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Centrino
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Centrino was a brand name of Intel Corporation which represented its Wi-Fi and WiMAX wireless computer networking adapters. The brand name was first used by the company as a platform-marketing initiative. The change of the meaning of the brand name occurred on January 7, 2010.[1]: 1 The Centrino name for laptops was replaced by the Ultrabook.
The old platform-marketing brand name covered a particular combination of mainboard chipset, mobile CPU and wireless network interface in the design of a laptop. Intel claimed that systems equipped with these technologies delivered better performance, longer battery life and broader wireless network interoperability than non-Centrino systems.
The product line name for Intel wireless products became Intel Centrino Wireless in 2010.[2] The Centrino brand was ultimately discontinued in 2013.
Intel Centrino
[edit]| Wireless LAN | Chipset | Centrino | Processor | Codename | Release Date | Manufacturing
Technology |
Microarchitecture |
| Intel Wireless Products |
800 Series | Carmel | Intel Pentium M | Banias | 2003 | 130 nm | Intel P6 |
| Dothan | 2004 | 90 nm | |||||
| 900 Series | Sonoma | 2005 | |||||
| Napa | Intel Core Solo/Duo | Yonah | 2006 | 65 nm | |||
| Intel Core 2 Duo/Solo | Merom | Intel Core | |||||
| Santa Rosa | Intel Core 2 Solo/Duo | 2007 | |||||
| Penryn | 2008 | 45 nm | |||||
| 4 Series | Montevina | ||||||
| 5 Series | Calpella | Intel Core i7/i7 Extreme Edition | Clarksfield | 2009 | Intel Nehalem | ||
| Intel Core i3/i5/i7 | Arrandale | 2010 | 32 nm | ||||
| 6 Series | Huron River | Intel Core i3/i5/i7/i7 Extreme Edition | Sandy Bridge | 2011 | Intel Sandy Bridge | ||
| 7 Series | Chief River | Intel Core i3/i5/i7/i7 Extreme Edition | Ivy Bridge | 2012 | 22 nm | ||
| 8 Series | Shark Bay | Intel Core i3/i5/i7/i7 Extreme Edition | Haswell | 2013 | Intel Haswell | ||
| 9 Series | Crescent Bay | Intel Core M/i3/i5/i7 | Broadwell | 2014 | 14 nm | ||
| 100 Series | Sunrise Point | Intel Core m3/m5/m7/i3/i5/i7 | Skylake | 2015 | Intel Skylake | ||
| 200 Series | Union Point | Intel Core m3/i3/i5/i7 | Kaby Lake | 2016 |
Notebook implementations
[edit]Carmel platform (2003)
[edit]Intel used "Carmel" as the codename for the first-generation Centrino platform, introduced in March 2003.
| Centrino | Carmel platform |
|---|---|
| Mobile chipset | an Intel Mobile 855 Express series chipset (codenamed Odem or Montara with Intel Extreme Graphics 2), including ICH4M southbridge. |
| Mobile processor | Processors - Socket 479 |
| Wireless network | an Intel PRO/Wireless 2100B (codenamed Calexico) or later 2200BG mini-PCI Wi-Fi adapter (codenamed Calexico2). |
Industry-watchers initially criticized the Carmel platform for its lack of support for IEEE 802.11g, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's announcement. In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino laptops.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for laptops to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed laptop manufacturers to create thinner and lighter laptops because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform (2005)
[edit]Intel used Sonoma as the codename for the second-generation Centrino platform, introduced in January 2005.
| Centrino | Sonoma platform |
|---|---|
| Mobile chipset | an Intel Mobile 915 Express series chipset (codenamed Alviso with Intel GMA 900), including ICH6M southbridge. |
| Mobile processor | Processors - Socket 479
|
| Wireless network | an Intel PRO/Wireless 2200BG or 2915ABG mini-PCI Wi-Fi adapter (both codenamed Calexico2). |
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes laptops built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma laptops typically achieve between 3.5–4.6 hours of battery-life on a 53 W-h battery.
Napa platform (2006)
[edit]The codename Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27, 2006 onwards.
| Centrino | Napa platform |
|---|---|
| Mobile chipset | an Intel Mobile 945 Express series chipset (codenamed Calistoga with Intel GMA 950), including ICH7M southbridge. |
| Mobile processor | Processors - Socket M / Micro-FCBGA
|
| Wireless network | an Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (codenamed Golan).
|
Intel uses Centrino Duo branding for laptops with dual-core Core Duo processors and retains the Centrino name for laptops with single core (Core Solo) processors. Some of the initial Core Duo laptops are still labeled as Intel Centrino rather than Centrino Duo.
Santa Rosa platform (2007)
[edit]The codename Santa Rosa refers to the fourth-generation Centrino platform, which was released on May 10, 2007.
| Centrino | Santa Rosa platform |
|---|---|
| Mobile chipset | an Intel Mobile 965 Express series chipset (codenamed Crestline): GM965 with Intel GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization.
|
| Mobile processor | Processors - Socket P / Socket M / Micro-FCBGA
|
| Wireless network | an Intel WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (codenamed Kedron).
|
The Santa Rosa platform comes with dynamic acceleration technology, allowing single threaded applications to execute faster. When a single threaded application is running, the CPU can turn off one of its cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Santa Rosa performs well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks.[8] Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.
