processing to 256-bit operations including fused multiply-add (FMA) and integer vectors, alongside new cryptographic instructions and transactional synchronization extensions (TSX) for improved parallel computing efficiency. The Core processor lineup for LGA 1150 encompasses a range of models tailored for consumer desktops, including unlocked "K" variants for . Representative high-end options include the i7-4770K, a quad-core processor with eight threads, a 3.5 GHz base frequency, 8 MB L3 cache, and Turbo Boost up to 3.9 GHz, designed for enthusiasts. Mid-range models like the i5-4670 offer quad-core, four-thread performance at a 3.4 GHz base clock with 6 MB cache and Turbo Boost to 3.8 GHz, balancing gaming and productivity tasks. Entry-level dual-core options, such as the i3-4130 with a 3.4 GHz base frequency and 3 MB cache, provide integrated graphics for basic computing. Budget alternatives include the dual-core G3220 at 3.0 GHz with 3 MB cache and the G1820 at 2.7 GHz with 2 MB cache, both featuring HD Graphics for light workloads. Xeon variants under the E3-1200 v3 series extend Haswell to and entry-level server use, supporting for in professional environments. For example, the E3-1275 v3 features four cores and eight threads, a 3.5 GHz base frequency, 8 MB cache, Turbo Boost to 3.9 GHz, and up to 32 GB of DDR3 memory with ECC validation, making it suitable for and light . These processors maintain compatibility with LGA 1150 while adding features like error-correcting code support, without integrated on most models. Performance enhancements in Haswell include efficiency gains equivalent to a process node shrink through fully integrated voltage regulators (FIVR), enabling better and up to 20x reductions in idle power via low-power states. (TDP) spans 35 W to 84 W across the lineup, with Turbo Boost 2.0 allowing for burst workloads. The family launched in June 2013, comprising over 50 stock-keeping units (SKUs) to address diverse market segments, with K-series models optimized for on compatible motherboards.

Broadwell Processors

The Broadwell microarchitecture represents Intel's fifth-generation Core processor family, fabricated on a 14 nm process node as a die shrink of the preceding Haswell architecture, enabling improved power efficiency and integration density while maintaining compatibility with the LGA 1150 socket. These processors incorporate enhancements such as support for unlocked multipliers on select models, allowing overclocking capabilities, and feature the Iris Pro Graphics 6200 integrated GPU paired with 128 MB of on-package eDRAM cache, which provides up to a 20% performance uplift in graphics workloads compared to prior generations without eDRAM. The eDRAM acts as a high-bandwidth Level 4 cache for the GPU, reducing latency and boosting frame rates in applications like gaming and video processing. The desktop lineup for LGA 1150 was notably limited, with only a handful of SKUs released—primarily focused on high-end unlocked variants due to 's emphasis on mobile Broadwell implementations—totaling around five to seven models including consumer and enterprise options. Key consumer models include the quad-core i7-5775C, with a 3.3 GHz base frequency, Turbo Boost up to 3.7 GHz, 6 MB L3 cache, and 65 W TDP, and the i5-5675C, featuring a 3.1 GHz base frequency, Turbo Boost up to 3.6 GHz, 4 MB L3 cache, and the same 65 W TDP. Both integrate the Iris Pro Graphics 6200 and support DDR3-1600 memory. For enterprise use, the E3-1285 v4 offers a 3.5 GHz base frequency, Turbo Boost up to 3.8 GHz, 6 MB L3 cache, Iris Pro Graphics 6200, and technology for remote management, with a configurable TDP ranging from 65 W to 95 W. Broadwell processors deliver key advancements in efficiency and media capabilities, including a 65-95 W TDP range that enhances over Haswell equivalents, support for 1.2 for higher-resolution multi-monitor setups, and hardware-accelerated HEVC (H.265) decoding at up to 4K at 30 fps via a hybrid engine combining GPU and CPU resources. These features position Broadwell as a bridge for LGA 1150 systems, though compatibility requires a update on 9-series chipsets like Z97 or H97 to enable full functionality. Released on June 2, 2015, the desktop Broadwell processors saw limited market adoption, as rapidly transitioned to the Skylake architecture on shortly thereafter, resulting in low production volumes; however, their unlocked nature made them popular among enthusiasts for , with the i7-5775C capable of stable boosts beyond 4 GHz on .

