Hubbry Logo
Comparison of EDA softwareComparison of EDA softwareMain
Open search
Comparison of EDA software
Community hub
Comparison of EDA software
logo
7 pages, 0 posts
0 subscribers
Be the first to start a discussion here.
Be the first to start a discussion here.
Comparison of EDA software
Comparison of EDA software
Comparison of EDA software
View on Wikipedia
from Wikipedia

This page is a comparison of electronic design automation (EDA) software which is used today to design the near totality of electronic devices. Modern electronic devices are too complex to be designed without the help of a computer. Electronic devices may consist of integrated circuits (ICs), printed circuit boards (PCBs), field-programmable gate arrays (FPGAs) or a combination of them. Integrated circuits may consist of a combination of digital and analog circuits. These circuits can contain a combination of transistors, resistors, capacitors or specialized components such as analog neural networks, antennas or fuses.

The design of each of these electronic devices generally proceeds from a high- to a low-level of abstraction. For FPGAs the low-level description consists of a binary file to be flashed into the gate array, while for an integrated circuit the low-level description consists of a layout file which describes the masks to be used for lithography inside a foundry.

Each design step requires specialized tools, and many of these tools can be used for designing multiple types of electronic circuits. For example, a program for high-level digital synthesis can usually be used both for IC digital design as well as for programming an FPGA. Similarly, a tool for schematic-capture and analog simulation can generally be used both for IC analog design and for PCB design.

In the case of integrated circuits (ICs) for example, a single chip may contain today more than 20 billion transistors and, as a general rule, every single transistor in a chip must work as intended. Since a single VLSI mask set can cost up to 10-100 millions, trial and error approaches are not economically viable. To minimize the risk of any design mistakes, the design flow is heavily automatized. EDA software assists the designer in every step of the design process and every design step is accompanied by heavy test phases. Errors may be present in the high-level code already, such as for the Pentium FDIV floating-point unit bug, or it can be inserted all the way down to physical synthesis, such as a missing wire, or a timing violation.

Comparison of proprietary EDA software

[edit]

Mainstream EDA software bundles for ICs design

[edit]

The world of electronic design automation (EDA) software for integrated circuit (IC) design is dominated by the three vendors Synopsys, Cadence Design Systems and Siemens EDA (Formerly Mentor Graphics, acquired in 2017 by Siemens) which have a revenue respectively of 4,2 billion US$, 3 billion US$ and 1,3 billion US$.

These vendors offer software bundles which allow to cover the full spectrum of IC design, from HDL synthesis to physical synthesis and verification.

The development of EDA software is tightly connected with the development of technology nodes. The properties of a specific semiconductor foundry, such as the transistor models, the physical characteristics and the design rules, are usually encoded in file formats which are proprietary to one or more EDA vendors. This set of files constitutes the process design kit (PDK) and it is usually developed as a joint effort between the foundry and an EDA vendor. Foundries therefore usually release PDKs which are compatible only for one specific EDA bundle. The information contained inside PDKs is usually considered confidential. PDKs are therefore usually protected by non disclosure agreements (NDAs) and may be shipped in an incomplete or in an encrypted form to the designers.

Proprietary software for electrical simulation (analog/mixed-signal/electromagnetic)

[edit]
Application and developer Platform Latest release Schematic? Simulation? PCB editing? User Interface Language(s) Imports Exports Scripting support
Version Date
Advanced Design System by Keysight EEsof EDA POSIX[1] 2019[2] 2018-11-15 Yes Yes, full-wave electromagnetic simulation and netlist simulation Yes en HSPICE, SPICE, Spectre netlists; Gerber, Excellon, ODB++, artwork; more HSPICE, SPICE, Spectre netlists; Gerber, Excellon, ODB++, artwork; more Python, Application Extension Language (proprietary; "AEL")
Windows[1]
SuSE[1]
RHEL[1]
CircuitLogix by Logic Design Windows 10 2019-01 Yes Yes, netlist simulation (analog and digital) Yes en SPICE, Gerber, DXF SPICE, PDF, Gerber, DXF
LTspice by Analog Devices
(free) 		Windows, macOS, Wine 24.0.12 2024-08-21 Yes Yes, netlist simulation (analog) No en netlist netlist
Micro-Cap
(free, end-of-life) 		Windows 12.2.0.5 2021-06-17
(end-of-life) 		Yes Yes, netlist simulation (analog and digital) No en, jp HSPICE, PSPICE, SPICE3, netlists, Images, IBIS, Touchstone SPICE text file, netlist, BOM, Protel, Accel, OrCad, PADS netlists, Schematic and Analysis Plots Images, Numeric Output Text, Excel
Wine

Of these, LTSpice and Micro-cap are free proprietary applications based on SPICE. Micro-Cap was released as freeware in July 2019, when its parent company Spectrum Software closed down while LTSpice has been free for a long time.

Comparison of proprietary software for PCB design

[edit]
Application and developer Platform Latest release Schematic? Simulation? PCB editing? User Interface Language(s) Imports Exports Scripting support
Version Date
Altium Designer (former Protel) by Altium Windows 24.10.1[3] 2024-10-10 Yes Yes Yes Multilingual OrCAD, Allegro, PADS Logic, PADS PCB, Expedition, DxDesigner, EAGLE, P-CAD, Gerber, STEP, Solidworks, IDF, more 3D PDF, Gerber, Gerber X2, Excellon, ODB++, DXF, STEP, OrCAD, EAGLE, EDB, more Delphi, JS, VB
Wine
CADSTAR, Board Designer, and Visula by Zuken Windows 2022.0 2022-08-31 Yes Yes, SI & PI Yes en PADS, OrCAD, P-CAD, Protel, DXF, IDF PDF, Gerber, Excellon, ODB++, DXF, IDF more COM, macros
CircuitMaker by Altium Windows 2 2021-07 Yes No Yes en Importer Removed since Last Version (1.3) Gerber, Excellon, DXF, STEP, PDF None
Wine
CR-5000 by Zuken POSIX 13 2011-05-17 Yes Yes, SI & PI Yes en, jp EDIF, DXF, IGES, IDF, BSDL, STEP, ACIS, Gerber, Excellon, more PDF, Gerber, Excellon, ODB++ (must request[4]), DXF, STEP, IPC D-356, IPC-2581, EPS, ACIS
Windows
Unix
Linux
CR-8000 by Zuken POSIX 2020 2020-06-30 Yes Yes, SI & PI, IBIS-AMI/SERDES Yes en, jp EDIF, DXF, IGES, IDF, BSDL, STEP, ACIS, Gerber, Excellon, more PDF, Gerber, Excellon, ODB++ (must request[4]), DXF, STEP, IPC D-356, IPC-2581, EPS, ACIS
Windows
Unix
Linux
DesignSpark PCB by RS Components Windows 9.0.3 2020-07-08 Yes Yes, Spice Yes en EAGLE, DXF, EDIF Gerber, Excellon, ODB++, DXF, IDF, PDF, LPKF
DipTrace by Novarm POSIX 5.2.0.1 2025-09-26 Yes External
(Spice netlist export) 		Yes 21 languages Altium, Eagle, KiCad, OrCAD, P-CAD, PADS, Gerber, N/C Drill, DXF, BSDL Pinlist, Netlists Gerber, Gerber X2, Excellon, ODB++, DXF, Eagle, P-CAD, PADS, OrCAD, IPC-D-356, STEP, VRML, Pick and Place, CSV, BOM
Windows
Mac
Wine
EAGLE by Autodesk/CadSoft Computer
(discontinued) 		POSIX 9.6.2 2020-05-27 Yes Ngspice Yes de, en, zh, hu, ru EAGLE (XML), ACCEL (P-CAD, Altium, Protel), ULTIBOARD, Netlists, BMP, Custom EAGLE (XML), Protel, Netlists, Images, Gerber, Gerber X2, Excellon, Sieb & Meyer, HPGL, PostScript/EPS, PDF, Images, HyperLynx, IDF, Custom Proprietary User Language Programming (ULP)
Windows
Linux
Mac
EasyEDA POSIX 6.4.5 2020-08-19 Yes Ngspice Yes en, fr, de, pl, jp, ru, es, se, ua, zh ... Altium, EAGLE, KiCad libraries, LTspice .asc/.asy files, JSON, Spice PDF, PNG, SVG, JSON, Gerber, Excellon, Pick and Place CSV file, CSV-formatted drill chart, Bill of Materials CSV file, Altium netlist, FreePCB netlist, PADS Layout Netlist, Spice netlist. JSON
Windows
Linux
Mac
ChromeOS as a Web application
Flux.ai POSIX N/A 2025 Yes Ngspice Yes en EAGLE/KiCad libraries, Altium/Allegro Schematics, DXF, SVG, STEP, etc. Gerber, IPC-2581C, ODB++, EDIF netlists, D356 netlists, JEP30, Pick and Place CSV file, CSV-formatted drill chart, Bill of Materials CSV file. TypeScript
Windows
Linux
Mac
ChromeOS as a Web application
NI Ultiboard and Multisim by National Instruments Windows 14.2 [5] 2019-05-19 Yes Yes Yes en MS*, MP*, EWB, Spice, OrCAD, UltiCap, Protel, Gerber, DXF, Ultiboard 4&5, Calay BOM, Gerber, Excellon, IGES (3D), DXF (2D & 3D), SVG
Web application[6]
OrCAD Windows 17.4 - 22.1 2022-10-20 Yes Yes Yes en EAGLE, PADS, Altium, STEP, DXF, IDF, IDX, OrCAD SDT, OrCAD Layout,OrCAD PDF, Gerber, Gerber X2, Excellon drill/route, netlist, ODB++, DXF, IDF, IDX, STEP,3D PDF, IPC2581 Tcl/TK, SKILL (Lisp)
Proteus by Labcenter Electronics Ltd Windows 8.17 2023-12-11 Yes Yes Yes en Gerber, BMP, DXF PDF, Gerber, GerberX2, Excellon, ODB++, DXF, IDF, PKP, testpoint file, metafile, BMP. internal script
Pulsonix by WestDev Ltd Windows 12.5 2023 Yes Yes Yes en Allegro, Altium, CadStar, EAGLE, OrCAD, PADS, P-CAD, Protel, Gerber, STEP, DXF, IDF, more Gerber, Gerber X2, Excellon, ODB++, IPC-2581, PDF, DXF, STEP, IDF, BOM, more Proprietary language, ActiveX
Wine
TARGET 3001! Windows 33.4 2025-04-09 Yes Yes Yes en, de, fr EAGLE, DXF, Gerber, Gerber, Excellon, BMP, CXF, STEP 3D ODB++, Gerber, Gerber X2, Excellon, EAGLE, HPGL, G-Code (Milling), CXF, STEP 3D, Excel BOMs, Pick&Place, GenCAD, FABmaster, IPC D-356, Test points, Netlists, OBJ, POV-Ray, PDF Package generator scripts, BOM scripts, printing and PDF generator scripts, 3D scripts
Wine
TINA Windows 12.0 2019-12 Yes Yes Yes 23 languages (en, de, fr, es and 19 other languages) VHDL, Verilog, Verilog-A, and Verilog-AMS VHDL, Verilog, Verilog-A, and Verilog-AMS
Linux
MacOS
Android
Upverter POSIX N/A 2019-05-10 Yes No Yes en Altium, OrCad, PDF, OpenJSON, EAGLE PDF, Gerber, Excellon, netlist, PADS Layout Netlist, Tempo Automation, Pick and Place CSV, High-Res PNG, STL, CSV-formatted drill chart, CSV-formatted list of all parts
Windows
Web application
123D Circuits by Autodesk POSIX N/A Yes, + breadboard Yes Yes en EAGLE Gerber
Windows
Web application
Application and developer Platform Latest release Schematic? Simulation? PCB editing? User Interface Language(s) Imports Exports Scripting support
Version Date