The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (codenamed Windigo) co-developed with Nokia.[9][10] After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but was later delayed until Montevina in 2008.[9]
It is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and "Centrino Duo" when they are not used.[11]
Montevina platform (2008)
[edit]The codename Montevina refers to the fifth-generation Centrino platform, now formally named Centrino 2 to avoid confusion with previous Centrino platforms. It was scheduled for release at Computex Taipei 2008, which took place on June 3–7, 2008,[12] but was delayed until July 15, due to problems with integrated graphics and wireless certification.[13]
| Centrino | Montevina platform |
|---|---|
| Mobile chipset | an Intel Mobile Express series 4 chipset (codenamed Cantiga; GL40, GS45, GM45, PM45) with Intel GMA X4500 graphics technology and ICH9M southbridge, 1066 MT/s (667 MT/s for GL40) FSB. The GM45/GS45 graphics core is clocked at 533 MHz and 400 MHz for GL40, which contains ten unified shaders, up from the eight provided by GMA X3100.
|
| Mobile processor | Processors - Socket P / Socket M / Micro-FCBGA
|
| Wireless network | Wireless Modules
|
It is branded as "Centrino 2 vPro" when combined with built-in security and manageability features technologies.
Calpella platform (2009)
[edit]The codename Calpella refers to the sixth-generation Centrino platform. Though originally scheduled to premiere in Q3 2009 with the second iteration of Nehalem processors,[15] Intel had stated that due to pressure from computer manufacturers, they would delay the release of the platform until at least October 2009 (Q4 2009) to allow OEM partners to clear excess inventory of existing chips. This was believed to be spurred by the lowered demand due to unfavorable economic conditions throughout 2009.[16]
| Centrino | Calpella platform |
|---|---|
| Mobile chipset | an Intel Mobile Express Series 5 chipset (PCHM codenamed Ibex Peak) with Intel HD Graphics technology that will allow for optimized decoding/encoding and editing/playback of H.264/MPEG-4 AVC video used in Blu-ray Discs and HD 1080p video, optimized for MPEG-2 (DVD) video playback and editing.
|
| Mobile processor | Processors, based on Intel Nehalem microarchitecture[17]
|
| Wireless network | Wireless Modules[18]
|
Huron River platform (2011)
[edit]The codename Huron River refers to the seventh-generation Centrino platform.
| Centrino | Huron River platform |
|---|---|
| Mobile chipset | an Intel Mobile Express Series 6 chipset (PCHM codenamed Cougar Point[19]).
|
| Mobile processor | Processors, based on Intel Sandy Bridge microarchitecture |
| Wireless network | Wireless Modules
|
Chief River platform (2012)
[edit]The codename Chief River refers to the eighth-generation Centrino platform.
| Centrino | Chief River platform |
|---|---|
| Mobile chipset | an Intel Mobile Express Series 7 chipset (PCHM codenamed Panther Point )
|
| Mobile processor | Processors, based on Intel Ivy Bridge microarchitecture |
| Wireless network | Wireless Modules
|
Shark Bay platform (2013)
[edit]The codename Shark Bay refers to the ninth-generation Centrino platform.
| Centrino | Shark Bay platform |
|---|---|
| Mobile chipset | an Intel Mobile Express Series 8 chipset (PCHM codenamed Lynx Point)
|
| Mobile processor | Processors, based on Intel Haswell microarchitecture |
| Wireless network | Wireless Modules Wilkins Peak |
Jon Worrel predicted in 2012 that Shark Bay would comprise a single Multi-Chip Module (MCM) package.[27]
Mobile Internet Device
[edit]Menlow platform (2008)
[edit]On March 2, 2008, Intel introduced the Intel Atom processor brand[28] for a new family of low-power processor platforms. The components have thin, small designs and work together to "enable the best mobile computing and Internet experience" on mobile and low-power devices.
Intel's second generation MID platform (codenamed Menlow) contains a 45 nm Intel Atom processor (codenamed Silverthorne) which can run up to 2.0 GHz and a System Controller Hub (codenamed Poulsbo) which includes Intel HD Audio (codenamed Azalia).
| Centrino | Menlow platform |
|---|---|
| Mobile chipset | an Intel SCH (codenamed Poulsbo) with integrated GMA 500 graphics (PowerVR SGX 535 based) |
| Mobile processor | a 45 nm Intel Atom CPU (codenamed Silverthorne) |
| Wireless network | a wireless radio |
This platform was initially branded as Centrino Atom but the logo was dropped in August 2008; the logo had caused confusion between laptop and MID with previous marketing of Centrino stating only Intel chipsets are being used. Hence MIDs will be branded as Atom to allow integration with other OEM chipsets for the low-end market.[29][30]
Intel Centrino Wireless
[edit]
Intel Centrino Wireless was the brand for Intel Wi-Fi and WiMAX adapters from 2010 to 2013. The product line included:
- Intel Centrino Wireless-N 1000
- Intel Centrino Advanced-N 6200
- Intel Centrino Ultimate-N 6300
- Intel Centrino Advanced-N + WiMAX 6250
Centrino with Intel vPro technology
[edit]Laptops with Intel vPro technology have hardware features that allow a system administrator to remotely access wired and wireless laptops for maintenance and servicing if the operating system is unresponsive or crashed and, when a laptop is connected to AC power (not on battery power), allow a sys-admin to remotely access the laptop when the system is asleep or laptop power is off. It is targeted more for businesses than consumers.[31]
- Centrino laptop with Intel vPro technology (Santa Rosa platform)
- Centrino 2 laptop with Intel vPro technology (Montevina platform)
Security technologies
[edit]Laptops with vPro have the typical dual-core or quad-core processor and wireless features of the Centrino family.
- The vPro technology built into the chipset adds management, security, and remote-deployment features for: monitoring laptops (protected event logs, access to BIOS settings, out-of-band alerting, protected data storage), maintaining and updating systems (access to protected system information, remote power up, console redirection), repairing systems (remote boot, console redirection, preboot access to BIOS settings, protected events logs), and securing systems (remote power up, hardware filters for network traffic, agent presence checks/triggers, out-of-band alerting).
- The 45 nm Centrino 2 package is based on the Penryn microprocessor and Q47/Q45 chipset. It includes a better graphics engine (integrated) than Centrino, and three key additional features: Transport Layer Security (TLS) secured communications over an open local area network (LAN) for wired laptops outside the corporate firewall (not supported for wireless states), support for Microsoft Network Access Protection (NAP), and support for out-of-band management and security features in Sx (all sleep states) when the laptop is inside the corporate firewall.
