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Indium gallium arsenide
Indium gallium arsenide
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Indium gallium arsenide (InGaAs) (alternatively gallium indium arsenide, GaInAs) is a ternary alloy (chemical compound) of indium arsenide (InAs) and gallium arsenide (GaAs). Indium and gallium are group III elements of the periodic table while arsenic is a group V element. Alloys made of these chemical groups are referred to as "III-V" compounds. InGaAs has properties intermediate between those of GaAs and InAs. InGaAs is a room-temperature semiconductor with applications in electronics and photonics.

The principal importance of GaInAs is its application as a high-speed, high sensitivity photodetector of choice for optical fiber telecommunications.[1]

Nomenclature

[edit]

Indium gallium arsenide (InGaAs) and gallium-indium arsenide (GaInAs) are used interchangeably. According to IUPAC standards[2] the preferred nomenclature for the alloy is GaxIn1-xAs where the group-III elements appear in order of increasing atomic number, as in the related alloy system AlxGa1-xAs. By far, the most important alloy composition from technological and commercial standpoints is Ga0.47In0.53As, which can be deposited in single crystal form on indium phosphide (InP).

Materials synthesis

[edit]

GaInAs is not a naturally occurring material. Single-crystal material is required for electronic and photonic device applications. Pearsall and co-workers were the first to describe single-crystal epitaxial growth of In0.53Ga0.47As on (111)-oriented [3] and on (100)-oriented [4] InP substrates. Single crystal material in thin-film form can be grown by epitaxy from the liquid-phase (LPE), vapour-phase (VPE), by molecular beam epitaxy (MBE), and by metalorganic chemical vapour deposition (MO-CVD).[5] Today, most commercial devices are produced by MO-CVD or by MBE.

The optical and mechanical properties of InGaAs can be varied by changing the ratio of InAs and GaAs, In
1-x
Ga
x
As
.[6] Most InGaAs devices are grown on indium phosphide (InP) substrates. In order to match the lattice constant of InP and avoid mechanical strain, In
0.53
Ga
0.47
As
is used. This composition has an optical absorption edge at 0.75 eV, corresponding to a cut-off wavelength of λ=1.68 μm at 295 K.

By increasing the mole fraction of InAs further compared to GaAs, it is possible to extend the cut-off wavelength up to about λ=2.6 μm. In that case special measures have to be taken to avoid mechanical strain from differences in lattice constants.

GaAs is lattice-mismatched to germanium (Ge) by 0.08%. With the addition of 1.5% InAs to the alloy, In0.015Ga0.985As becomes latticed-matched to the Ge substrate, reducing stress in subsequent deposition of GaAs.

Electronic and optical properties

[edit]
Fig.1 Energy gap versus gallium composition for GaInAs

InGaAs has a lattice parameter that increases linearly with the concentration of InAs in the alloy.[7] The liquid-solid phase diagram[3] shows that during solidification from a solution containing GaAs and InAs, GaAs is taken up at a much higher rate than InAs, depleting the solution of GaAs. During growth from solution, the composition of first material to solidify is rich in GaAs while the last material to solidify is richer in InAs. This feature has been exploited to produce ingots of InGaAs with graded composition along the length of the ingot. However, the strain introduced by the changing lattice constant causes the ingot to be polycrystalline and limits the characterization to a few parameters, such as bandgap and lattice constant with uncertainty due to the continuous compositional grading in these samples.

Fig.2 Lattice parameter of GaInAs vs GaAs alloy content
Fig.3 Photoluminescence of n-type and p-type GaInAs[8]

Properties of single crystal GaInAs

[edit]

Single crystal GaInAs

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Single crystal epitaxial films of GaInAs can be deposited on a single crystal substrate of III-V semiconductor having a lattice parameter close to that of the specific gallium indium arsenide alloy to be synthesized. Three substrates can be used: GaAs, InAs and InP. A good match between the lattice constants of the film and substrate is required to maintain single crystal properties and this limitation permits small variations in composition on the order of a few percent. Therefore, the properties of epitaxial films of GaInAs alloys grown on GaAs are very similar to GaAs and those grown on InAs are very similar to InAs, because lattice mismatch strain does not generally permit significant deviation of the composition from the pure binary substrate.

Ga
0.47
In
0.53
As
is the alloy whose lattice parameter matches that of InP at 295 K. GaInAs lattice-matched to InP is a semiconductor with properties quite different from GaAs, InAs or InP. It has an energy band gap of 0.75 eV, an electron effective mass of 0.041 and an electron mobility close to 10,000 cm2·V−1·s−1 at room temperature, all of which are more favorable for many electronic and photonic device applications when compared to GaAs, InP or even Si.[1] Measurements of the band gap and electron mobility of single-crystal GaInAs were first published by Takeda and co-workers.[9]

Property Value at 295 K Reference
Lattice Parameter 5.869 Å [4]
Band Gap 0.75 eV [9]
Electron effective mass 0.041 [10]
Light-hole effective mass 0.051 [11]
Electron mobility 10,000 cm2·V−1·s−1 [12]
Hole mobility 250 cm2·V−1·s−1 [12]

FCC lattice parameter

[edit]

Like most materials, the lattice parameter of GaInAs is a function of temperature. The measured coefficient of thermal expansion [13] is 5.66×10−6 K−1. This is significantly larger than the coefficient for InP which is 4.56×10−6 K−1. A film that is exactly lattice-matched to InP at room temperature is typically grown at 650 °C with a lattice mismatch of +6.5×10−4. Such a film has a mole fraction of GaAs = 0.47. To obtain lattice matching at the growth temperature, it is necessary to increase the GaAs mole fraction to 0.48.