Comparison of free and open source software EDA tools

[edit]

Free and open source software EDA bundles for IC design

[edit]

Free and open-source (FOSS) EDA software bundles are currently under fast development mainly thanks to the DARPA and Google's openROAD project. The OpenROAD project offers a complete stack of tools from high-level synthesis down to layout generation[7] The flow includes Yosys for logic synthesis, OpenLane for physical synthesis and targets the SkyWater 130 nm PDK. The flow is currently utilized to submit design for free fabrication at Google.[8][9][better source needed]

Free and open source software for high-level synthesis

[edit]

High-level synthesis software can generally be used for the design of both application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs). Most high-level synthesis software is used to edit and verify code written in one of the mainstream hardware description languages (HDL) like VHDL or Verilog. Other tools instead operate at a higher level of abstraction and allow to synthesize HDL code starting from languages like Chisel or SpinalHDL. The higher abstraction of such languages enables formal verification of HDL code.[10][11][better source needed]

Name Architecture License Comment
GHDL Linux, Mac GPL-2.0-or-later VHDL analyzer, compiler, and simulator.[12]
Icarus Verilog *BSD, Linux, Mac GPL-2.0-or-later Verilog simulator
Verilator Posix LGPL-3.0-only or Artistic-2.0 Verilator is the fastest free Verilog HDL simulator. It compiles synthesizable Verilog into cycle accurate C++ or SystemC code following 2-state synthesis (zero delay) semantics. Benchmarks reported on its website suggest it is several times faster than commercial event driven simulators such as ModelSim, NC-Verilog and VCS, while not quite as fast as commercial cycle accurate modeling tools such as Carbon ModelStudio and ARC VTOC.

List by developer

[edit]
List of electrical engineering software[13][14]
Software Developer Operating System/License
Advanced Design System (ADS) Keysight Technologies Windows, Linux
Altium Designer Altium Limited Windows
ANSYS Electronics ANSYS Windows, Linux
ANSYS HFSS ANSYS Windows
ANSYS Maxwell ANSYS Windows, Linux
AutoCAD – Electrical Autodesk Windows
CST Studio Suite Simulia Windows, Linux
Eagle Autodesk Windows, macOS, Linux
EMTP-RV ATPDraw Windows
EMTPWorks EMTPWorks Windows
Electrical Transient Analyzer Program ETAP/Operation Technology Inc. Windows
FreeCAD FreeCAD Community Windows, macOS, Linux
FreePCB FreePCB community Windows
gEDA gEDA Project Windows, macOS, Linux
KTechLab KTechLab Developers Windows, macOS, Linux
LibrePCB LibrePCB Team Windows, macOS, Linux
Quite Universal Circuit Simulator (QUCS) Qucs Developers Windows, macOS, Linux
KiCad KiCad Developers Windows, macOS, Linux
LabVIEW National Instruments Windows, macOS, Linux
LTspice Linear Technology Windows
NI Multisim National Instruments Electronics Workbench Group Windows
NL5 circuit simulator New Wave Instruments Windows
OrCAD Cadence Design Systems Windows
PowerEsim Power Integrations Web application
PSIM Powersim Inc. Windows
PSpice Cadence Design Systems Windows
Power system simulator for engineering Siemens Energy Windows
SaberRD Synopsys Windows
Simulink MathWorks Windows, macOS, Linux
SynchroTrace Rosh Engineering LLC Windows
TINA DesignSoft Windows
XCircuit Tim Edwards Windows, macOS, Linux
  •   Proprietary
  •   Open source
  •   Freeware/Trialware

Free software for IC physical synthesis and layout

[edit]

This list does not include schematic editors or simulators since these can generally be used both for Integrated Circuits (ICs) and for Printed Circuit Board (PCB) as long as device models are available.

Name Architecture License Autorouter Comment
Electric *BSD, Java GPL-3.0-or-later Yes VLSI circuit design tool with connectivity at all levels. Can also be used for schematic entry and PCB design. In maintenance mode since 2017.[citation needed]
Magic Linux BSD license No A very-large-scale integration layout tool

Free software for schematic editing and analog/mixed-signal simulation

[edit]
Name Architecture License Comment
Gnucap any (C++11) GPL-3.0-or-later Mixed-signal circuit simulator
KTechLab Linux GPL KTechLab is a schematic capture and simulator. It is specifically geared toward mixed signal simulation of analog components and small digital processors.
Ngspice Linux, Solaris, Mac, NetBSD, FreeBSD, Windows BSD-3-Clause SPICE + XSPICE + Cider
Oregano GPL-2.0-or-later Schematic capture + spice simulation
Quite Universal Circuit Simulator (QUCS) Linux, Solaris, Mac, NetBSD, FreeBSD, Windows GPL-2.0-or-later Schematic capture + Verilog + VHDL + simulation. Qucs-S fork supports SPICE backends Ngspice, Xyce, & SpiceOpus.
XCircuit Unix GPL Used to produce netlists and publish high-quality drawings.