See also
[edit]References
[edit]- ^ "Second-Generation Intel® Centrino TM Mobile Technology" (PDF). Intel Technology Journal. 9 (1). February 17, 2005. doi:10.1535/itj.0901. ISSN 1535-864X.
- ^ Connect with Intel® Centrino® Processor Technology
- ^ Intel dumbs down dual Santa Rosa cores with IDA - The INQUIRER, archived from the original on 2013-01-12
- ^ Intel 965 Express Chipset Family Datasheet - For the Intel 82Q965, 82Q963, 82G965 Graphics and Memory Controller Hub (GMCH) and Intel 82P965 Memory Controller Hub (MCH)
- ^ Intel Santa Rosa Does Not Support DDR2-800
- ^ Flynn, Laurie J. (2007-09-18), "Intel Previews a New Family of Power-Saving Chips", The New York Times, retrieved 2010-04-28
- ^ Rickwood, Lee, Intel Unveils Next Gen Processor, PCWorld.ca, archived from the original on 2007-05-24, retrieved 2007-05-09
- ^ Santa Rosa Revealed, TrustedReviews
- ^ a b Intel Wireless Connectivity Roadmap, The Register
- ^ Intel, NextGen feature Nokia chip, CNET
- ^ Santa Rosa officially dubbed Centrino Pro, Engadget
- ^ Kim, Arnold (2008-02-18), Intel Processors and Platform (Montevina) Due in June 2008, MacRumors.com
- ^ Kircos, Bill (2008-05-28), Intel Delays Next-Generation Centrino Chipset, pcmag.com
- ^ Tony Smith (2006-10-11), Intel to follow 'Santa Rosa' Centrino with 'Montevina', The Register, archived from the original on 2008-10-07, retrieved 2006-10-19
- ^ Intel to launch Calpella notebook platform in 3Q09, digitimes.com, 2008-08-05
- ^ Notebook vendors looking for delay of Intel's Calpella platform, digitimes.com, 2009-01-05
- ^ CPU list, archived from the original on 2012-03-01
- ^ Intel：不會再有Centrino 3平台 Centrino品牌被降格成網絡模組品牌, 電腦領域 HKEPC Hardware, 2009-08-05, archived from the original on 2009-08-06
- ^ Chipset list, archived from the original on 2011-07-12
- ^ Intel® Centrino® Ultimate-N 6300 Intel webpage, March 2011
- ^ Intel® Centrino® Advanced–N + WiMAX 6250 Intel webpage, March 2011
- ^ Intel® Centrino® Advanced-N 6205 Intel webpage, March 2011
- ^ Intel® Centrino® Advanced-N 6230 Intel webpage, March 2011
- ^ Intel® Centrino® Advanced-N + WiMAX 6150 Intel webpage, March 2011
- ^ Intel® Centrino® Wireless-N 1030 Intel webpage, March 2011
- ^ Intel® Centrino® Wireless-N 1000 Intel webpage, March 2011
- ^
Worrel, Jon (2012-04-15). "Intel migrates to desktop Multi-Chip Modules (MCMs) with 14nm Broadwell". Retrieved 2016-05-19.
The platform is called "Shark Bay" for notebooks and ultrabooks, and it will consist of a single Multi-Chip Module (MCM) package fully integrating the PCH from previous generation 22nm Ivy Bridge (2012) directly into the same die as the 22nm Haswell (2013) CPU.
- ^ Intel Announces Intel Atom Brand for New Family of Low-Power Processors
- ^ Intel Centrino Atom logo being dropped, archived from the original on 2008-08-17
- ^ Intel Drops Centrino Atom Brand After Five Months - Business Center - PC World
- ^ Intel Centrino 2 with vPro technology and Intel Core2 processor with vPro technology (PDF), Intel, retrieved 2008-08-07
External links
[edit]Centrino
View on Grokipediafrom Grokipedia
Overview
Definition and Branding
Intel Centrino is a trademarked platform brand developed by Intel Corporation for mobile computing devices, specifically certifying notebooks that integrate designated Intel processors, chipsets, and wireless networking components to deliver optimized performance, extended battery life, and seamless wireless connectivity.[1] This certification ensures that only systems meeting Intel's validation criteria for interoperability and efficiency can bear the Centrino logo, distinguishing them from devices using mismatched or non-Intel parts.[1] Launched on March 12, 2003, Centrino addressed the growing demands of mobile users for reliable wireless access in an era of expanding Wi-Fi infrastructure, enabling thinner, lighter notebooks with up to five hours of battery life during wireless use.[1][6] The branding strategy marked a departure for Intel, as Centrino was the company's first unified platform brand combining microprocessor, chipset, and 802.11 wireless networking technologies under a single magenta-colored logo featuring the Intel Inside mark and a stylized wing symbolizing mobility and forward progress.[7] This approach differentiated Centrino from standalone Intel products like individual processors or wireless adapters by emphasizing the holistic benefits of Intel-validated integration, such as enhanced power management and reduced weight in OEM designs.[7] Over time, the branding evolved to encompass subsequent generations, maintaining the logo's core elements while adapting to new platform architectures, always requiring OEM adherence to Intel's specifications for logo usage.[7] To achieve Centrino certification, original equipment manufacturers (OEMs) must incorporate the specified Intel CPU, chipset, and wireless adapter—such as the initial Pentium M processor, 855 chipset family, and PRO/Wireless 2100 module—and pass Intel's testing for compatibility, performance, and wireless functionality.[1] This process includes the Wireless Verification Program, which tests system integration with access points, software, and hotspots to ensure broad connectivity, with Intel aiming to validate over 10,000 hotspots by the end of 2003.[1] Only certified systems qualify for the full Centrino branding, reinforcing Intel's commitment to a standardized mobile ecosystem.[1]Historical Context and Evolution