Bandgap energy

[edit]

The bandgap energy of GaInAs can be determined from the peak in the photoluminescence spectrum, provided that the total impurity and defect concentration is less than 5×1016 cm−3. The bandgap energy depends on temperature and increases as the temperature decreases, as can be seen in Fig. 3 for both n-type and p-type samples. The bandgap energy at room temperature for standard InGaAs/InP (53% InAs, 47% GaAs), is 0.75 eV and lies between that of Ge and Si. By coincidence the bandgap of GaInAs is perfectly placed for photodetector and laser applications for the long-wavelength transmission window, (the C-band and L-band) for fiber-optic communications.

Effective mass

[edit]

The electron effective mass of GaInAs m*/m° = 0.041 [10] is the smallest for any semiconductor material with an energy bandgap greater than 0.5 eV. The effective mass is determined from the curvature of the energy-momentum relationship: stronger curvature translates into lower effective mass and a larger radius of delocalization. In practical terms, a low effective mass leads directly to high carrier mobility, favoring higher speed of transport and current carrying capacity. A lower carrier effective mass also favors increased tunneling current, a direct result of delocalization.

The valence band has two types of charge carriers: light holes: m*/m° = 0.051 [11] and heavy holes: m*/m° = 0.2.[14] The electrical and optical properties of the valence band are dominated by the heavy holes, because the density of these states is much greater than that for light holes. This is also reflected in the mobility of holes at 295 K, which is a factor of 40 lower than that for electrons.

Fig.4 Electron and hole mobilities of GaInAs vs impurity concentration at 295 K.[12]

Mobility of electrons and holes

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Electron mobility and hole mobility are key parameters for design and performance of electronic devices. Takeda and co-workers were the first to measure electron mobility in epitaxial films of InGaAs on InP substrates.[9] Measured carrier mobilities for electrons and holes are shown in Figure 4.

The mobility of carriers in Ga
0.47
In
0.53
As
is unusual in two regards:

  • The very high value of electron mobility
  • The unusually large ratio of electron to hole mobility.

The room temperature electron mobility for reasonably pure samples of Ga
0.47
In
0.53
As
approaches 10×103 cm2·V−1·s−1, which is the largest of any technologically important semiconductor, although significantly less than that for graphene.

The mobility is proportional to the carrier conductivity. As mobility increases, so does the current-carrying capacity of transistors. A higher mobility shortens the response time of photodetectors. A larger mobility reduces series resistance, and this improves device efficiency and reduces noise and power consumption.

The minority carrier diffusion constant is directly proportional to carrier mobility. The room temperature diffusion constant for electrons at 250 cm2·s−1 is significantly larger than that of Si, GaAs, Ge or InP, and determines the ultra-fast response of Ga
0.47
In
0.53
As
photodetectors.

The ratio of electron to hole mobility is the largest of currently used semiconductors.

Applications

[edit]
Fig.5 upper: Ge photodiode lower: GaInAs photodiode in the wavelength range 1 μm to 2 μm.[15]

Photodetectors

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The principal application of GaInAs is as an infrared detector. The spectral response of a GaInAs photodiode is shown in Figure 5. GaInAs photodiodes are the preferred choice in the wavelength range of 1.1 μm < λ < 1.7 μm. For example, compared to photodiodes made from Ge, GaInAs photodiodes have faster time response, higher quantum efficiency and lower dark current for the same sensor area.[16] GaInAs photodiodes were invented in 1977 by Pearsall.[17]

Avalanche photodiodes offer the advantage of additional gain at the expense of response time. These devices are especially useful for detection of single photons in applications such as quantum key distribution where response time is not critical. Avalanche photodetectors require a special structure to reduce reverse leakage current due to tunnelling. The first practical avalanche photodiodes were designed and demonstrated in 1979.[18]

In 1980, Pearsall developed a photodiode design that exploits the uniquely short diffusion time of high mobility of electrons in GaInAs, leading to an ultrafast response time.[19][20] This structure was further developed and subsequently named the UTC, or uni-travelling carrier photodiode.[21] In 1989, Wey and co-workers[22] designed and demonstrated a p-i-n GaInAs/InP photodiodes with a response time shorter than 5 picoseconds for a detector surface measuring 5 μm x 5 μm.

Other important innovations include the integrated photodiode – FET receiver[23] and the engineering of GaInAs focal-plane arrays.[24]

Lasers

[edit]

Semiconductor lasers are an important application for GaInAs, following photodetectors. GaInAs can be used as a laser medium. Devices have been constructed that operate at wavelengths of 905 nm, 980 nm, 1060 nm, and 1300 nm. InGaAs quantum dots on GaAs have also been studied as lasers.[25] GaInAs/InAlAs quantum-well lasers can be tuned to operate at the λ = 1500 nm low-loss, low-dispersion window for optical fiber telecommunications [26] In 1994, GaInAs/AlInAs quantum wells were used by Jérôme Faist and co-workers[27] who invented and demonstrated a new kind of semiconductor laser based on photon emission by an electron making an optical transition between subbands in the quantum well. They showed that the photon emission regions can be cascaded in series, creating the quantum cascade laser (QCL). The energy of photon emission is a fraction of the bandgap energy. For example, GaInAs/AlInAs QCL operates at room temperature in the wavelength range 3 μm < λ < 8 μm. The wavelength can be changed by modifying the width of the GaInAs quantum well.[28] These lasers are widely used for chemical sensing and pollution control.