Free software for PCB design

[edit]
Name Architecture License Autorouter Imports Exports Scripting support Comment
atopile Linux, Mac, Windows MIT License No - Gerber, BOM Python Code-based EDA tool that allows hardware engineers to design electronic circuits and PCBs using a programming-like environment. It integrates hardware design specifications directly into code, enabling intelligent design capture, version control, and continuous integration practices.[15]
FreePCB Windows GPL Yes - Gerber No A printed circuit board design program for Microsoft Windows. FreePCB allows for up to 16 copper layers, both metric and US customary units, and export of designs in Gerber format. Boards can be partially or fully autorouted with the FreeRouting[16] autorouter by using the FpcROUTE Specctra DSN design file translator.
Fritzing Windows, Mac, Linux GPL-3.0-or-later Yes gEDA symbols, KiCad symbols, SVG Gerber, DIY etching, BOM, SVG, PDF, EPS No Protoboard view, schematic view, PCB view, Code (firmware) view. Includes customizable design rule checker. Includes common shaped boards like Arduino and Raspberry Pi shields. Allows spline curve traces. Only two layers (top and bottom). Outputs gerbers.
gEDA *BSD, Linux, Mac GPL-2.0-or-later Yes gschem netlists, image as background Gerber, Excellon, SVG, PDF, EPS, PNG, GIF, JPEG, Specctra, XYRS Guile (Scheme) Schematic, simulation, PCB editor, gerber view
KiCad Linux, Mac, Windows GPL-3.0-or-later FreeRouting Altium, CadStar, EAGLE (XML), P-CAD, Fabmaster, TinyCAD net lists, OrCAD EDIF PDF, Gerber, Gerber X2, Excellon, netlist, VRML2, STEP, IDFv3 Python Full package for schematic and board design, etc. Design rule checking. User-defined symbols and footprints. Gerber/drill file creation. Graphic interface. Active user community.
pcb-rnd *BSD, Linux, Mac, Windows GPL-2.0-or-later Yes gschem netlists, Protel Autotrax, KiCad (legacy & s-expr layouts), EAGLE (XML & v3,4,5 binary layouts), eeschema netlists, mentor netlists, TinyCad netlists, Calay netlist, FreePCB/easyEDA netlist, LT-Spice, MUCS, Mentor Graphics Hyperlynx, image (BMP, JPG, GIF, PNG), HPGL, BXL, Specctra (DSN), PADS Gerber/drill, SVG, PDF, EPS, PNG, GIF, JPEG, Specctra (DSN), PADS, Protel Autotrax, KiCad (legacy & s-expr), DXF, FidocadJ, Mentor Graphics Hyperlynx, template configurable XYRS/BOM Python, Lua, Perl, Tcl, AWK (multiple dialects), Lisp & Scheme (multiple dialects), JavaScript, Ruby, Pascal, BASIC Circuit layout program with extended file format support, DRC, parametric footprints, query language, and GUI and command line operation for batch processing and automation

See also

[edit]

References

[edit]
[edit]
Revisions and contributorsEdit on WikipediaRead on Wikipedia

Comparison of EDA software

View on Grokipedia
from Grokipedia
Electronic design automation (EDA) software encompasses a category of computer-based tools, including software, hardware, and services, that automate the design, simulation, verification, and implementation of electronic systems such as integrated circuits (ICs), very-large-scale integration (VLSI) chips, and printed circuit boards (PCBs). Comparisons of EDA software evaluate these tools across various dimensions, including functionality for , layout editing, , timing analysis, and power optimization, to assist engineers in selecting solutions that meet project-specific needs in complexity, scalability, and integration with manufacturing processes. EDA tools are broadly categorized into those for IC/VLSI design, which handle high-level synthesis, physical placement, and advanced verification for semiconductor fabrication, and PCB design tools focused on board-level layout, signal integrity, and 3D modeling. Leading proprietary suites, such as ' Fusion Design Platform for RTL synthesis and IC Compiler II for placement and routing, and Cadence's for analog layout and Innovus for digital implementation, dominate the market due to their comprehensive flows and support for advanced nodes like 3nm and 5nm. In contrast, open-source alternatives like for PCB design and OpenROAD for automated RTL-to-GDSII flows offer cost-free entry points but often lag in scalability and enterprise-grade support compared to commercial options. Comparisons typically assess factors such as pricing models—ranging from free (e.g., , ) to high-end subscriptions exceeding thousands of dollars annually (e.g., , tools)—alongside performance metrics like simulation speed, ease of use, and integration with cloud or AI-driven features. For instance, tools like X excel in real-time design collaboration and scalability for large-scale projects, earning top ratings in PCB comparisons, while EDA's PADS emphasizes seamless workflow integration for analysis. The EDA market, valued at approximately $17.2 billion in 2024, is projected to grow due to demands from AI, IoT, and applications, influencing tool evolution toward hybrid cloud-native architectures and enhancements.

Fundamentals of EDA Software

Definition and Core Workflow

(EDA) refers to a category of software tools, along with associated hardware and services, that automate the design, verification, implementation, and manufacturing of electronic systems such as integrated circuits (ICs), printed circuit boards (PCBs), and field-programmable gate arrays (FPGAs). These tools enable engineers to handle the increasing complexity of electronic designs by replacing manual processes with computational algorithms for tasks ranging from high-level specification to physical layout. EDA encompasses the full spectrum from conceptual planning to production-ready outputs, ensuring designs meet functional, performance, and manufacturability requirements. The core EDA workflow is typically divided into front-end, back-end, and sign-off stages, providing a structured progression from abstract to physical realization. In the front-end stage, engineers begin with system specification and architectural , followed by (RTL) modeling using hardware description languages (HDLs) like or to describe the desired functionality. This phase includes to verify behavioral correctness, often iterating between RTL coding and testing to refine the before proceeding. The back-end stage transforms the RTL into a gate-level through logic synthesis, which maps HDL descriptions to standard cell libraries, and then proceeds to physical via place-and-route algorithms that position components and route interconnections on the chip layout. serves as a critical bridge between these stages, representing the as interconnected components in a format compatible with downstream tools for optimization and verification. The sign-off stage performs final checks, including static timing analysis to ensure signal propagation meets clock constraints, power integrity analysis, and design rule checks (DRC) to confirm compliance with fabrication processes. Modern EDA workflows emphasize integration through iterative loops, such as repeated cycles of , synthesis, and optimization to balance power, performance, and area (PPA) metrics while addressing design constraints. This iterative approach allows for early detection of issues, reducing redesign efforts and accelerating time-to-market for complex electronic systems.

Historical Evolution and Key Milestones

The origins of electronic design automation (EDA) software trace back to the 1960s and 1970s, when the burgeoning integrated circuit (IC) industry necessitated tools for automating design tasks on mainframe computers. Early efforts focused on interactive graphics systems for IC layout, with companies like Calma pioneering hardware-software solutions that allowed manual digitization of circuit designs into digital formats. Calma, founded in 1965, introduced its Graphic Design System (GDS) in the early 1970s, which established the GDSII stream format as a de facto standard for exchanging IC layout data between design tools and fabrication facilities. Concurrently, simulation capabilities emerged to verify circuit behavior; the Simulation Program with Integrated Circuit Emphasis (SPICE), developed at the University of California, Berkeley, as a graduate student project starting in 1970 under professors Donald O. Pederson and Ronald A. Rohrer, provided the first widely accessible analog circuit simulator. The initial version of SPICE was released in 1972, revolutionizing IC verification by enabling nonlinear device modeling and sparse matrix techniques on limited computing resources. The 1980s and 1990s marked the commercialization and maturation of EDA, driven by the rise of application-specific integrated circuits (ASICs) and the shift from mainframes to engineering workstations like those from Sun Microsystems. Hardware description languages (HDLs) became pivotal for abstracting designs, with Verilog HDL originating in 1984 at Gateway Design Automation as a proprietary simulation language that supported gate-level modeling and later behavioral descriptions. VHDL, developed under the U.S. Department of Defense's Very High Speed Integrated Circuit (VHSIC) program starting in 1981 and standardized by IEEE in 1987, complemented Verilog by emphasizing structured, documentation-oriented design for military applications. Commercial vendors proliferated to deliver integrated toolsets; Synopsys was founded in 1986 by Aart de Geus and colleagues, initially focusing on logic synthesis tools that automated the conversion of HDL to gate-level netlists. Cadence Design Systems emerged in 1988 through the merger of SDA Systems and ECAD, advancing place-and-route and verification software for workstation environments. The formation of the Electronic Design Automation Consortium (EDAC) in 1989 further solidified the industry by promoting standards, education, and market growth amid rapid innovation. From the 2000s onward, EDA evolved to address escalating design complexity fueled by , which predicted the doubling of transistors on chips approximately every two years, thereby demanding more sophisticated tools for handling billion-transistor scales and verification challenges. Open-source initiatives gained traction to democratize access, exemplified by Icarus Verilog, an implementation of the standard begun in 1998 by Steve Williams, which provided a free compiler and simulator for digital designs. The introduction of in 2002 by Accellera, building on Verilog with advanced verification features like assertions and object-oriented extensions, was ratified as IEEE 1800 in 2005, enabling more efficient functional verification for complex systems. FPGA also proliferated, with open-source options supporting and customization. Post-2020, the industry shifted toward open standards like , an open initiated at UC Berkeley in 2010 but seeing explosive adoption for custom processors; this spurred development of open-source EDA flows, such as those using Yosys for synthesis, to lower barriers for RISC-V-based IC design without proprietary dependencies.