Supported Chipsets

8-Series Chipsets

The Intel 8-series chipsets, codenamed Lynx Point, were introduced in the second quarter of 2013 as the primary platform companion to 4th-generation Core processors (Haswell) on the LGA 1150 socket. The lineup emphasized improved I/O capabilities over prior generations, including native USB 3.0 support via an integrated xHCI controller, up to 6 SATA 6 Gb/s ports for storage (with variations by variant), and a Direct Media Interface (DMI) 2.0 link providing 2 GB/s bidirectional bandwidth between the chipset and processor. These chipsets connect to the CPU through 8 PCIe 2.0 lanes configured as DMI 2.0 x4, enabling efficient data transfer for peripherals while the processor handles memory and primary PCIe lanes. Memory support is limited to DDR3 at speeds up to 1600 MHz across 4 DIMM slots in dual-channel configuration, with a maximum capacity of 32 GB using non-ECC modules. The Z87 served as the flagship variant, targeted at enthusiasts with full CPU capabilities, support for 0/1/5/10 configurations via , and up to 6 PCIe 2.0 root ports configurable for multi-GPU setups. Mid-range options like the H87 offered similar I/O expansion, including 6 6 Gb/s ports and 4 ports, but omitted and limited to levels 0/1/5. Budget-oriented B85 and H81 variants reduced features for cost efficiency: B85 supported 4 6 Gb/s ports (plus 2 at 3 Gb/s) and 4 ports with 0/1/5, while H81 was more restricted with 2 6 Gb/s ports (plus 2 at 3 Gb/s), 2 ports, and no support. Business-focused Q87 and Q85 chipsets prioritized stability and manageability, with Q87 providing 6 6 Gb/s ports, 6 ports, and full 0/1/5/10, alongside enhanced security features like Intel Stable Image Platform Program (SIPP). The Q85 mirrored B85 in I/O with 4 6 Gb/s ports (plus 2 at 3 Gb/s) and 4 ports but added business-oriented tools such as hardware-based remote management and no support. For server and workstation use, the C226 variant paired with E3 v3 processors, enabling ECC DDR3 memory support up to 32 GB, 6 6 Gb/s ports with 0/1/5/10, and additional I/O flexibility for enterprise environments. A key limitation across all 8-series variants was the lack of out-of-the-box compatibility with 5th-generation Core processors (Broadwell), requiring BIOS updates on select implementations that were not universally available or stable. Lower-tier chipsets like H81 and B85 also omitted advanced features such as native SATA RAID, relying instead on AHCI mode for basic storage needs.
VariantTarget MarketOverclockingSATA Ports (6 Gb/s)USB 3.0 PortsRAID LevelsPCIe Root Ports (Max)
Z87EnthusiastYes660, 1, 5, 10Up to 8 (x16 config)
H87MainstreamNo640, 1, 5Up to 8 (x16 config)
B85BusinessNo440, 1, 5Up to 8 (x16 config)
H81Entry-levelNo22NoneUp to 4 (x8 config)
Q87BusinessNo660, 1, 5, 10Up to 8 (x16 config)
Q85BusinessNo44NoneUp to 8 (x16 config)
C226Server/WorkstationNo640, 1, 5, 10Up to 8 (x16 config)