Photovoltaics and transistors

[edit]

GaInAs is used in triple-junction photovoltaics and also for thermophotovoltaic power generation.[29]

In
0.015
Ga
0.985
As
can be used as an intermediate band-gap junction in multi-junction photovoltaic cells with a perfect lattice match to Ge. The perfect lattice match to Ge reduces defect density, improving cell efficiency.[citation needed]

HEMT devices using InGaAs channels are one of the fastest types of transistor[30][citation needed]

In 2012 MIT researchers announced the smallest transistor ever built from a material other than silicon.[31] The Metal oxide semiconductor field-effect transistor (MOSFET) is 22 nanometers long. This is a promising accomplishment, but more work is needed to show that the reduced size results in improved electronic performance relative to that of silicon or GaAs-based transistors.

In 2014, Researchers at Penn State University developed a novel device prototype designed to test nanowires made of compound semiconductors such as InGaAs.[32] The goal of this device was to see if a compound material would retain its superior mobility at nanoscale dimensions in a FinFET device configuration. The results of this test sparked more research, by the same research team, into transistors made of InGaAs which showed that in terms of on current at lower supply voltage, InGaAs performed very well compared to existing silicon devices.

In Feb 2015 Intel indicated it may use InGaAs for its 7 nanometer CMOS process in 2017.[33]

Safety and toxicity

[edit]

The synthesis of GaInAs, like that of GaAs, most often involves the use of arsine (AsH
3
), an extremely toxic gas. Synthesis of InP likewise most often involves phosphine (PH
3
). Inhalation of these gases neutralizes oxygen absorption by the bloodstream and can be fatal within a few minutes if toxic dose levels are exceeded. Safe handling involves using a sensitive toxic gas detection system and self-contained breathing apparatus.[34]

Once GaInAs is deposited as a thin film on a substrate, it is basically inert and is resistant to abrasion, sublimation or dissolution by common solvents such as water, alcohols or acetones. In device form the volume of the GaInAs is usually less than 1000 μm3, and can be neglected compared to the volume of the supporting substrate, InP or GaAs.

The National Institutes of Health studied these materials and found:[35]

  • No evidence of carcinogenic activity of gallium arsenide in male F344/N rats exposed to 0.01, 0.1, or 1.0 mg/m3
  • Carcinogenic activity in female F344/N rats
  • No evidence of carcinogenic activity in male or female B6C3F1 mice exposed to 0.1, 0.5, or 1.0 mg/m3.

The World Health Organization's International Agency for Research on Cancer's review of the NIH toxicology study concluded:[36]

  • There is inadequate evidence in humans for the carcinogenicity of gallium arsenide.
  • There is limited evidence in experimental animals for the carcinogenicity of gallium arsenide.
  • The gallium moiety may be responsible for lung cancers observed in female rats

REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) is a European initiative to classify and regulate materials that are used, or produced (even as waste) in manufacturing. REACH considers three toxic classes: carcinogenic, reproductive, and mutagenic capacities.

The REACH classification procedure consists of two basic phases. In phase one the hazards intrinsic to the material are determined, without any consideration of how the material might be used or encountered in the work place or by a consumer. In phase two the risk of harmful exposure is considered along with procedures that can mitigate exposure. Both GaAs and InP are in phase 1 evaluation. The principal exposure risk occurs during substrate preparation where grinding and polishing generate micron-size particles of GaAs and InP. Similar concerns apply to wafer dicing to make individual devices. This particle dust can be absorbed by breathing or ingestion. The increased ratio of surface area to volume for such particles increases their chemical reactivity.

Toxicology studies are based on rat and mice experiments. No comparable studies test the effects of ingesting GaAs or InP dust in a liquid slurry.

The REACH procedure, acting under the precautionary principle, interprets "inadequate evidence for carcenogenicity" as "possible carcinogen". As a result, the European Chemicals Agency classified InP in 2010 as a carcinogen and reproductive toxin:[37]

  • Classification & labelling in accordance with Directive 67/548/EEC
  • Classification: Carc. Cat. 2; R45
  • Repr. Cat. 3; R62

and ECHA classified GaAs in 2010 as a carcinogen and reproductive toxin:

  • Classification & labelling in accordance with Directive 67/548/EEC:
  • Classification3: Carc. Cat. 1; R45
  • Repro. Cat. 2; R60

See also

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References

[edit]
[edit]
Revisions and contributorsEdit on WikipediaRead on Wikipedia
from Grokipedia
Indium gallium arsenide (InGaAs), with the general formula InxGa1xAs\text{In}_x\text{Ga}_{1-x}\text{As}, is a ternary III-V compound semiconductor alloy composed of indium, gallium, and arsenic, where the indium content xx typically varies between 0 and 1 to tune its properties for specific applications. The most commonly used composition is In0.53Ga0.47As\text{In}_{0.53}\text{Ga}_{0.47}\text{As}, which is lattice-matched to indium phosphide (InP) substrates with a lattice constant of approximately 5.869 Å, enabling high-quality epitaxial growth. This material exhibits a zinc-blende crystal structure and is a direct bandgap semiconductor with a room-temperature bandgap energy of about 0.75 eV for the In0.53Ga0.47As\text{In}_{0.53}\text{Ga}_{0.47}\text{As} variant, allowing efficient optical emission and absorption in the near-infrared range of 1.2–2.0 μm. InGaAs is renowned for its superior electronic properties compared to or (GaAs), including high exceeding 12,000 cm²/V·s at and low effective , which facilitate high-speed charge transport. These attributes, combined with its thermal stability and compatibility with advanced fabrication techniques like (MBE) and metalorganic chemical vapor deposition (MOCVD), make InGaAs ideal for next-generation devices. Relative to GaAs (bandgap 1.42 eV, electron mobility ~8,500 cm²/V·s), InGaAs offers a narrower bandgap and higher mobility, enhancing performance in low-power, high-frequency applications, though it requires careful strain management when grown on mismatched substrates like GaAs. Key applications of InGaAs span and high-speed electronics, including photodetectors, laser diodes, and modulators for communications operating at wavelengths around 1.55 μm. It is also employed in high-electron-mobility transistors (HEMTs) for and millimeter-wave devices, as well as in photovoltaic and thermophotovoltaic solar cells due to its efficient carrier collection and compatibility with multi-junction architectures. Emerging uses include structures for imaging and advanced transistors in beyond-CMOS computing, leveraging its tunable bandgap and high injection velocity.