Comparison Criteria for EDA Tools

Essential Features and Performance Metrics

Essential features of EDA software revolve around core functionalities that support the , , and validation of electronic systems. A fundamental capability is support for hardware description languages (HDLs) such as and , which allow engineers to model digital circuits at the (RTL) for subsequent synthesis and . Simulation accuracy is another critical feature, including transient analysis for evaluating time-domain behaviors like signal rise times and AC analysis for frequency-domain responses such as gain and phase margins, ensuring models closely approximate real-world circuit . These simulation types rely on numerical solvers that balance computational precision with efficiency to predict outcomes without physical prototyping. Synthesis optimization forms a cornerstone of EDA features, targeting reductions in area, power, and timing through algorithmic transformations of RTL code into gate-level netlists. Area optimization minimizes the physical footprint by selecting compact cell libraries, while power optimization employs techniques like clock gating and multi-voltage domains to lower dynamic and leakage consumption. Timing optimization ensures signals propagate within specified clock cycles by adjusting logic depths and inserting buffers, often guided by static timing analysis. Verification coverage complements these by incorporating functional verification, which uses testbenches to exercise design behaviors, and formal verification, which applies equivalence checking and property proofs to exhaustively confirm correctness without exhaustive simulation. These features collectively enable reliable progression through front-end design stages like RTL coding and behavioral modeling. Performance metrics provide quantitative benchmarks for assessing EDA tool effectiveness, with runtime efficiency measuring task completion times, often in hours for large-scale operations. Scalability evaluates the ability to process designs exceeding millions of gates, where tools must maintain performance as transistor counts grow without exponential resource demands. Resource usage tracks CPU and GPU consumption, with parallel processing enabling faster execution on multi-core systems. Interoperability is gauged by seamless data exchange via standardized formats like LEF for library exchange and DEF for design layouts, facilitating integration across tool flows without proprietary lock-in. These metrics highlight trade-offs, such as increased memory for detailed simulations versus speed for iterative designs. Standardized evaluation methods employ benchmarks to compare tools objectively, such as the International Symposium on Physical Design (ISPD) contests, which test placement and algorithms on metrics like total wirelength and routability for industrial benchmarks. The International Test Conference (ITC) benchmarks, including ITC'99 suites, assess verification tools on fault coverage and test pattern efficiency for designs. Quantitative results often include the power-delay product (PDP), calculated as average power multiplied by propagation delay, serving as a key indicator of energy efficiency in logic circuits. These contests and metrics, derived from representative designs, establish baselines for tool improvements without relying on vendor-specific claims. Usability factors influence adoption by balancing accessibility with flexibility, including graphical user interfaces (GUIs) for intuitive schematic entry and visualization, contrasted with scriptable interfaces using languages like Tcl for batch automation and customization. Integration with systems, such as , supports collaborative workflows by tracking design iterations and enabling . Debugging capabilities, featuring waveform viewers and assertion-based error tracing, streamline issue resolution during verification. These elements ensure tools are approachable for diverse users while scalable for enterprise environments.

Licensing, Cost, and Support Models

Electronic Design Automation (EDA) software licensing typically falls into two primary models: perpetual and subscription-based. Perpetual licenses involve a one-time upfront payment granting indefinite use of a specific software version, often accompanied by optional maintenance fees for updates and support. In contrast, subscription models require recurring payments, usually annual, providing access to the latest versions, cloud resources, and ongoing enhancements, which has become prevalent in enterprise EDA environments with costs ranging from $50,000 to $500,000 per seat depending on tool complexity. Additionally, licenses are categorized by deployment: node-locked versions are bound to a single machine, limiting portability but reducing administrative overhead, while floating licenses enable shared access across a network, allowing multiple users to utilize the software concurrently up to the licensed limit. Academic institutions often benefit from discounted or free access through special programs, enabling educational use without full commercial pricing. Cost structures in EDA extend beyond initial licensing to encompass various models that influence total ownership expenses. Upfront pricing for comprehensive suites can exceed $100,000, reflecting the specialized nature of the tools, though cloud-based options mitigate this through pay-per-use billing tied to compute hours or simulation runs. Hidden costs frequently arise from hardware demands, as EDA workflows require high-performance computing resources like multi-core processors and substantial memory, potentially adding tens of thousands in infrastructure investments. Training represents another significant expense, with vendor-led programs or third-party courses necessary to master complex interfaces, often costing several thousand dollars per engineer and extending onboarding timelines. Support ecosystems vary by tool origin, ensuring reliability and compatibility in design flows. Proprietary EDA vendors provide dedicated support including 24/7 hotlines, regular updates, and bug fixes, often bundled into subscription fees to maintain tool efficacy. Open-source alternatives rely on community-driven models, where user forums, volunteer contributions, and collaborative repositories foster ongoing development and troubleshooting without formal guarantees. Certification programs, particularly for foundry compatibility, validate tools against specific process nodes, offering assurance of interoperability and reducing integration risks through partnerships between EDA providers and semiconductor manufacturers. As of 2024, EDA licensing has shifted toward Software-as-a-Service (SaaS) models accelerated post-2020, with over 60% of new licenses delivered via cloud platforms to enhance and while lowering hardware barriers. This transition favors subscription and usage-based pricing over perpetual licenses, enabling flexible scaling for varying project demands. tiers have emerged for startups, offering basic functionalities at no cost to lower entry barriers and facilitate prototyping before upgrading to paid features.

Proprietary EDA Software

Integrated Suites for IC Design

Integrated suites for IC design encompass proprietary (EDA) tools that provide end-to-end workflows from (RTL) synthesis to layout, enabling comprehensive design, implementation, and verification of complex system-on-chips (SoCs). These suites are dominated by offerings from major vendors such as , , and Siemens EDA (formerly ), which integrate synthesis, place-and-route, timing analysis, power optimization, and into unified platforms to address the challenges of advanced processes. Synopsys' Fusion Compiler serves as a flagship RTL-to-GDSII solution, featuring a single data model for synthesis, placement, optimization, and routing to deliver superior power, performance, and area (PPA) results with reduced turnaround times for large-scale designs. It supports advanced process nodes down to 2nm, including TSMC's N2P technology, through certified flows that incorporate extreme ultraviolet (EUV) lithography for high-density FinFET and nanosheet transistors. Cadence's Innovus Implementation System focuses on digital place-and-route with advanced timing closure capabilities, supporting nodes from 16nm FinFET to 3nm, and integrates EUV-aware rules for multi-patterning and density management in complex SoCs. Siemens EDA's Calibre Design Solutions complements these by providing integrated physical verification, layout-versus-schematic (LVS) checks, and design-for-manufacturability (DFM) optimization, seamlessly interfacing with Synopsys and Cadence tools via the Calibre Connectivity Interface (CCI) to ensure sign-off accuracy across the full design flow.
SuiteProcess Node SupportMCMM AnalysisIP Integration (e.g., Cores)
Fusion Compiler2nm ( N2P, EUV-enabled FinFET/nanosheet)Integrated multi-corner multi-mode (MCMM) timing and power optimization across variationsNative support for IP blocks with automated insertion and verification flows
Innovus3nm ( N3, EUV multi-patterning)GigaPlace engine for MCMM-aware placement and clock tree synthesisSeamless integration of third-party IP like cores via Liberty and LEF/DEF formats
CalibreAdvanced nodes including 3nm and below (EUV-compatible verification)Supports MCMM through and extraction for multi-scenario analysisInterfaces with / for IP verification, including connectivity checks
These suites excel in automating the design of large SoCs with billions of gates, leveraging proprietary algorithms for congestion reduction, , and yield enhancement; for instance, ' DSO.ai employs AI-driven to optimize placement and directives, achieving up to 20% better PPA in designs compared to traditional methods. Innovus incorporates for predictive and power grid analysis, enabling 10x faster physical design cycles in advanced nodes. Calibre's integration ensures early detection of manufacturing defects, reducing iterations by shifting verification left in the flow. However, these tools suffer from high licensing costs—often exceeding millions of dollars annually per seat—and vendor lock-in due to proprietary formats and ecosystem dependencies, which limit and increase for design teams. In 2025, updates across these suites have enhanced EUV support for sub-3nm nodes, addressing effects and multi-beam masking to maintain productivity amid shrinking geometries.