9-Series Chipsets

The 9-series chipsets were released in the second quarter of 2014 as an update to the LGA 1150 platform, primarily to support the unlocked "Devil's Canyon" refresh of Haswell processors and the upcoming Broadwell processors. These chipsets, built on the same PCH architecture as their 8-series predecessors, introduced enhancements focused on storage connectivity and capabilities, while maintaining with existing Haswell CPUs through updates. Key additions included native support for slots using PCIe lanes for higher-bandwidth SSDs and interfaces, enabling up to 10 Gb/s transfer rates—approximately 67% faster than standard 3.0—without requiring additional controllers on motherboards. Improved power delivery phases were also integrated in reference designs to better handle overclocked unlocked CPUs, reducing voltage droop under load. The primary variants included the enthusiast-oriented Z97 chipset and the mid-range H97 chipset. The Z97 supported full CPU for unlocked "" series processors, multi-GPU configurations like SLI or via flexible PCIe lane allocation (up to x16 for plus additional x4 for storage), and up to six 6 Gb/s ports alongside and . In contrast, the H97 provided similar storage and I/O features—such as 14 USB ports (including six ) and support for up to 32 GB of DDR3-1600 —but omitted CPU and limited PCIe to a single x16 slot, targeting non-enthusiast builds. Some manufacturers offered refreshed 8-series-based boards with support via updates, though these retained original limitations on . For server and workstation applications, introduced the C222 and C224 chipsets as vPro-enabled options, with the C224 emphasizing enterprise features like enhanced configurations (0, 1, 5, 10) across four 6 Gb/s ports and support for . Both were compatible with E3 v3 and v4 processors, offering up to 14 USB ports (four ) and integrated MAC for LAN, prioritizing stability and remote management over consumer-oriented . Native support for Broadwell processors required only a update on 9-series boards, ensuring seamless integration without hardware changes. Adoption of the 9-series was driven by its role in extending the LGA 1150 lifecycle, powering the Devil's Canyon launch in June 2014 and Broadwell desktop CPUs in early 2015, with premium implementations featuring 10 GbE LAN for high-speed networking. This marked the final major chipset evolution for the socket before the transition to with Skylake processors later in 2015.

Physical Design and Installation

Socket Mechanics

The LGA 1150 socket employs a (ZIF) design with an independent loading mechanism (ILM) featuring a load plate and to secure the processor without applying direct during insertion. To install a CPU, first raise the socket fully to unlock and open the load plate, exposing the socket contacts. Align the processor by matching its triangular Pin 1 indicator with the socket's corresponding mark and ensuring the CPU's corner notches fit over the socket's orientation keys or posts, then lower the CPU straight down into the socket without tilting, sliding, or forcing it. Gently close the load plate over the CPU and lower the until it locks, applying even pressure across the integrated (IHS) to ensure proper contact with the 1150 pins. No specialized tools are required for the CPU seating process itself, as the ILM lever operates manually by hand; however, a Phillips screwdriver may be needed for any motherboard-specific ILM retention screws during initial assembly, torqued to manufacturer specifications to prevent uneven loading. The socket's mechanical dimensions, including pin pitch and ILM frame size, support this alignment process as outlined in the broader mechanical design. For removal, reverse the installation by raising the to open the load plate, then lift the CPU vertically using its edges or IHS, avoiding contact with the underside lands. Always employ anti-static precautions, such as wrist straps or mats, to discharge potential electrostatic buildup before handling components. After removal, visually inspect the socket pins for bends or debris, as the LGA 1150 lacks native compatibility with PGA-style adapters that could otherwise risk further damage. Common issues during installation include misalignment of the CPU notches with socket keys, which can lead to incomplete seating, electrical , or bent pins that compromise connectivity. The ILM may also experience or breakage after repeated use, contributing to insecure seating over time. The socket is rated for a maximum of 20 insertion/removal cycles to maintain reliability. Safety during handling requires grounding oneself to avoid (ESD) that could damage sensitive pins or CPU lands; never touch the gold-plated contacts directly with bare hands or ungrounded tools.