Prior to the introduction of Centrino, Intel's mobile computing efforts in the late 1990s relied on processors like the Pentium III-M, which provided foundational performance for laptops but operated in an era of fragmented wireless integration. Emerging standards such as IEEE 802.11 were available, yet wireless connectivity typically required separate add-on cards or incompatible chipsets from various vendors, resulting in inconsistent battery life, limited range, and compatibility issues that hindered seamless mobile internet access.[8] Intel launched Centrino mobile technology on March 12, 2003, integrating the Pentium M processor, the 855 chipset family, and the PRO/Wireless 2100 network adapter to create a validated platform optimized for Wi-Fi connectivity and power efficiency. This unified approach addressed prior integration challenges, spurring widespread Wi-Fi adoption among consumers and significantly boosting laptop sales; for instance, strong demand for Centrino-based notebooks contributed to Intel's second-quarter 2003 revenue of $6.8 billion, an 8% increase year-over-year, largely driven by mobile processor shipments.[6][9][10] The Centrino brand evolved from its initial Wi-Fi-centric focus to encompass multi-core architectures and advanced power management, fostering the development of more efficient mobile ecosystems through subsequent generations. In June 2009, Intel announced the phase-out of Centrino as a platform branding for personal computers effective 2010, redirecting the name to wireless components only while transitioning to the broader Intel Core family, including Core i3, i5, and i7 designations. This shift marked the end of Centrino's role as a distinct mobile platform by the early 2010s, with its concepts integrated into later initiatives like the Intel Evo platform in the 2020s, which emphasizes verified performance, battery life, and connectivity in premium laptops.[11]Core Components
Processors and Chipsets
The Centrino platform relied on a series of mobile-optimized processors and chipsets designed to balance performance, power efficiency, and integration for notebook computers. These components evolved from single-core architectures to multi-core designs, incorporating advanced power management and memory support to enable prolonged battery life and wireless connectivity. Key to this was Intel's Enhanced Intel SpeedStep Technology, introduced with early processors, which dynamically adjusts voltage and frequency based on workload to reduce power consumption by up to 20 times compared to fixed-speed operation. The inaugural processor family for Centrino was the Pentium M, based on the Banias core, launched in 2003 with clock speeds up to 1.7 GHz and a thermal design power (TDP) of 24 W. Built on a 130 nm process, it featured a 1 MB L2 cache and 400 MHz front-side bus (FSB), prioritizing low power over high clock rates for mobile use. This was paired with the Intel 855 chipset family (also known as Carmel), which included integrated Intel Graphics Media Accelerator 900 (GMA 900) for basic 2D/3D acceleration and support for DDR SDRAM up to 1 GB at 400 MHz. The i855 enabled early PCI Express lanes for peripherals, though limited to x1 configurations, facilitating the platform's focus on wireless integration without discrete graphics demands.[12][13] Subsequent updates refined this foundation. The Dothan-core Pentium M in 2004 increased L2 cache to 2 MB and FSB to 533 MHz with TDP of 24-27 W, integrated with the i915 Express chipset (Sonoma platform) that upgraded to DDR2 memory support up to 2 GB at 533 MHz and introduced full PCI Express x16 for graphics. The i915's GMA 900 provided improved video decode capabilities, enhancing multimedia playback efficiency. By 2006, the shift to dual-core began with the Yonah-based Core Duo processors on the Napa platform, offering 1.66-2.33 GHz speeds, 2 MB shared L2 cache, 667 MHz FSB, and 31 W TDP on a 65 nm process. These worked with the i945 Express chipset (Alviso), which supported dual-channel DDR2 up to 4 GB at 667 MHz and PCI Express x16, enabling better bandwidth for integrated Intel GMA 950 graphics that doubled pixel processing rates over prior generations.[12][14][15] Advancements continued with the Merom-based Core 2 Duo in 2007 (Santa Rosa platform), scaling to 2.33 GHz, 4 MB L2 cache, 800 MHz FSB, and 35 W TDP on 65 nm, introducing 64-bit support and SSE4 instructions for enhanced media processing. Paired with the GM965 (Mobile Intel 965 Express) chipset, it offered DDR2 up to 8 GB at 800 MHz, PCI Express 1.0 x16, and Intel GMA X3100 graphics with 500 MHz core clock and up to 384 MB shared memory, supporting DirectX 9 and hardware video acceleration via Intel Clear Video Technology. The chipset's power management features, like Display Power Saving Technology (DPST) 3.0, complemented the processor's SpeedStep and deeper sleep states to extend battery life.[16][12] The 2008 Montevina platform (Centrino 2) introduced the 45 nm Penryn Core 2 Duo processors, with speeds up to 3.06 GHz, 6 MB L2 cache, 1066 MHz FSB, and TDP options from 6 W (ultra-low voltage) to 35 W, adding SSE4.1 for improved efficiency. These integrated with the PM45 and related Series 4 chipsets, supporting DDR3 up to 8 GB at 1066 MHz, PCI Express 2.0, and GMA X4500MHD graphics capable of DirectX 10 and hardware HD decoding. Chipset innovations like dynamic bus frequency switching allowed the FSB to drop to 200 MHz during idle, reducing power draw by up to 20%. Following Montevina, the full Centrino platform branding was phased out in 2009, with the name retained for wireless components until discontinuation in 2013.[17][18][4][5]| Generation | Processor Family | Key Specs | Chipset | Memory/PCIe Support | Graphics | TDP Range |
|---|---|---|---|---|---|---|
| Carmel (2003) | Pentium M (Banias) | 1.3-1.7 GHz, 1 MB L2 | i855 | DDR up to 1 GB, PCIe x1 | GMA 900 | 24 W |
| Sonoma (2004) | Pentium M (Dothan) | 1.3-2.26 GHz, 2 MB L2 | i915 | DDR2 up to 2 GB, PCIe x16 | GMA 900 | 24-27 W |
| Napa (2006) | Core Duo (Yonah) | 1.66-2.33 GHz, 2 MB L2 shared | i945 | DDR2 up to 4 GB, PCIe x16 | GMA 950 | 31 W |
| Santa Rosa (2007) | Core 2 Duo (Merom) | 1.66-2.33 GHz, 4 MB L2 | GM965 | DDR2 up to 8 GB, PCIe x16 | GMA X3100 | 35 W |
| Montevina (2008) | Core 2 Duo (Penryn) | 1.06-3.06 GHz, 6 MB L2 | PM45 | DDR3 up to 8 GB, PCIe 2.0 x16 | GMA X4500MHD | 6-35 W |
Wireless Networking Integration