Analog/Mixed-Signal Simulation and Electromagnetic Tools

Proprietary tools for analog and mixed-signal simulation play a critical role in validating integrated circuits (ICs) by modeling nonlinear behaviors, transient responses, and interactions in complex designs. These simulators, often built on SPICE-like frameworks, enable engineers to predict circuit performance before fabrication, focusing on accuracy for analog blocks like amplifiers, oscillators, and data converters. Leading solutions include Spectre, HSPICE, and HFSS (following ' acquisition of in July 2025), each optimized for specific aspects of analog/mixed-signal and electromagnetic analysis in IC workflows. Cadence Spectre serves as a high-performance fast-SPICE simulator tailored for large-scale analog and RF circuits, emphasizing speed through massive parallelization and smart presets that balance accuracy with runtime efficiency. It supports transistor-level simulations of blocks such as voltage-controlled oscillators (VCOs), delivering up to 10x faster runtime compared to traditional methods via advanced numerical techniques and GPU acceleration, as demonstrated in 2025 deployments on H100 hardware achieving 6x performance gains over CPU-based runs while preserving accuracy. HSPICE, recognized as the industry gold standard for precision, excels in foundry-certified MOS device modeling and verification, providing robust handling of mixed-signal ICs with superior convergence for intricate topologies. Ansys HFSS, a 3D electromagnetic field solver, integrates seamlessly into IC design flows via its HFSS-IC extension, enabling multiphysics simulations from chip to system scale, including advanced packaging and 3DICs, with (FEM) capabilities for full-wave analysis. Comparisons across these tools highlight differences in solver types, particularly for RF applications where harmonic balance methods are essential for steady-state nonlinear analysis of oscillators and mixers. Spectre and HSPICE incorporate solvers to efficiently compute periodic steady-state (PSS) responses in the , reducing simulation time for high-frequency circuits compared to transient methods, while employs FEM-based full-wave solvers for broadband electromagnetic propagation. Noise analysis capabilities vary, with all three supporting thermal, shot, and modeling; HSPICE offers advanced periodic noise analysis for RF blocks, quantifying contributions from active devices, whereas Spectre integrates optimization in its RF toolkit, and extends this to electromagnetic-induced noise in 3D structures. Parasitic extraction focuses on RC and RL networks post-layout, where rule-based and field-solver hybrids in provide high-fidelity RL extraction for inductive effects in mmWave designs, Spectre leverages integrated extraction for fast post-layout netlists, and HSPICE ensures accuracy in RC-dominated analog parasitics through validated models. Performance distinctions arise in convergence algorithms and workflow integrations, with Spectre's adaptive stepping and parallel processing enabling simulations of designs 5x larger than prior generations, improving throughput for mixed-signal verification. Both Spectre and HSPICE provide native support for behavioral modeling, allowing seamless co-simulation of analog and digital domains in AMS designs, while Synopsys integrates via its multiphysics platform for electromagnetic-aware mixed-signal analysis. Post-layout simulation integration is a strength across the board: Spectre automates parasitic inclusion from layouts, HSPICE correlates extracted netlists with silicon measurements for signoff, and Synopsys -IC facilitates 3D EM extraction directly into circuit simulators, reducing iteration cycles in advanced-node flows. In benchmarks, HSPICE demonstrates high accuracy in noise and distortion metrics over generic variants for RF validation, underscoring its role in precision-critical applications. By 2025, enhancements in RF and mmWave support have addressed / demands, with Spectre incorporating AI-driven presets for faster frequency sweeps in sub-6 GHz to mmWave bands, Ansys HFSS 2025 R2 accelerating antenna array simulations by optimizing asymptotic solvers for electrically large environments, and HSPICE refining for beamforming circuits with improved convergence on multi-GHz transients. These updates enable efficient modeling of phased arrays and reconfigurable intelligent surfaces (RIS), where benchmarks show HSPICE maintaining reference accuracy for mmWave models against commercial EDA alternatives, supporting reduced design timelines for next-generation wireless ICs.

PCB Layout and Routing Software

Proprietary PCB layout and routing software enables engineers to create detailed physical designs for printed circuit boards, transitioning from to final manufacturing outputs. Leading tools such as , Allegro, and Siemens Xpedition dominate this space, each offering robust capabilities for handling complex layouts in high-performance applications. provides an integrated environment that seamlessly combines with PCB layout, supporting end-to-end workflows for single- and multi-board designs. Allegro excels in high-speed PCB routing, optimizing for dense interconnects in enterprise-scale projects. Siemens Xpedition focuses on system-level design, facilitating collaboration across multi-board systems and integrating with broader electronic design ecosystems. These tools differ significantly in core capabilities, particularly in layer support, algorithms, and features, which are critical for ensuring reliability in modern electronics. supports up to 32 signal layers and 16 plane layers, including rigid-flex configurations, enabling intricate multi-layer stacks for compact devices. Allegro accommodates up to 256 routing layers, making it suitable for ultra-high-density boards with extensive plane and signal layers. Xpedition handles multi-layer designs with flexible stackups, supporting complex hierarchies for without a strict layer cap in its enterprise edition. Auto- algorithms vary: and Allegro employ shape-based methods, which use gridless approaches to navigate obstacles dynamically and produce optimized traces, contrasting with traditional grid-based routers that snap to predefined coordinates for simpler but less adaptable paths. Xpedition utilizes constraint-driven , combining interactive and automated shape-based techniques to enforce design rules during placement and . is integral across all, with offering built-in for and impedance control, Allegro providing advanced high-speed verification including pre-layout checks for , and Xpedition integrating tools for differential pair tuning and . Additional features enhance manufacturability and interoperability. All three support 3D visualization for clearance checks and mechanical fit validation, with and Allegro providing real-time 3D PCB rendering directly in the editor. (DFMA) tools are prominent: includes real-time component data and rules checking to optimize assembly, Allegro integrates with Valor for DFM analysis including panelization and fiducial placement, and Xpedition leverages Valor NPI for early detection of fabrication issues like via reliability. Integration with MCAD tools, such as , is a key strength; enables bidirectional via its CoDesigner extension, supports ECAD-MCAD workflows through unified data exchange, and Xpedition offers co-design capabilities for multi-disciplinary teams. 's cloud-based collaboration via 365 stands out, allowing real-time sharing and version control across distributed teams. In 2025, these proprietary tools emphasize support for High-Density Interconnect (HDI) technologies, driven by IoT demands for miniaturized, high-performance boards with microvias and fine-pitch components. HDI adoption has surged, with market projections indicating growth to enable denser packaging in edge devices, where tools like Allegro and Xpedition provide specialized via stitching and impedance tuning for HDI stacks. Altium's cloud features further differentiate it by enabling collaborative HDI design reviews, reducing iteration times in IoT workflows. Overall, selection depends on project scale, with Allegro favored for high-speed RF/ microwave, Xpedition for enterprise systems, and Altium for agile, integrated teams.
FeatureAltium DesignerCadence AllegroSiemens Xpedition
Max LayersUp to 32 signal + 16 plane layersUp to 256 routing layersFlexible multi-layer (no fixed max)
Routing TypeShape-based, interactive/autoShape-based, constraint-drivenConstraint-driven, shape-based
Signal Integrity Tools/impedance simulationPre-layout / analysisDifferential tuning/waveform validation
3D VisualizationReal-time renderingIntegrated 3D view3D clearance checks
DFMA SupportReal-time rules/component dataValor integration for fabricationValor NPI for early DFM
MCAD IntegrationBidirectional with ECAD-MCAD data exchangeCo-design with mechanical tools
HDI FocusMicrovia support via layer managerFine-pitch via stitchingHDI stackup optimization

Open Source and Free EDA Software

Bundles and Suites for IC Design

Open source bundles for (IC) design provide accessible, cost-free alternatives to suites, enabling RTL-to-GDSII flows for ASICs and FPGA prototyping without licensing restrictions. These bundles integrate multiple tools into cohesive workflows, supporting digital design from synthesis to physical , and are particularly valuable for , and small-scale production environments. A prominent bundle for ASIC is OpenROAD, which offers a fully automated, no-human-in-the-loop RTL-to-GDSII flow. Developed under a initiative, OpenROAD combines tools for synthesis, floorplanning, placement, clock tree synthesis, , and verification, achieving 24-hour turnaround times for exploration and quality-of-results estimation. For FPGA digital flows, the Yosys+nextpnr combination serves as a key bundle, where Yosys handles synthesis and nextpnr performs architecture-neutral, timing-driven place-and-route, supporting vendor-neutral bitstream generation for FPGAs. These bundles share strong support for open process design kits (PDKs) like the SkyWater 130nm, a collaboration between and that provides comprehensive design rules, device models, and EDA setup files without legal barriers. OpenROAD integrates seamlessly with SkyWater PDKs via the open_pdks installer, enabling layouts compatible with tools like and KLayout. Similarly, Yosys+nextpnr leverages open PDKs for FPGA emulation of ASIC designs, though its focus remains on pre-physical synthesis stages. In terms of advanced features, OpenROAD includes timing-driven placement via RePlAce and TritonRoute, optimizing for wirelength and congestion, alongside clock tree synthesis that balances skew and insertion delay using H-tree topologies. Yosys supports timing-aware synthesis but relies on nextpnr for placement-driven timing closure, which is less mature for multi-corner analysis compared to ASIC flows.
BundlePDK Support (SkyWater 130nm)Timing-Driven PlacementClock Tree Synthesis
OpenROADFull integration via open_pdks for RTL-to-GDSIIYes, via RePlAce optimizerYes, automated with low skew
Yosys+nextpnrPartial, for FPGA prototypingYes, in nextpnr P&RLimited, post-synthesis buffering
The primary strengths of these bundles lie in their absence of licensing fees, allowing unrestricted access for global developers, and their community-driven extensibility through scripting interfaces like Tcl, which enables custom automation of flows without . For instance, OpenROAD's Tcl-based configuration supports rapid iteration and integration of user-defined constraints. However, limitations include inadequate support for commercial IP blocks, which often require closed formats incompatible with open tools, restricting adoption in high-volume production. As of 2025, advancements in the /SkyWater collaboration have enhanced OpenLane—a tapeout-hardened flow built on OpenROAD—facilitating numerous successful chip tape-outs using the Sky130 PDK in multi-project wafer runs. These updates include refined automation for physical design and improved PDK compatibility, demonstrated in LibreLane releases for no-man-in-the-loop generation. In contrast to proprietary suites like tools, open bundles prioritize accessibility for non-commercial innovation.