Heatsink Compatibility

Heatsink retention for the LGA 1150 socket utilizes the Independent Loading Mechanism (ILM) frame for mounting points, employing a standard backplate with four threaded standoffs secured by shoulder screws and 6-32 fasteners. The ILM applies a static compressive load of 311–600 N (70–135 lbf) to seat the processor on the socket contacts, while the heatsink retention mechanism applies an additional static load of 0–222 N (0–50 lbf) on the processor's integrated (IHS) to ensure thermal interface contact. The backplate is a flat component, typically 1.8 mm thick for compatible designs, with torque specifications of 8–10 inch-pounds for the shoulder screws to ensure without damaging the socket or . Compatible heatsinks for LGA 1150 include aftermarket options such as the Noctua NH-U12S, which uses SecuFirm2 mounting clips for direct attachment to the ILM frame, and stock boxed coolers like the E97379 series, supporting design powers (TDPs) up to 95 via screw or push-pin mounts. Heatsink designs must adhere to a maximum mass of 500 g and a static load of 0–222 N (0–50 lbf) to prevent excessive pressure on the processor package. A thermal interface material (TIM), such as , is required between the heatsink base and the processor IHS to facilitate efficient , with the heatsink base needing a minimum contact area of 40 x 40 mm to fully cover the 37.5 x 37.5 mm IHS. Maximum operating temperatures are 100 °C for both Haswell and Broadwell processors to avoid thermal throttling or damage. Heatsinks feature clips or brackets tailored to the LGA 1150 ILM frame, and are generally directly compatible with due to identical mounting hole spacing. For beyond 4 GHz, liquid cooling solutions are recommended to manage increased output from unlocked processors, alongside ensuring adequate case to cool the integrated GPU on supported chips.

References

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  2. https://www.cpu-world.com/Sockets/Socket_1150_LGA1150_H3.html
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  15. https://www.techpowerup.com/199331/intel-finalizes-feature-sets-of-the-first-wave-of-9-series-chipsets
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  18. https://community.intel.com/t5/Processors/Broadwell-for-desktop-LGA1150-Series-8-chipset-support/td-p/405679
  19. https://ieeexplore.ieee.org/document/6762795
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  21. https://www.anandtech.com/show/8355/intel-broadwell-architecture-preview/2
  22. https://arstechnica.com/gadgets/2015/06/intel-launches-long-delayed-quad-core-broadwell-cpus-and-the-iris-pro-6200-gpu/
  23. https://www.intel.com/content/www/us/en/products/sku/88095/intel-core-i55675c-processor-4m-cache-up-to-3-60-ghz/specifications.html
  24. https://www.intel.com/content/www/us/en/products/sku/88046/intel-xeon-processor-e31285-v4-6m-cache-3-50-ghz/specifications.html
  25. https://www.anandtech.com/show/9320/intel-broadwell-review-i7-5775c-i5-5675c
  26. https://www.intel.com/content/www/us/en/products/sku/75013/intel-z87-chipset/specifications.html
  27. https://www.intel.com/content/www/us/en/products/sku/75019/intel-b85-chipset/specifications.html
  28. https://www.intel.com/content/www/us/en/products/sku/75522/intel-c226-chipset/specifications.html
  29. https://www.intel.com/content/www/us/en/products/sku/82012/intel-z97-chipset/specifications.html
  30. https://bit-tech.net/reviews/tech/motherboards/the-intel-9-series-chipsets-examined/2/
  31. https://www.velocitymicro.com/blog/intel-launches-z97-h97-processors-whats-difference/
  32. https://www.pugetsystems.com/labs/articles/z97-vs-h97-what-is-the-difference-562/
  33. https://www.kitguru.net/components/motherboard/anton-shilov/specs-and-highlights-of-intels-9-series-chipset-revealed/
  34. https://www.intel.com/content/www/us/en/products/sku/75516/intel-c222-chipset/specifications.html
  35. https://ark.intel.com/content/www/us/en/ark/products/82016/intel-c224-chipset.html
  36. https://gamersnexus.net/guides/1449-intel-broadwell-chipset-comparison-z97-h97
  37. https://www.gigabyte.com/us/Press/News/1281
  38. https://bit-tech.net/reviews/tech/motherboards/the-intel-9-series-chipsets-examined/1/
  39. https://www.intel.com/content/www/us/en/support/articles/000005762/processors.html
  40. https://www.intel.com/content/www/us/en/support/articles/000005597/processors.html
  41. https://noctua.at/en/compatibility/socket-overview
  42. https://www.ocinside.de/workshop_en/intel_lga1150_cpu_overclock/5/
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