The Intel Centrino platform required specific wireless adapters for certification, beginning with the Intel PRO/Wireless 2100 and 2200 series introduced in 2003 and 2004, respectively, which supported IEEE 802.11b and 802.11b/g standards operating in the 2.4 GHz band at data rates up to 54 Mbps.[19][20] These Mini-PCI adapters were designed for notebook integration, emphasizing compatibility with the platform's power management features to extend battery life during wireless use.[1] Over time, Centrino's wireless capabilities advanced to support faster standards, with the introduction of the Intel WiFi Link 4965 AGN in 2006 enabling IEEE 802.11n (Wi-Fi 4) compatibility, delivering up to 300 Mbps throughput through dual-band operation (2.4 GHz and 5 GHz) and multiple-input multiple-output (MIMO) technology.[21] Wireless evolution under the Centrino brand ended with 802.11n support, as seen in the Intel Centrino Wireless-N 100 series, with shipments discontinued on December 31, 2013.[22][5] Bluetooth integration complemented Wi-Fi from the outset, starting with version 1.2 in 2003 for basic personal area networking and coexistence with 802.11b, and progressing to version 4.0 by 2012, which introduced low-energy profiles for reduced power consumption in peripherals like mice and headsets.[1] Centrino certification mandated adherence to minimum performance thresholds, including sustained throughput aligned with the supported standards (e.g., 54 Mbps for 802.11g and 300 Mbps for 802.11n), effective range up to 100 meters indoors for initial adapters evolving to improved coverage via beamforming in later models, and security via WPA2 with AES encryption to ensure robust protection against unauthorized access.[22][23] Additionally, power-saving modes such as those in IEEE 802.11n and Wi-Fi Direct were required, enabling direct device-to-device connections while minimizing energy use through adaptive transmit power and sleep states.[24]Notebook Platform Generations
Banias-Based Platforms (2003-2005)
The inaugural Centrino platforms, codenamed Carmel and launched in March 2003, marked Intel's first integrated mobile computing solution designed specifically for wireless notebook PCs. This platform combined the Pentium M processor (Banias core) operating at clock speeds from 1.3 GHz to 1.7 GHz, the Intel 855 chipset family (including variants like 855PM and 855GM), and the Intel PRO/Wireless 2100 network connection supporting 802.11b standards, with compatibility for 802.11g upgrades. The Carmel design emphasized power efficiency through features such as a 400 MHz front-side bus, 1 MB on-die L2 cache, and Enhanced SpeedStep technology, enabling the first full certification of an Intel-branded platform for optimized wireless performance and battery conservation.[1][25] Succeeding Carmel, the Sonoma platform—introduced in late 2004 and fully launched in January 2005—built upon this foundation with enhancements for broader multimedia and storage capabilities. It featured upgraded Pentium M processors (Dothan core) reaching speeds up to 2.0 GHz on a 533 MHz front-side bus, paired with the Mobile Intel 915 Express chipset family (such as i915PM and i915GM), which introduced dual-channel DDR2 memory support up to 2 GB and Native Command Queuing (NCQ) for improved serial ATA storage performance. Wireless integration advanced to the Intel PRO/Wireless 2200BG or 2915ABG adapters, providing native 802.11b/g connectivity along with enhanced security via 802.11i. These updates allowed Sonoma-based systems to handle accelerated graphics through PCI Express interfaces and integrated Intel Graphics Media Accelerator 900, while maintaining focus on thermal and power management.[26] Performance evaluations highlighted substantial gains in battery life and efficiency, with Carmel and Sonoma platforms delivering up to 7 hours of usage on standard batteries—roughly double the 3-4 hours typical of prior Pentium 4-M systems—due to integrated optimizations reducing power draw by over 50% in comparable workloads. Market reception was strong, as major OEMs like Dell and HP rapidly adopted these platforms, shipping millions of certified notebooks that boosted wireless adoption and solidified Centrino's role in mobile computing. However, limitations persisted, including the absence of 64-bit computing support in the 32-bit-only Pentium M architecture and reliance on external AGP 4x interfaces for discrete graphics acceleration in non-integrated configurations.[27]Core Duo-Based Platforms (2006-2007)
The Core Duo-based platforms marked a significant evolution in Intel's Centrino lineup, introducing dual-core processing to mobile computing for the first time, which enabled substantial gains in multitasking and overall efficiency while maintaining the emphasis on wireless connectivity and extended battery life. Launched in early 2006, the Napa platform, branded as Intel Centrino Duo mobile technology, integrated the Intel Core Duo processor family (codenamed Yonah) operating at clock speeds from 1.66 GHz to 2.0 GHz, paired with the Mobile Intel 945 Express chipset (i945PM) and the Intel PRO/Wireless 3945ABG network adapter supporting 802.11a/b/g standards. This configuration represented the first 64-bit capable mobile platform from Intel, leveraging EM64T extensions for enhanced addressable memory and future-proofing applications. The dual-core architecture of the Core Duo processor delivered up to a 70% performance uplift over the preceding single-core Sonoma platform, with particular improvements in multitasking scenarios—often achieving 2-3 times faster execution in parallel workloads compared to the Banias-based Pentium M processors—while adhering to a 31W TDP and incorporating advanced thermal throttling for sustained operation under load. Building on Napa's foundation, the Santa Rosa platform arrived in mid-2007 as an update to Centrino Duo, incorporating the Intel Core 2 Duo processor (codenamed Merom) with speeds ranging from 1.8 GHz to 2.6 GHz, the Mobile Intel 965 Express chipset (GM965), and the Intel WiFi Link 4965AGN adapter for draft 802.11n wireless connectivity. Santa Rosa introduced support for Intel Viiv technology, enabling richer media experiences through features like enhanced video decoding and content sharing, alongside HDMI 1.2 output with HDCP compliance for high-definition connectivity. The platform maintained a 35W TDP for standard models, with refined power management that improved thermal efficiency over prior generations, allowing for more consistent performance without excessive heat buildup. Relative to Banias-era systems, these advancements translated to 2-3x better multitasking throughput in productivity and multimedia tasks, driven by the Core 2 Duo's improved microarchitecture and 800 MHz front-side bus. These platforms saw widespread adoption in business-oriented laptops from manufacturers like Dell and Lenovo, where the combination of dual-core performance, robust wireless integration, and power efficiency extended real-world battery life to over 8 hours in optimized configurations—such as Dell's Latitude series achieving up to 9.4 hours under mixed workloads. This era solidified Centrino's role in enterprise mobility, powering a surge in notebook shipments as professionals benefited from seamless multitasking without compromising portability or connectivity.Penryn-Based Platforms (2008)