High-Level and Logic Synthesis Tools

High-level (HLS) and logic synthesis tools in open-source EDA ecosystems enable the transformation of high-level descriptions, such as C/C++ code or (RTL) designs, into gate-level netlists for (IC) implementation. These tools are essential for accelerating productivity in FPGA and ASIC flows, particularly for resource-constrained environments where commercial alternatives may be inaccessible. Key open-source representatives include Yosys for RTL synthesis, Bambu for HLS from C/C++ to RTL, and LegUp for FPGA-targeted HLS, each addressing distinct aspects of the synthesis while supporting modular integration into broader pipelines. Yosys serves as a versatile framework for synthesizing Verilog RTL designs to netlists, incorporating the ABC engine for advanced logic minimization and optimization at the gate level. It excels in multi-level logic synthesis, reducing circuit complexity through techniques like technology mapping and retiming, which balance area and timing trade-offs in post-synthesis results. Bambu, developed at Politecnico di Milano, focuses on HLS by compiling C/C++ applications into synthesizable Verilog or VHDL, emphasizing datapath optimization such as bitwidth analysis and constant multiplication replacement with shifts and adds to minimize resource usage. LegUp, originating from University of Toronto research and later integrated into Microchip's ecosystem while retaining open-source roots, targets FPGA acceleration by synthesizing C functions to hardware modules, achieving competitive area-delay products comparable to commercial HLS tools in benchmarks like processor accelerators. Comparisons across these tools reveal Yosys prioritizing logic depth reduction for timing closure in ASIC flows, while Bambu and LegUp offer superior throughput in FPGA contexts, with significant area savings in evaluated kernels through aggressive scheduling, though at potential costs to initial latency. Support for hardware description languages like Chisel, which generates Verilog via Scala, is native in Yosys through its Verilog-2005 parser, enabling seamless synthesis of parameterized generator outputs. Core features of these tools include automated insertion for enhancement, constraint-driven approaches to meet specifications, and verification integrations to ensure correctness. In Bambu, insertion is facilitated by list-based and speculative scheduling algorithms that parallelize operations, improving initiation intervals in looped structures while adhering to user-specified latency and area constraints via libraries. LegUp supports similar pipelining at the function level, automatically inferring hardware from C pragmas to optimize for FPGA fMAX and area, with co-simulation capabilities for validation. Yosys enables constraint-driven synthesis through scripting for timing budgets and area targets, often invoking ABC for delay-aware mappings. For verification, Yosys integrates formal equivalence checking via the EQY frontend, constructing miter circuits to confirm behavioral equivalence between RTL and representations, supporting bounded with SMT solvers. These features collectively address trade-offs in HLS, where aggressive pipelining in Bambu and LegUp can reduce cycle counts by factors of 5-10 in benchmarks but increase register overhead, contrasting Yosys's focus on combinational optimization for minimal area in logic-heavy designs.
ToolPrimary InputOptimization FocusArea/Timing Trade-off ExampleVerification Integration
Yosys RTLLogic minimization (ABC)Reduces LUTs by 15-25% with minor delay increase in ASIC netsFormal equivalence via EQY miter
BambuC/C++ scheduling, bitwidthSignificant area reduction in FPGA kernels via pipelining, latency halvedCo-simulation with downstream tools
LegUpFunction-level FPGA Competitive area-delay product, 10x in acceleratorsCycle-accurate co-sim
Recent developments in open-source synthesis tools have extended capabilities toward emerging hardware paradigms, with 2025 explorations in optimization influencing logic synthesis methodologies. For instance, frameworks like Yosys have seen enhancements in reversible logic support through integrations with tools such as RevKit, enabling quantum-aware gate mappings for fault-tolerant designs, though full quantum EDA remains nascent in these ecosystems. Benchmarks from 2025 evaluations indicate ongoing improvements in timing predictability for hybrid classical-quantum flows, with Bambu adaptations for irregular multi-threaded applications showing reduced synthesis bugs via automated detection.

Physical Synthesis, Placement, and Layout Tools

Open source tools for physical synthesis, placement, and layout play a crucial role in the back-end design of integrated circuits (ICs), enabling the transformation of synthesized netlists into manufacturable layouts. These tools focus on optimizing placement of standard cells, routing interconnections, and generating physical layouts while adhering to rules. Key representatives include OpenROAD, which provides an automated RTL-to- flow with integrated placement and routing; , an interactive VLSI layout editor; and KLayout, a versatile viewer and editor for verification and manual adjustments. OpenROAD stands out for its end-to-end automation, incorporating the RePlAce algorithm for density-aware placement and TritonRoute for detailed routing, achieving high utilization rates such as 80% in Nangate45 benchmarks for designs like AES cores. Magic excels in manual layout creation with built-in extraction and extraction-to-simulation capabilities, supporting hierarchical cell definitions for complex designs. KLayout complements these by offering scriptable editing and measurement tools, facilitating post-layout refinements. These tools collectively support open process design kits (PDKs) like SkyWater 130nm, ensuring compatibility with standard cell libraries such as Nangate for 45nm processes. In comparisons, OpenROAD demonstrates superior for achieving dense layouts with up to 80% utilization in industrial benchmarks, while and KLayout provide finer control for custom analog-digital interfaces but require more manual intervention. All three integrate (DRC) and layout-versus-schematic (LVS) functionalities: via its native extractor and Netgen for LVS, KLayout through customizable Ruby-based rule decks, and OpenROAD by leveraging external verifiers like those in SkyWater PDK for comprehensive checks. Power grid generation is a strength of OpenROAD, which automates power distribution network (PDN) synthesis during floorplanning to minimize IR drop. Hierarchical design support is universal, with OpenROAD enabling macro placement in partitioned flows, using scalable cell hierarchies, and KLayout handling multi-level transformations without performance loss.
ToolDensity/Utilization ExampleDRC/LVS SupportPower Grid FeaturesPDK/Library Compatibility
OpenROADUp to 80% (Nangate45)Integrated via PDK decksAutomated PDN generationSkyWater 130nm, Nangate 45nm
MagicManual optimization (~70%)Built-in extractor + Netgen LVSBasic via tech filesSkyWater 130nm, MOSIS
KLayoutVerification-focusedScriptable rule decksN/A (viewer/editor)SkyWater 130nm, /OASIS
By 2025, advancements in TritonRoute within OpenROAD have incorporated for design rule violation prediction, enhancing routability for supported process nodes by reducing iterations in detailed routing. These tools process outputs from logic synthesis, such as Yosys-generated netlists, to produce files ready for fabrication.