Fundamentals

Nomenclature and Composition

Indium gallium arsenide (InGaAs), also referred to as gallium indium arsenide (GaInAs), is a ternary III-V semiconductor alloy formed by combining indium arsenide (InAs) and gallium arsenide (GaAs). The notations InGaAs and GaInAs are used interchangeably in the literature to denote this material, reflecting its compositional variability. The formulas \Inx\Ga1x\As\In_x \Ga_{1-x} \As and \Gax\In1x\As\Ga_x \In_{1-x} \As are both common, where xx specifies the mole fraction of indium or gallium, respectively, enabling precise description of the alloy's stoichiometry. The composition of \Inx\Ga1x\As\In_x \Ga_{1-x} \As can be systematically varied by adjusting xx between 0 (pure InAs) and 1 (pure GaAs), yielding intermediate properties that bridge the characteristics of the binary endpoints. For example, the direct bandgap energy at decreases nonlinearly from 1.42 eV for GaAs (x=1x = 1) to 0.35 eV for InAs (x=0x = 0) as the content increases. This tunability arises from the alloy's behavior, with the bandgap dependence on xx enabling tailored optoelectronic responses. A technologically significant composition is \In0.53\Ga0.47\As\In_{0.53}\Ga_{0.47}\As, which achieves lattice matching to InP substrates for defect-free epitaxial layers. The nomenclature and compositional framework for InGaAs emerged from early 1970s research on ternary III-V , driven by efforts to understand phase equilibria and enable controlled synthesis. Seminal studies, such as those examining thermodynamic phase diagrams, laid the groundwork for specifying compositions and predicting solid-liquid equilibria during growth.

Crystal Structure

Indium gallium arsenide (InGaAs), denoted as \Inx\Ga1x\As\In_x\Ga_{1-x}\As, crystallizes in the zincblende structure, which represents the thermodynamically stable phase for single-crystal forms of this ternary III-V . This cubic structure consists of a face-centered cubic (FCC) sublattice of gallium and indium cations tetrahedrally coordinated to an interpenetrating FCC sublattice of anions, characteristic of many zincblende III-V compounds. The lattice parameter of InGaAs approximately follows Vegard's law, exhibiting nearly linear variation with indium composition xx according to the relation a(x)=5.653+0.405xa(x) = 5.653 + 0.405x Å at room temperature, where a(0)=5.653a(0) = 5.653 Å corresponds to pure GaAs and a(1)=6.058a(1) = 6.058 Å to pure InAs. This interpolation provides a reliable estimate for the pseudomorphic lattice constant across the alloy range, enabling precise control in heterostructure design, though small deviations from linearity have been observed. Despite its structural versatility, InGaAs possesses a significant at low temperatures (below approximately 543 °C), promoting into indium-rich and gallium-rich domains during bulk due to thermodynamic instability. This inhomogeneity compromises uniformity in bulk materials, whereas epitaxial deposition at elevated temperatures or under non-equilibrium conditions suppresses the gap, yielding homogeneous thin films essential for device applications. In crystalline InGaAs, prevalent defects such as threading dislocations and antiphase boundaries arise primarily from lattice mismatch during epitaxial growth on foreign substrates, leading to degraded material quality through increased carrier and recombination centers. These imperfections, often threading from the interface, can propagate into the active layers, thereby limiting and optical efficiency in fabricated devices. Advanced growth strategies, including buffer layers, are employed to mitigate their density and preserve high-quality .

Synthesis

Growth Techniques

Indium gallium arsenide (InGaAs) thin films are primarily synthesized through epitaxial growth techniques to achieve high-quality layers with controlled composition and minimal defects, enabling applications in and high-speed electronics. These methods involve depositing material in a layer-by-layer fashion on a crystalline substrate, often InP for lattice matching. Early techniques like liquid phase epitaxy (LPE) and vapor phase epitaxy (VPE) laid the foundation, while modern approaches such as (MBE) and metalorganic chemical vapor deposition (MOCVD) offer superior precision and scalability. Liquid phase epitaxy (LPE) was one of the earliest methods for growing InGaAs, utilizing a saturated melt of , , and typically at temperatures around 600–700°C to deposit thick layers on InP substrates. This technique involves sliding the substrate under a molten solution in a horizontal or vertical furnace, allowing supersaturation-driven precipitation of InGaAs with composition controlled by the melt to achieve lattice matching, such as In0.53Ga0.47As. LPE is suitable for thicker films (several micrometers) due to its high growth rates (up to 10 μm/h), but it suffers from limited uniformity across large areas and challenges in abrupt interface formation, making it less ideal for complex heterostructures. Improvements using rare-earth gettering agents, like or , have enhanced purity by reducing impurities during growth, yielding layers with low carrier concentrations below 1015 cm-3. Vapor phase epitaxy (VPE), particularly the variant developed in the 1970s, marked an initial advancement for InGaAs synthesis using chloride-based like GaCl, InCl, and AsH3 in a carrier gas at and temperatures of 600–650°C. This open-tube process enables growth rates of 1–5 μm/h and was pivotal for early demonstrations of lattice-matched InGaAs on (100) InP substrates, with optimized GaCl flows ensuring the desired In0.53Ga0.47As composition. VPE provided better control over doping compared to LPE but was limited by precursor purity and scalability issues, often resulting in higher defect densities in thicker layers. Molecular beam epitaxy (MBE) emerged as a ultrahigh-vacuum technique (base pressure ~10-10 ) for precise InGaAs growth, employing effusion cells to evaporate elemental , , and (or As2/As4) beams onto heated substrates (typically 450–500°C) at rates of 0.1–1 per second. This method allows atomic-layer precision in composition and thickness, ideal for quantum wells and superlattices, with in-situ monitoring via reflection high-energy (RHEED) ensuring smooth interfaces. MBE-grown InGaAs on InP exhibits low defect densities (below 106 cm-2) and sharp lines, supporting high-performance devices. Post-2010 optimizations, including low-temperature growth (≤250°C) using migration-enhanced variants, have minimized point defects like arsenic antisites by reducing indium segregation, achieving improved carrier mobilities over 10,000 cm2/V·s in strained layers. Metalorganic chemical vapor deposition (MOCVD), also known as MOVPE, is the most widely adopted commercial technique for InGaAs production, involving of metalorganic precursors such as trimethylindium (TMIn), trimethylgallium (TMGa), and (AsH3) in a reactor at 600–700°C and pressures of 20–100 . Growth rates of 0.5–2 μm/h enable scalable wafer-scale production (up to 8 inches), with precise composition control via precursor flow ratios for lattice-matched films on InP. MOCVD yields highly uniform layers with low unintentional doping (n-type ~1015 cm-3) and is favored for its compatibility with doping and multilayer integration, though it requires careful management of precursor toxicity and carbon incorporation.