The Penryn-based platforms, branded as Intel Centrino 2 and codenamed Montevina, represented the 2008 evolution of Intel's mobile computing initiative, introducing the 45 nm process node for enhanced efficiency in notebook designs. This generation featured five dual-core Intel Core 2 Duo processors built on the Penryn microarchitecture, with clock speeds ranging from 2.26 GHz (P8400) to 3.06 GHz (Core 2 Extreme X9100), a 1066 MHz front-side bus, and L2 cache sizes of 3 MB or 6 MB depending on the model.[28][29] These processors supported thermal design powers (TDPs) of 25 W for low-power variants (P-series) and 35 W for standard models (T-series), enabling better thermal management in slim form factors.[29] The platform integrated the Mobile Intel 45 Express Chipset (PM45), which included the Intel Graphics Media Accelerator (GMA) 4500MHD for integrated graphics, clocked at 533 MHz with support for up to 384 MB shared video memory and hardware-accelerated HD video decoding for Blu-ray playback.[30] Wireless connectivity was advanced through the Intel WiFi Link 5000 series, notably the 5100 model supporting 802.11n with speeds up to 300 Mbps, marking Intel's first fully certified implementation of the standard for broader interoperability and up to five times the bandwidth of 802.11a/g networks.[30][28] Key efficiency features included a 30% reduction in processor power consumption for 25 W models compared to prior 35 W equivalents, achieved via the 45 nm high-k metal gate process and Deep Power Down Technology, which idles core clocks and cache to extend battery life during HD video playback.[29] Optional Intel Turbo Memory, up to 2 GB, provided NAND flash caching for hard drives, accelerating boot times and application loading while reducing overall system power draw.[30] Switchable graphics capabilities allowed seamless transitions between integrated and discrete GPUs for optimized performance and energy use.[28] In benchmarks, Penryn processors delivered up to 15% higher performance in CPU-intensive tasks compared to Merom predecessors at equivalent TDPs, benefiting from increased cache and faster FSB, though gains were more modest in memory-bound scenarios.[31] Targeted at ultraportable notebooks, Montevina powered devices like the Sony VAIO Z series, a 3-pound model with a 13.1-inch display emphasizing mobility and multimedia.[32] Over 250 designs were planned, focusing on longer battery life and wireless enhancements for mobile professionals.[29]Calpella and Huron River Platforms (2009-2011)
The Calpella and Huron River platforms, featuring processors based on the Westmere and Sandy Bridge microarchitectures respectively, represented a pivotal advancement in mobile computing by integrating the memory controller directly onto the processor die, enhancing memory access efficiency and overall system responsiveness. This integration eliminated the bottlenecks associated with previous off-chip memory controllers, enabling support for DDR3 memory and paving the way for higher bandwidth in notebook designs. Launched between 2009 and 2011, these platforms emphasized balanced performance, improved graphics, and extended battery life while maintaining the Centrino brand's focus on wireless integration. The Calpella platform, introduced in 2009, featured dual-core Arrandale processors under the Core i5 and Core i7 branding, with clock speeds ranging from 1.2 GHz to 2.66 GHz. Paired with the Mobile Intel HM55 Express chipset, it supported up to 8 GB of DDR3-1066 memory across two SO-DIMM slots and marked the first Centrino platform with an integrated DDR3 memory controller. The HM55 chipset also provided up to 12 USB 2.0 ports, six PCI Express lanes at 2.5 GT/s, and four SATA 3 Gb/s ports, facilitating robust connectivity for peripherals and storage. This configuration delivered improved multitasking capabilities and power efficiency, with the integrated Intel HD Graphics offering basic visual performance suitable for office and light media applications. Succeeding Calpella, the Huron River platform debuted in 2011, incorporating Sandy Bridge processors with clock speeds from 1.6 GHz to 2.7 GHz and the Mobile Intel HM65 Express chipset.[33] It expanded memory support to 16 GB of DDR3-1333 via dual-channel configuration and integrated the Intel HD Graphics 3000 on-die GPU, which provided roughly twice the performance of Arrandale's graphics solution for tasks like video playback and casual gaming. A standout feature was Intel Quick Sync Video, a hardware-accelerated encoding engine that reduced video transcoding times by up to 4x compared to software-only methods, benefiting content creators and media enthusiasts. Mandatory 802.11n Wi-Fi certification ensured high-speed wireless connectivity, aligning with evolving mobile internet demands. Battery life saw notable gains, with select systems reaching up to 10 hours under typical usage due to refined power gating and voltage regulation.[34] These platforms also introduced broader innovations, such as on-die GPU integration for streamlined designs and reduced latency in graphics workloads. The transition to a 32 nm process node in Sandy Bridge increased transistor density, which heightened thermal output compared to prior 45 nm implementations. Intel mitigated this through dynamic scaling mechanisms, including Turbo Boost Technology, which intelligently adjusted core frequencies and power draw based on workload and thermal limits to sustain performance without excessive heat buildup.Sandy Bridge and Ivy Bridge Platforms (2012-2013)