Schematic Capture and Mixed-Signal Simulation Tools

Open-source tools for and mixed-signal simulation play a crucial role in the early stages of electronic design automation (EDA), enabling engineers to create circuit diagrams, perform analog and mixed-signal analyses, and verify designs without costs. These tools typically integrate graphical interfaces for schematic entry with backend simulators compatible with standards, supporting features like transient, , and noise analyses for circuits involving resistors, capacitors, transistors, and behavioral models. Key representatives include Xyce, , and QUCS, each offering distinct strengths in model compatibility, analysis types, and integration for mixed-signal workflows. Xyce, developed by as a high-performance, SPICE-compatible analog circuit simulator, excels in handling large-scale circuits with parallel processing capabilities, making it suitable for complex mixed-signal simulations. It supports industry-standard compact models such as BSIM for MOSFETs and through its ADMS compiler, allowing seamless integration of behavioral and custom device descriptions. Xyce includes advanced analyses like for statistical variation studies via its .SAMPLING command, which implements random sampling methods, and (HB) for RF nonlinear distortion analysis, enabling efficient steady-state simulations of oscillators and mixers. Additionally, it features circuit netlisting in format, built-in waveform plotting tools, and scripting interfaces, including Python bindings for automated workflows. Recent enhancements in Xyce have expanded support for models, facilitating simulations in neuromorphic computing designs through extensions. Ngspice, an open-source successor to Berkeley SPICE3, provides a robust foundation for mixed-signal simulation with a focus on portability and extensibility across systems. It supports BSIM models for advanced simulations and integration via the OSDI interface since version 39, enabling the use of modern compact models like BSIM-CMG for FinFETs. analysis is natively available for tolerance and yield assessments, allowing parameter variations in components to evaluate circuit reliability. While is not fully implemented in core Ngspice, it can leverage external integrations for RF tasks. Ngspice generates SPICE-compatible netlists from input decks, offers ASCII-based waveform output viewable with tools like , and includes scripting via its interactive command mode or Tcl extensions for batch processing. QUCS (Quite Universal Circuit Simulator) combines with simulation in a unified graphical environment, ideal for of mixed-signal circuits including analog, digital, and RF elements. Its GUI supports hierarchical entry using drag-and-drop components, with automatic netlisting to or its native Qucsator format for backend processing. QUCS integrates simulators like or Xyce for enhanced mixed-signal capabilities, supporting BSIM and models through these backends, along with for statistical analysis and HB via Xyce for RF simulations. Key features include interactive waveform viewers with plotting, truth tables, and diagrams for post-simulation analysis, as well as scripting support through embedded equations and an m-code interface for custom transient solvers. This integration allows users to transition seamlessly from design to verification without manual editing.
FeatureXyceNgspiceQUCS
Model SupportBSIM, (ADMS), PSP, custom memristorsBSIM, (OSDI), HSPICE-compatibleBSIM, (via backends like /Xyce)
Monte Carlo AnalysisYes (.SAMPLING command, parallel-enabled)Yes (native parameter variation)Yes (integrated with backends)
Harmonic Balance (HB)Yes (multi-tone RF analysis)Partial (roadmap item; via integrations)Yes (via Xyce backend for RF)
Netlisting-compatible output netlists from decksAutomatic to SPICE/Qucsator; hierarchical
Waveform ViewingBuilt-in plotting and .PRINT HB outputsASCII/Gnuplot-compatibleGUI-based diagrams, interactive plots
Scripting InterfacesPython bindings, command-lineTcl, interactive modeEquations, m-code for solvers
In comparison, Xyce stands out for high-performance parallel simulations of large mixed-signal systems, particularly in RF and neuromorphic applications, while offers lightweight, portable core simulation with strong model extensibility. QUCS provides the most accessible schematic-to-simulation , bridging the other two for user-friendly mixed-signal . These tools collectively enable cost-effective early-stage verification, though users may combine them—such as QUCS with Xyce—for comprehensive feature coverage.

PCB Design and Routing Tools

Open-source and free PCB design and routing tools provide accessible alternatives for , board layout, and autorouting, enabling hobbyists, educators, and small-scale engineers to create professional-grade printed circuit boards without licensing costs. These tools emphasize modularity, community-driven development, and compatibility with manufacturing standards, contrasting with proprietary options like that offer advanced automation at a premium. Key representatives include , the suite with its PCB component, and standalone autorouters like FreeRouting, each catering to different workflows in PCB design. KiCad stands out as a comprehensive, integrated suite for end-to-end PCB development, featuring , hierarchical design, PCB layout with interactive routing, and a built-in for mechanical verification. Developed by a global community under the Open Hardware Licence, KiCad supports multi-layer boards up to 32 layers and includes plugins for extending functionality, such as custom importers for other EDA formats. Its footprint library exceeds 10,000 symbols and footprints, maintained through collaborative efforts on platforms like , ensuring broad component coverage for common microcontrollers and passives. KiCad generates Gerber files, drill files, and (BOM) in standard formats compatible with fabrication houses like JLCPCB and PCBWay, facilitating seamless production workflows. In comparison, the gEDA suite, comprising tools like gschem for schematics and pcb for layout, adopts a modular approach that allows users to mix and match components for customized pipelines. Licensed under GPL, gEDA's ecosystem supports netlisting, forward/backward annotation between and layout, and basic autorouting via external scripts, though it lacks 's native 3D integration. Its libraries, while smaller at around 2,000-3,000 symbols contributed by users, focus on flexibility for scripting-heavy environments, with Gerber and BOM export capabilities similar to but requiring more manual configuration. FreeRouting, an open-source Java-based autorouter often paired with or gEDA, excels in algorithmic for dense boards, supporting rip-up and retry methods to optimize trace lengths and avoid vias, under the GPL . Across these tools, common features include electrical rule checks (ERC) for integrity and design rule checks (DRC) for layout compliance, such as minimum trace widths and clearance violations, integrated directly in and available via plugins in . They also support integration with open-source simulators like for SPICE-based analysis of analog circuits during the phase, allowing verification of power distribution and without proprietary dependencies. Differential pair , essential for high-speed signals like USB or Ethernet, is natively handled in with length-matching tools, while FreeRouting provides tunable algorithms for it when used standalone. As of 2025, community efforts have introduced AI-powered automation for placement and routing in , reducing design time significantly through plugins and extensions. This development, building on contributions from the LibrePCB project, underscores the evolving scalability of open-source PCB tools for professional applications, with ongoing improvements in library curation and cloud collaboration features.

EDA Tools by Developer and Ecosystem

Major Commercial Vendors and Their Offerings

The electronic design automation (EDA) industry is dominated by three major commercial vendors: Synopsys, Cadence Design Systems, and Siemens EDA. Synopsys holds a leading position in digital IC design tools, with approximately 31% of the global EDA market share in 2024, closely followed by Cadence at 30%, while Siemens EDA commands about 13%. Cadence excels in analog and mixed-signal design as well as PCB tools, whereas Siemens EDA, formed through the 2017 acquisition of Mentor Graphics for $4.5 billion, emphasizes verification and system-level analysis. Synopsys offers a comprehensive portfolio for digital IC design and verification, including the Verdi Automated Debug System, which enables advanced waveform viewing, signal tracing, and AI-assisted debugging to accelerate verification cycles. Cadence's Virtuoso platform supports custom IC design, particularly for analog and RF circuits, integrating schematic capture, layout, and simulation in a unified environment for complex mixed-signal systems. Siemens EDA provides HyperLynx for signal integrity (SI) and power integrity (PI) analysis, allowing early detection of crosstalk, EMI, and PDN issues in high-speed PCB and package designs. Market dynamics underscore the vendors' growth amid rising semiconductor complexity. reported record fiscal 2024 revenue of $6.127 billion, up 15% year-over-year, driven by demand for AI-enabled tools and the completed $35 billion acquisition of in July 2025, enhancing capabilities. and have similarly benefited from ecosystem partnerships, such as collaborations with for certified EDA flows on advanced nodes like N2 and A16, enabling optimized designs for AI and . Vendor differentiation lies in specialized strengths: leads in end-to-end digital flows with tools like Fusion Compiler for synthesis and place-and-route; advances AI-driven automation, such as Cerebrus Intelligent Chip Explorer for optimization across design stages; and EDA prioritizes verification with Questa Advanced Simulator for functional coverage in complex SoCs. These portfolios collectively address the full spectrum of IC and PCB design challenges, supported by subscription-based licensing models that facilitate scalability.

Open Source Projects, Communities, and Contributions

The CHIPS Alliance, hosted by the , serves as a key for (EDA) initiatives, fostering collaboration on hardware design tools and process design kits (PDKs). It encompasses projects such as OpenROAD, an end-to-end digital IC design flow, and the SkyWater 130nm PDK, which was the first foundry-supported PDK released in collaboration with and in 2020. These efforts aim to lower in chip design by providing accessible, royalty-free resources for prototyping and fabrication. Community-driven projects like LibrePCB exemplify grassroots development in EDA, with its GitHub repository maintained by contributors worldwide to support and PCB layout. Similarly, the Yosys Open Synthesis Suite has garnered significant traction, with its primary GitHub repository exceeding 2,500 as of late , reflecting for RTL synthesis in open hardware workflows. The Free and Silicon (FOSSi) Foundation, established in 2015, plays a central role in nurturing these communities by promoting collaboration, hosting events, and advocating for open silicon designs. Corporate contributions have accelerated open source EDA progress, notably through Google's leadership in the OpenTitan project, an RISC-V-based silicon root of trust that reached commercial silicon production in 2025 for integration into devices like Chromebooks. Government funding, including DARPA's support for the OpenROAD project under its Electronics Resurgence Initiative, has provided critical resources to advance automated design flows. Standards from the open hardware movement, such as those defined by the Open Source Hardware Association (OSHWA), further enable and certification of open EDA components. Despite these advances, EDA faces challenges including limited commercial support, which can complicate integration with processes and lead to gaps in verification and signoff capabilities. However, adoption is growing rapidly, with OpenROAD facilitating over 600 silicon-ready tapeouts by 2025 through partnerships like Efabless, demonstrating scalable production for diverse applications.