Substrates and Lattice Matching

Indium gallium arsenide (InGaAs) epitaxial layers are commonly grown on (InP) substrates to achieve lattice matching, as InP has a of 5.869 at , which closely matches the In0.53Ga0.47As composition with a of approximately 5.868 , resulting in a mismatch of less than 0.3%. This low mismatch enables the growth of high-quality, defect-free layers suitable for optoelectronic devices. For applications requiring strained layers, (GaAs) substrates are used, with a of 5.65 , allowing compressive strain in InGaAs films with higher indium content. InAs substrates, featuring a of 6.058 , support growth of high-indium-content InGaAs for extended applications. Lattice matching is quantified by the mismatch parameter ff, defined as f=aInGaAsasubasubf = \frac{a_{\text{InGaAs}} - a_{\text{sub}}}{a_{\text{sub}}} where asuba_{\text{sub}} is the substrate and aInGaAsa_{\text{InGaAs}} is that of the InGaAs layer; the absolute value of this is minimized to prevent the formation of dislocations that degrade material quality. In pseudomorphic growth on mismatched substrates like GaAs, the epitaxial layer remains coherently strained up to a critical thickness typically 10–20 nm for layers with approximately 20% content, beyond which misfit dislocations form to relieve strain. To accommodate larger mismatches in heterostructures, graded composition buffers are employed, where the indium content is gradually varied to transition the lattice constant from the substrate to the target InGaAs layer, distributing dislocations and reducing threading defect densities. These buffers enable metamorphic growth on non-native substrates while maintaining low defect levels. Commercial production of InGaAs on InP has scaled to 6-inch wafers using metalorganic chemical vapor deposition (MOCVD) as of the , with 4-inch wafers common since the early , facilitating large-area device fabrication.

Physical Properties

Structural Properties

Single-crystal indium gallium arsenide (InGaAs), specifically the lattice-matched composition In0.53_{0.53}Ga0.47_{0.47}As, has a measured lattice parameter of 5.8687 at 300 K, as determined by diffraction. This value aligns with the zincblende structure's expected dimensions for this ternary alloy. The material density is approximately 5.50 g/cm³ for the standard In0.53_{0.53}Ga0.47_{0.47}As composition at 300 K, with minor variations (on the order of 0.01–0.1 g/cm³) arising from changes in the indium mole fraction xx. The linear thermal expansion coefficient of InGaAs is 5.66 × 106^{-6} K1^{-1} at 300 K, exceeding that of (2.6 × 106^{-6} K1^{-1}) and influencing strain management in heterostructure devices. In high- layers grown by (MBE), structural perfection is evidenced by rocking curve full-width at half-maximum (FWHM) values as low as 20 arcsec, indicating minimal mosaicity and tilt. Threading dislocation densities in such lattice-matched MBE-grown InGaAs on InP substrates are typically below 106^{6} cm2^{-2}, reflecting effective preservation of substrate quality during epitaxial growth.

Electronic Properties

Indium gallium arsenide (InxGa1-xAs) is a direct bandgap III-V whose electronic properties are highly tunable with the indium x. The bandgap energy at 300 K follows the quadratic relation Eg(x) = 1.424 - 1.534x + 0.475x2 eV, as compiled in the comprehensive review of band parameters for III-V compounds. For the composition lattice-matched to InP substrates (x ≈ 0.53), the bandgap is Eg = 0.75 eV, enabling applications in near-infrared . This direct bandgap structure supports efficient radiative recombination, with the valence band maximum and conduction band minimum both at the Γ-point of the . The temperature dependence of the bandgap is characterized by a decrease of approximately 4 × 10-4 eV/K, arising from electron-phonon interactions and lattice expansion effects. Carrier transport in InGaAs is dominated by due to their low effective and high mobility. The conduction band electron effective is me = 0.041 m0 for x = 0.53, where m0 is the free electron , reflecting the small of the Γ-valley dispersion. In the valence band, the heavy- effective is mhh = 0.41 m0, while the light- effective is mlh* = 0.051 m0, leading to anisotropic . In undoped epitaxial films, room-temperature electron mobility reaches up to 12,000 cm²/V·s, attributed to reduced impurity and phonon-limited , whereas mobility is around 500 cm²/V·s due to stronger intervalley and higher effective . Doping control is essential for tailoring carrier concentrations in InGaAs devices. N-type doping is commonly achieved with group VI (Te) or group IV (Si) impurities, which substitute on the group III sublattice and provide shallow donor levels near the conduction band edge. P-type doping uses group II acceptors like Zn, which occupy group III sites and introduce levels approximately 20-30 meV above the valence band. However, III-V surfaces, including InGaAs, exhibit strong pinning, typically 0.5-0.6 eV below the conduction band minimum, due to from dangling bonds and reconstruction, complicating ohmic contacts without passivation.