The Sandy Bridge and Ivy Bridge eras marked the final evolution of Intel's Centrino notebook platforms, emphasizing integrated multimedia processing, power efficiency, and wireless connectivity during 2012-2013. These platforms built on prior generations by incorporating advanced graphics and I/O capabilities, targeting ultrabooks and high-performance laptops while maintaining the core Centrino principle of validated CPU, chipset, and wireless integration for optimized mobile performance.[35] The Chief River platform, introduced in 2012, supported Ivy Bridge processors, enabling the use of second-generation Core i-series CPUs in updated notebook designs. It utilized the Mobile Intel HM76 Express Chipset from the 7 Series family, which added native USB 3.0 support for transfer speeds up to 5 Gbps, a significant upgrade over previous USB 2.0 limitations in Centrino configurations. This chipset also leveraged Ivy Bridge's 22 nm process advancements, offering better transistor density for improved efficiency without increasing power draw.[36][37] Ivy Bridge processors in Chief River configurations featured up to 4 cores with clock speeds ranging from 1.8 GHz to 3.1 GHz, delivering approximately 10-20% better performance in multi-threaded tasks compared to Sandy Bridge equivalents due to architectural refinements like enhanced branch prediction and larger caches. Integrated Intel Iris Graphics enabled superior multimedia handling, including hardware acceleration for 1080p video playback and basic 3D rendering, while ultrabook variants maintained a 15 W TDP for extended battery life in thin-and-light form factors. Security was bolstered by Intel Trusted Execution Technology (TXT), which provided hardware-rooted trust for virtualized environments and data protection. Wireless integration relied on modules like the Intel Centrino Ultimate-N 6300, supporting 802.11n with dual-stream MIMO for reliable high-speed connectivity up to 300 Mbps.[38] By 2013, the Shark Bay platform represented the last full Centrino certification for notebook systems, incorporating the Mobile Intel HM86 Express Chipset from the 8 Series and Haswell processors, preparing for 802.11ac Wi-Fi with modules like the Intel Dual Band Wireless-AC 7260 for speeds up to 867 Mbps on the 5 GHz band. Following Shark Bay, Intel de-emphasized the Centrino branding in favor of standalone Intel Core processor marketing, effectively phasing out the integrated platform certification model as wireless and performance features became standard across mobile lines.[39][40]Mobile Internet Device Platforms
Menlow Platform (2008)
The Menlow platform, codenamed for Intel's initial Centrino Atom technology and launched in 2008, marked the company's entry into ultra-low-power computing for Mobile Internet Devices (MIDs) and Ultra-Mobile PCs (UMPCs). Designed from the ground up for handheld form factors, it combined a 45 nm single-core Intel Atom Z5xx series processor with the Poulsbo (Intel System Controller Hub US15W) chipset to deliver a complete system solution emphasizing portability and efficiency. This platform targeted devices requiring always-on connectivity and extended battery life, positioning it as a bridge between traditional notebooks and emerging mobile gadgets.[41][42] At the heart of Menlow was the Intel Atom Z5xx processor (codenamed Silverthorne), available in models such as the Z530 at 1.6 GHz, with 512 KB L2 cache and a thermal design power (TDP) of 2.0 W (or 2.2 W with hyper-threading enabled). The Poulsbo chipset complemented this with a 2.3 W TDP, integrating a memory controller supporting up to 2 GB of single-channel DDR2-533 RAM, an I/O hub with 8 USB 2.0 ports, SDIO/MMC support, and a PATA interface for storage. Overall platform power stayed under 5 W, enabling fanless designs suitable for pocketable devices with 2-4 W total TDP. Graphics were handled by the integrated Intel Graphics Media Accelerator 500 (GMA 500), a PowerVR-based core providing hardware acceleration for H.264 video decode and basic 3D rendering, though limited to resolutions like 1024x600 for typical MID displays.[43][44][43] Menlow supported lightweight operating systems including Windows CE and various Linux distributions, facilitating development for embedded and mobile applications. Wireless integration followed Centrino standards with 802.11b/g Wi-Fi modules, ensuring compatibility for internet access in UMPCs without additional power overhead. As a precursor to the more advanced Moorestown platform, Menlow emphasized modular design for easy integration into custom handheld hardware.[41][44][41] Targeted at UMPC applications, Menlow influenced early low-cost portable computing trends, such as those seen in devices paving the way for netbooks like the ASUS Eee PC series, though initial Eee models predated full Atom adoption. The platform prioritized endurance over high performance.[45] Despite its technical merits, the Menlow platform faced limited market adoption, hampered by relatively high manufacturing costs for the time and the rapid rise of competitive smartphones like Apple's iPhone, which offered superior integration and user experience at lower price points. UMPCs based on Menlow remained niche, with poor sales reflecting broader challenges in the subnotebook segment.[46][47]Moorestown Platform (2010)
The Moorestown platform, introduced by Intel in 2010 as part of the Centrino Atom processor technology, represented a refined evolution of mobile internet device (MID) architectures, emphasizing enhanced power efficiency for tablets, netbooks, and handheld computing.[48] It built upon prior MID efforts by integrating more components into a system-on-chip design to reduce overall power draw and form factor while maintaining x86 compatibility for Internet-centric applications.[49] At its core, Moorestown featured the Atom Z600 series processors, single-core units operating at 1.2 to 1.5 GHz for smartphone and handheld variants (with up to 1.9 GHz scalability for tablets), fabricated on a 45 nm process node.[49][50] The platform's primary chipset components included the Lincroft system-on-a-chip, which housed the CPU, integrated graphics, video encode/decode engines, and a memory controller, paired with the Langwell platform controller hub for I/O management and an optional mixed-signal IC for power delivery.[49][51] Wireless connectivity was enabled through 802.11n Wi-Fi support, with optional integrated 3G/HSPA modems to facilitate mobile broadband access.[49] Memory configuration supported up to 2 GB of low-power DDR2 or LPDDR1 via a single-channel 32-bit interface. Key advancements in Moorestown focused on power optimization, achieving over 2x efficiency improvements in active scenarios like web browsing and video playback compared to the preceding Menlow platform, through features such as ultra-low-power states (S0i1 and S0i3) consuming as little as 100 microwatts in idle.[49] This enabled representative battery life of 4-5 hours for video playback and browsing in reference designs, alongside support for full 1080p HD video decoding and multitasking capabilities.[49] The platform targeted emerging operating systems like Android, with Intel collaborating on optimizations for rich media and Internet tasks on x86 hardware.[52] A follow-up architecture, codenamed Oak Trail, was planned for 2011, introducing dual-core Atom Z670 series processors on a 32 nm process to further extend MID capabilities.[49] Despite its technical merits, Moorestown saw limited commercial success, with few devices reaching the market due to competition from ARM-based alternatives and delays in ecosystem adoption; notable examples included prototype handhelds like the Aava Mobile Phone and LG GW990.[53] It served as a transitional step, bridging earlier MID efforts to later Intel platforms like Bay Trail in 2013, which integrated more advanced features for ultrabooks and tablets.Advanced Features and Variants
Centrino with vPro Technology
Intel Centrino with vPro Technology was introduced in April 2007 as an enterprise-oriented extension of the Centrino platform, specifically tailored for IT administrators managing mobile workforces. This integration combined the wireless and performance features of the upcoming Santa Rosa platform—featuring Intel Core 2 Duo processors—with Intel vPro technology, enabling advanced remote management capabilities over Wi-Fi networks.[54] The launch addressed the growing need for notebook security and control in business environments, where devices often operate outside traditional corporate networks.[54] At its core, the technology leveraged hardware-based virtualization to support out-of-band management, allowing IT teams to access and repair systems regardless of the operating system's state or the device's power status. Key components included Intel Active Management Technology (AMT), which provided remote provisioning, monitoring, and recovery functions, and Keyboard, Video, Mouse (KVM) over IP for secure, real-time remote control.[54] Implementation required specific Intel Core 2 Duo vPro processor SKUs, paired with compatible chipsets and wireless adapters, ensuring seamless integration within validated Centrino systems.[54] The platform evolved across generations, with support extending to the Calpella platform in 2010, continuing to incorporate Intel Trusted Execution Technology (TXT) to enable measured and secure boot processes that verified system integrity against tampering.[55] This enhancement bolstered protection for virtualized environments and sensitive data handling in mobile scenarios. Compatibility continued through subsequent architectures, including up to Ivy Bridge-based platforms in 2012-2013.[56] Following the phase-out of the Centrino brand in 2013, vPro technology continued to evolve independently in Intel's subsequent processor platforms. By offering proactive issue resolution and inventory visibility, Centrino with vPro Technology significantly reduced operational downtime—enabling fixes without physical intervention—and facilitated asset tracking across distributed fleets.[54] These capabilities proved particularly valuable in corporate settings, where they streamlined IT workflows and minimized support costs for business notebooks.Security and Management Enhancements
Intel Trusted Execution Technology (TXT), introduced in 2008 with the Centrino 2 platform featuring vPro technology, provides a hardware-based root of trust for measured launches of operating systems and applications. This mechanism verifies the integrity of platform components during boot, ensuring that only trusted software executes and preventing malware from compromising the system at the firmware level. By establishing a chain of trust from hardware through the BIOS to the OS, TXT isolates execution environments, particularly beneficial for enterprise mobile devices where virtualization is common.[57][58] Centrino platforms incorporate advanced idle states, including enhanced C-states, to enable power-secure management by reducing processor activity and voltage during low-utilization periods while maintaining system responsiveness. These states integrate with Trusted Platform Module (TPM) 1.2 and later 2.0 chips, allowing secure storage of cryptographic keys and platform measurements that support TXT and other security features without exposing sensitive data during idle operations. This combination ensures that power savings do not compromise security postures in managed enterprise environments.[58] Management enhancements in Centrino with vPro include compliance with the Desktop and mobile Architecture for System Hardware (DASH) standard, enabling out-of-band remote monitoring and control over networks, even for powered-off devices. Features such as remote BIOS updates allow IT administrators to apply firmware patches securely without physical access, reducing downtime and vulnerability exposure. Additionally, anti-theft technologies like Computrace, integrated starting around 2009, provide persistent tracking and remote data wiping for lost or stolen laptops, enhancing asset protection in mobile workforces.[59][60] Security evolved further in the 2013 Shark Bay platform, the ninth-generation Centrino variant, with the addition of Advanced Encryption Standard New Instructions (AES-NI) for hardware-accelerated encryption and decryption. These instructions significantly improve performance for data protection tasks, such as securing communications and storage, while maintaining low power consumption suitable for mobile platforms.[39][61]References
- https://en.wikichip.org/wiki/intel/platforms/menlow
- https://en.wikichip.org/wiki/intel/atom/z600