Optical Properties

Indium gallium arsenide (InGaAs), particularly the lattice-matched composition In0.53Ga0.47As, exhibits strong optical absorption above its bandgap due to interband transitions. The absorption coefficient α exceeds 104 cm-1 for energies greater than the bandgap, enabling efficient harvesting in the near-infrared region. For this composition, the cutoff λg, corresponding to the bandgap , is approximately 1.65 μm, defining the long-wavelength limit for absorption. The of InGaAs is around 3.5 at wavelengths such as 1.55 μm, with values varying slightly with composition (e.g., n ≈ 3.58 for x=0.53). Dispersion in the can be modeled using the , which accounts for the material's response across the near- to mid-infrared spectrum. in InP-matched InGaAs alloys occurs at in the range of approximately 1.3–1.55 μm, depending on strain and quantum confinement effects in heterostructures, making it suitable for fiber-optic applications. The binding energy in InGaAs is on the order of 10 meV, influencing radiative recombination processes. This contributes to high quantum efficiencies exceeding 80% in short-wave (SWIR) detectors utilizing InGaAs as the absorbing material. Nonlinear optical effects, such as , become significant in InGaAs under high-intensity illumination, with relevance for power-handling limits in photonic devices.

Applications

Photodetectors and Imaging

Indium gallium arsenide (InGaAs) is widely employed in photodetectors due to its high quantum efficiency and sensitivity in the short-wave (SWIR) range, particularly from 0.9 to 1.7 μm, enabling applications in , sensing, and . PIN photodiodes based on InGaAs offer high responsivity exceeding 0.9 A/W at 1.55 μm, with bandwidths surpassing 40 GHz, making them essential for high-speed fiber optic receivers in systems. These devices achieve low dark currents, typically below 1 nA, and exhibit cutoff frequencies suitable for gigabit-per-second data rates in optical networks. Avalanche photodiodes (APDs) incorporating InGaAs provide internal gain greater than 100, enhancing sensitivity for weak signals in telecom applications, while maintaining a low under 3 dB through optimized multiplication layers. In these structures, the excess factor remains controlled at around 2.3 for gains up to 20, supporting high bit-rate optical receivers with reduced impact. The mechanism in InGaAs APDs leverages the material's low excess characteristics, achieving bandwidth-gain products over 100 GHz for 1.55 μm operation. For imaging, InGaAs focal plane arrays (FPAs) enable high-resolution SWIR cameras, such as 640×512 configurations with quantum efficiencies exceeding 70% across key wavelengths like 850 nm and 1.55 μm. These arrays support applications in , where SWIR reflectance from ambient sources aids low-light detection, and in for material identification through molecular absorption bands. operability often reaches over 99.5%, with readout integrated circuits enabling snapshot imaging at video rates. Recent advancements in the 2020s include monolithic integration of InGaAs photodetectors with CMOS platforms, demonstrated on 300 mm wafers to enable hybrid photonic-electronic circuits with reduced parasitics. For extended SWIR (eSWIR) detection, strained InGaAs layers in dot-in-a-well (DWELL) structures extend sensitivity up to 2.5 μm, using graded buffers on InP substrates to minimize defects and achieve cutoffs beyond standard InGaAs limits. The adoption of InGaAs-based photodetectors in industrial imaging has grown significantly, with market projections indicating a of 12.81% for InGaAs imaging systems from 2025 to 2030.

Lasers and Emitters

Indium gallium arsenide (InGaAs) plays a crucial role in lasers and emitters, particularly for near- and mid-infrared applications, due to its tunable bandgap and compatibility with InP substrates for lattice matching. These devices leverage InGaAs quantum wells or dots to achieve efficient electron-hole recombination and , enabling high-performance light sources for and sensing. InGaAs/InP lasers are prominent for emissions in the 1.3–1.55 μm telecom window, where compressively strained InGaAs active regions reduce threshold currents and enhance performance. These structures typically feature multiple s sandwiched between InP barriers, supporting continuous-wave operation at with threshold current densities below 200 A/cm², as demonstrated in ridge waveguide designs achieving less than 380 A/cm² for 5 μm-wide devices. Seminal work on strained-layer InGaAs/InP multiple lasers has shown reduced threshold current densities compared to unstrained counterparts, enabling high output powers and narrow spectral linewidths suitable for fiber-optic systems. Vertical-cavity surface-emitting lasers (VCSELs) based on InGaAs quantum wells serve as compact, low-power sources for telecom applications, offering circular output beams and easy integration into arrays. InGaAs/GaAs VCSELs at 1.3 μm deliver output powers exceeding 1 mW at elevated temperatures up to 85°C, with single-mode operation and modulation bandwidths up to 8 GHz at . These devices often incorporate InGaAsN for extended wavelength coverage, achieving 1 mW output in oxide-confined structures with 5 μm apertures. Quantum dot emitters using InAs/InGaAs structures provide broadband emission through size and composition variations in self-assembled dots, ideal for superluminescent diodes and multi-wavelength lasers. InAs quantum dots embedded in InGaAs strain-reducing layers on GaAs substrates yield emission linewidths below 50 nm across the 1.0–1.3 μm range, with photoluminescence bandwidths up to 90 nm in optimized dots-in-a-well configurations for enhanced spectral coverage. Chirped InAs/InGaAs quantum dot stacks further broaden the emission spectrum while maintaining high quantum efficiency. Integration of InGaAs-based lasers with unitraveling-carrier (UTC) photodiodes enables compact photonic integrated circuits for high-speed and . Evanescently coupled InGaAs/InP UTC photodiodes monolithically integrated with InGaAs lasers support bandwidths over 30 Gb/s at zero bias, reducing power consumption and in telecom PICs. Recent advancements in quantum cascade lasers (QCLs) utilize InGaAs as injector or barrier regions in InGaAs/AlInAs/InP heterostructures for mid-infrared emission around 3–6 μm, benefiting from improved gain and lower losses. Post-2020 designs with high-strain InGaAs wells and AlInAs barriers have achieved continuous-wave powers up to 5.6 W at 4.9 μm, with wall-plug efficiencies exceeding 10% at , enhancing applications in and sensing.

Transistors and Electronics

Indium gallium arsenide (InGaAs) is widely utilized in high-speed transistors due to its superior electron transport properties, enabling performance beyond traditional silicon-based devices in radio-frequency (RF) applications. High-electron-mobility transistors (HEMTs) employing an InGaAs channel and InAlAs barriers form the core of these structures, leveraging the high electron mobility in the InGaAs layer confined by the wide-bandgap InAlAs barriers to achieve cutoff frequencies (f_T) exceeding 500 GHz. These HEMTs are particularly valued in RF amplifiers for wireless communication and radar systems, where their ability to operate at millimeter-wave frequencies supports high data rates and low power dissipation. Pseudomorphic HEMTs (pHEMTs), which incorporate strained InGaAs channels grown on InP substrates, further enhance noise performance critical for sensitive receiver circuits. The strain in the InGaAs layer increases electron velocity and reduces scattering, resulting in minimum noise figures below 1.2 dB at frequencies approaching 100 GHz, such as 1.2 dB at 94 GHz. This low noise characteristic, combined with associated gains over 10 dB, makes pHEMTs essential for low-noise amplifiers in satellite and infrastructure, where at high frequencies is paramount. Integration of InGaAs transistors with silicon complementary metal-oxide-semiconductor () technology addresses compatibility challenges for hybrid systems, initially through hybrid bonding techniques demonstrated in for III-V channels on large-scale Si substrates. Early efforts, such as Intel's exploration of III-V enhancements for CMOS nodes around 7-14 nm, utilized to combine InGaAs high-mobility channels with Si logic, enabling heterogeneous integration for improved speed in mixed-signal circuits. By the , advancements shifted toward monolithic approaches, including direct epitaxial growth of InGaAs on Si via metamorphic buffers, reducing interface defects and supporting scalable fabrication on 300 mm wafers for cost-effective production. In logic applications, InGaAs offers potential for beyond-Moore scaling through its electron mobility over 10 times that of , allowing higher drive currents and faster switching in n-channel metal-oxide-semiconductor field-effect transistors (MOSFETs). However, challenges persist in p-type performance, where the lower mobility in InGaAs—stemming from its conduction-band-dominated transport—limits complementary logic efficiency compared to n-type devices, necessitating hybrid n/p architectures or alternative materials for p-channels. This high n-mobility, linked to a low effective as explored in electronic properties, positions InGaAs MOSFETs as candidates for ultra-low-power logic in future computing paradigms. Recent research from 2023 to 2025 has advanced InGaAs field-effect transistors (FETs) for , exploiting their one-dimensional structure for bendable high-performance devices. These enable gate-all-around configurations that mitigate short-channel effects, achieving enhanced suitable for wearable sensors and conformable circuits on non-rigid substrates. Pristine InGaAs nanowires have demonstrated potential in integrated optoelectronic synapses, with applications extending to mechanically robust FETs for next-generation flexible systems.

Photovoltaics

Indium gallium arsenide (InGaAs) plays a significant role in applications due to its tunable bandgap, typically around 0.75 eV for the lattice-matched composition In0.53Ga0.47As\mathrm{In}_{0.53}\mathrm{Ga}_{0.47}\mathrm{As}, which allows efficient absorption of photons. In single-junction solar cells, In0.53Ga0.47As\mathrm{In}_{0.53}\mathrm{Ga}_{0.47}\mathrm{As} devices have demonstrated power conversion efficiencies ranging from 9.3% to 12.9% under the AM1.5 spectrum at , limited by its narrow absorption range but optimized through multi-dimensional design parameters such as doping profiles and layer thicknesses. This composition's bandgap is particularly suited for integration as a bottom subcell in tandem configurations, where it complements wider-bandgap materials to broaden the spectral response and approach higher overall efficiencies in multi-junction stacks. In multi-junction solar cells, InGaAs is commonly employed in triple-junction architectures such as InGaP/GaAs/InGaAs, lattice-matched to GaAs substrates for improved crystal quality and reduced defects. These structures, optimized for applications due to their radiation tolerance and high specific power, have achieved efficiencies exceeding 30% under AM0 conditions, with records up to 37.9% under AM1.5G illumination (as of May 2025) in thin, Ge-free designs. The InGaAs subcell contributes to current matching across the junctions, enabling robust performance in concentrated sunlight or orbital environments. For thermophotovoltaic (TPV) systems, InGaAs subcells support operation at emitter temperatures above 1000°C, converting from high-temperature sources like concentrated solar or into with minimal bandgap mismatch. Record single-junction InGaAs TPV cells have reached efficiencies over 20% under blackbody spectra at these temperatures, benefiting from enhanced photon recycling and low non-radiative recombination. Dilute variants, such as InGaAsN with a 1 eV bandgap, extend this capability in four-junction cells by providing better lattice compatibility with GaAs-based upper junctions, contributing to record efficiencies of 47.6% under concentrated illumination in 2022 developments. Recent advancements include flexible thin-film InGaAs-based , integrated into lightweight modules for wearable and portable applications. Triple-junction GaInP/GaAs/InGaAs cells on flexible substrates have demonstrated high specific power (>1000 W/kg) with encapsulation that maintains efficiency under bending, enabling integration into textiles or drones as of 2022-2024 prototypes. These developments prioritize mechanical durability alongside photovoltaic performance for emerging energy-harvesting scenarios.

Safety and Environmental Impact

Toxicity and Health Risks

Indium gallium arsenide (InGaAs), like (GaAs), contains , which contributes to its potential hazards, primarily through of or particles during or . The International Agency for Research on Cancer (IARC) classifies GaAs as a carcinogen to humans, based on sufficient evidence of carcinogenicity in experimental animals and strong mechanistic evidence linking its content to genotoxicity and tumor promotion. InGaAs shares similar risks due to its component, with of fine particles posing a primary exposure route that can lead to pulmonary inflammation and fibrosis. During synthesis, such as metalorganic vapor phase epitaxy (MOVPE), InGaAs production involves highly toxic precursor gases like (AsH₃), which is used to supply . is a potent hemolytic agent, causing rapid destruction of red blood cells and subsequent renal failure; its acute is evidenced by an LC50 of approximately 45 ppm (4-hour exposure) in rats. (PH₃), sometimes employed in related processes for (InP) substrates or quaternary alloys like InGaAsP, exhibits comparable , inducing and respiratory distress with an LC50 around 11 ppm (4-hour exposure) in rats. Animal studies provide insight into InGaAs's systemic effects, drawing parallels from GaAs research due to compositional similarity. In a 2-year study by the National Program (NTP, 2000), GaAs exposure showed clear evidence of carcinogenic activity in female F344/N rats (increased alveolar/bronchiolar neoplasms) and some evidence in male rats (increased bronchiolar adenomas), but no evidence in male or female B6C3F1 mice; additional non-neoplastic effects included and pulmonary lesions. No epidemiological data exist specifically for InGaAs in humans, though limited studies on GaAs workers suggest potential respiratory and reproductive risks without conclusive carcinogenicity. In fabricated devices, InGaAs thin films are generally inert and pose minimal direct exposure risk under normal use, as they are encapsulated and stable. However, gallium ions released from processing or degradation may cause skin irritation, including characterized by redness and blistering upon prolonged exposure. Recent regulatory assessments under the EU REACH framework classify GaAs and related compounds as reprotoxic category 1B (H360D: may damage the unborn child), based on developmental toxicity observed in rodent studies, with InGaAs alloys subject to analogous labeling due to shared and components.

Environmental Impact

Manufacturing and disposal of InGaAs can lead to environmental contamination primarily from , , and release. Semiconductor production processes, such as (CMP), generate containing elevated levels of these elements, which can pollute and soil. Studies have detected and in near sites, classifying them as emerging contaminants due to their persistence and potential in aquatic ecosystems. from InGaAs waste poses risks to , similar to other compounds, potentially affecting microbial communities and entering the . Recycling efforts for e-waste containing InGaAs are increasing to mitigate these impacts, though challenges remain in separating and recovering the metals efficiently.

Handling and Regulations

In laboratories and industrial settings, indium gallium arsenide (InGaAs) handling protocols emphasize containment to minimize exposure risks from its components, particularly . Powders and solid forms are processed in inert glove boxes under controlled atmospheres, such as with oxygen and levels below 0.1 ppm, to prevent oxidation and airborne dispersion during weighing, breaking, or loading operations. For metalorganic (MOCVD) synthesis, which often involves (AsH₃) precursors, exhaust ventilation systems with high-efficiency particulate air () filters are mandatory, incorporating real-time monitoring capable of detecting AsH₃ concentrations below 0.05 ppm to ensure compliance with exposure limits. Waste generated from InGaAs production, such as slurries from polishing or etching processes, is classified as hazardous under the U.S. (RCRA) due to its content exceeding toxicity thresholds (e.g., via the ). Disposal requires specialized methods, including high-temperature incineration to achieve destruction and removal efficiencies of at least 99.99% for principal organic constituents or stabilization/solidification using agents like or polymers to immobilize before landfilling. Occupational exposure limits for arsine, a key byproduct in InGaAs processing, are set by the (OSHA) at a (PEL) of 0.05 ppm as an 8-hour time-weighted average, with engineering controls and required to maintain levels below this threshold. The National Institute for Occupational Safety and Health (NIOSH) recommends a stricter 15-minute of 0.002 mg/m³ for chronic exposure scenarios, classifying arsine as a potential occupational . Internationally, the Restriction of Hazardous Substances (RoHS) Directive provides exemptions for optoelectronic applications incorporating III-V compound semiconductors like InGaAs, such as in photodetectors and lasers, where alternatives are not yet viable (e.g., exemptions under III for specific lead uses in related components). Transboundary shipments of InGaAs-containing wastes fall under the , which mandates prior procedures, detailed manifests, and environmentally sound management to prevent export to non-consenting parties, treating arsenic-rich semiconductor wastes as hazardous ( VIII categories). In 2025, updates to the Classification, Labelling and Packaging ( (via Proposal COM(2025)531) introduce digital labeling options and extended compliance deadlines for certain requirements, including aspects related to . These protocols collectively address the toxicity of while ensuring regulatory adherence.

References

  1. https://ntrs.[nasa](/page/NASA).gov/api/citations/20050223577/downloads/20050223577.pdf
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