Integration with AI and Machine Learning

The integration of (AI) and (ML) into electronic design automation (EDA) software has revolutionized chip design by automating complex optimization tasks and enhancing decision-making processes. ML-based placement techniques, for instance, leverage and neural networks to optimize cell and macro positioning, significantly reducing wirelength and improving overall power, performance, and area (PPA). ' DSO.ai platform exemplifies this, using ML to autonomously explore design spaces and achieve up to 15% power reductions alongside substantial die size shrinks of 5% on advanced processes, as demonstrated in over 100 commercial tape-outs. Similarly, predictive timing analysis employs graph neural networks (GNNs) to forecast timing violations pre-route, enabling proactive optimizations and reducing iterations in large-scale designs. Commercial tools like Cerebrus AI Studio further illustrate AI's role in end-to-end flow optimization, applying agentic AI for multi-block SoC designs to coordinate tasks across hierarchical levels and deliver up to 20% better PPA metrics. This platform accelerates design closure by 5x to 10x through and parallel workflows, allowing a single engineer to manage multiple blocks efficiently. In the open-source domain, the OpenROAD project incorporates for routing via the XRoute Environment, a scalable RL framework that trains agents to select and route nets, with baseline results reported for congestion and wirelength on industry benchmarks. These AI enhancements provide key benefits, including faster convergence in optimizing billion-gate designs and better handling of process variations in advanced nodes like 2nm, where traditional methods struggle with increased complexity. By predicting outcomes such as IR drop and timing slacks early, AI mitigates risks from manufacturing variability, as seen in ' successful first-pass silicon on TSMC's N2 process for AI edge devices. As of 2025, AI adoption in EDA has become widespread, with tools like DSO.ai and Cerebrus reporting productivity gains of up to 10x in engineering time, enabling quicker tape-outs and supporting the semiconductor industry's push toward sub-2nm scaling.

Cloud-Based and Collaborative Tools

The transition to cloud-based (EDA) platforms has enabled designers to leverage scalable infrastructure for complex workflows, moving beyond traditional on-premises setups to support distributed teams and on-demand resources. Major commercial offerings include Cloud, which integrates with (AWS) to provide hybrid bursting capabilities for EDA jobs, allowing seamless scaling across on-premises and cloud environments using x86 and ARM-based instances for optimal performance. OnCloud similarly delivers cloud-native solutions optimized for distributed processing in simulation and verification tasks. In the open-source domain, platforms like the cloud-based Open Agile EDA integrate tools such as Yosys for synthesis with continuous integration systems like GitLab CI, facilitating automated flows for logic design and verification without proprietary dependencies. Key features of these cloud platforms emphasize and , with provisions for elastic compute resources that handle large-scale simulations through GPU acceleration, reducing processing times for compute-intensive tasks like timing analysis and power optimization. Real-time collaboration is supported via versioning tools and shared libraries, enabling multiple engineers to access and modify design databases concurrently while maintaining across global teams. These capabilities are particularly valuable in hybrid environments where on-premises tools interface with cloud resources for burst workloads. Cloud-based EDA offers significant advantages, including reduced upfront hardware costs by shifting to pay-per-use models that eliminate the need for dedicated servers and centers. It provides global access for distributed teams, fostering productivity in scenarios accelerated by the , with hybrid cloud adoption becoming prevalent for balancing performance and control. measures, such as customer-managed keys for (IP) protection, ensure confidentiality during transit and storage, mitigating risks in multi-tenant cloud setups. As of 2025, the EDA market, valued at USD 4.18 billion in 2025, reflects growing , driven by the need for flexible infrastructure among startups and established firms alike. This trend underscores a broader shift toward hybrid models, where over 90% of organizations are expected to incorporate elements by 2027, enhancing resilience and innovation in .

References

  1. https://www.synopsys.com/glossary/what-is-electronic-design-automation.html
  2. https://www.cadence.com/en_US/home/explore/what-is-electronic-design-automation.html
  3. https://www.ema-eda.com/ema-resources/blog/pcb-cad-software-comparison-2023/
  4. https://www.guvi.in/blog/top-vlsi-design-tools/
  5. https://www.sw.siemens.com/en-US/technology/electronic-design-automation-eda/
  6. https://www.psmarketresearch.com/market-analysis/electronic-design-automation-market
  7. https://www.sciencedirect.com/topics/computer-science/electronic-design-automation
  8. https://arxiv.org/html/2312.01674v2
  9. https://www.pearsonhighered.com/assets/samplechapter/0/1/3/0/0130449113.pdf
  10. https://www.design-reuse.com/article/61358-synthesis-methodology-netlist-qualification/
  11. https://dl.acm.org/doi/10.1145/3736167
  12. https://www.keysight.com/blogs/en/tech/educ/2024/electronic-design-automation
  13. http://www.ecircuitcenter.com/SpiceTopics/History.htm
  14. https://www.synopsys.com/glossary/what-is-synthesis.html
  15. https://edaplayground.com/
  16. https://www.microwaves101.com/encyclopedias/transient-analysis-using-eda-software
  17. https://www.edn.com/the-different-types-of-analysis-in-circuit-simulation-and-its-importance/
  18. https://ieeexplore.ieee.org/document/10186351
  19. https://www.synopsys.com/glossary/what-is-functional-verification.html
  20. https://verificationacademy.com/topics/formal-verification/formal-coverage/
  21. https://www.intel.com/content/www/us/en/it-management/intel-it-best-practices/increasing-eda-performance.html
  22. http://ieeexplore.ieee.org/iel7/43/8694033/08355999.pdf
  23. https://si2.org/public-standards-and-solutions/
  24. https://www.researchgate.net/publication/3250276_RT-level_ITC%2799_benchmarks_and_first_ATPG_results
  25. https://www.ijareeie.com/upload/2015/april/34A_105_Ramya1.pdf
  26. https://www.researchgate.net/publication/364318159_Application_of_usability_testing_to_GUIs_in_the_electronic_design_automation_industry
  27. https://www.researchgate.net/publication/3893221_Scripting_for_EDA_tools_a_case_study
  28. https://www.10duke.com/learn/software-licensing/software-licensing-models/
  29. https://www.marketgrowthreports.com/market-reports/electronic-design-automation-eda-software-market-112897
  30. https://support.hexagonmi.com/s/article/What-is-the-difference-between-a-node-locked-and-a-floating-license-1527312285408
  31. https://www.keysight.com/us/en/lib/resources/technical-specifications/keysight-eesof-eda--resources-for-students-2175659.html
  32. https://www.futuremarketinsights.com/reports/cloud-electronic-design-automation-eda-market
  33. https://www.snsinsider.com/reports/cloud-electronic-design-automation-market-7849
  34. https://dirox.com/post/hidden-costs-software-development
  35. https://www.keysight.com/us/en/lib/resources/selection-guides/keysight-licensing-overview-terms-and-types.html
  36. https://anysilicon.com/the-ultimate-guide-to-open-source-eda-tools/
  37. https://semiconductor.samsung.com/foundry/safe/eda/
  38. https://semiwiki.com/eda/pulsic/311800-freemium-business-model-applied-to-analog-ic-layout-automation/
  39. https://www.synopsys.com/implementation-and-signoff/physical-implementation/fusion-compiler.html
  40. https://www.cadence.com/en_US/home/tools/digital-design-and-signoff/soc-implementation-and-floorplanning/innovus-implementation-system.html
  41. https://eda.sw.siemens.com/en-US/ic/calibre-design/
  42. https://www.stocktitan.net/news/SNPS/synopsys-and-tsmc-usher-in-angstrom-scale-designs-with-certified-eda-97fyptjwb27j.html
  43. https://www.cadence.com/en_US/home/solutions/advanced-node-solutions/digital-advanced-node.html
  44. https://blogs.sw.siemens.com/calibre/2025/11/05/bridging-the-gap-unlock-seamless-collaboration-in-ic-design-with-calibre-connectivity-interface/
  45. https://www.synopsys.com/implementation-and-signoff/rtl-synthesis-test.html
  46. https://semiwiki.com/wikis/industry-wikis/tsmc-n3-process-node-3nm-wiki/
  47. https://eda.sw.siemens.com/en-US/ic/calibre-design/physical-verification/
  48. https://www.synopsys.com/ai/ai-powered-eda/dso-ai.html
  49. https://bitsilica.com/ai-in-real-world-chip-design-workflows-a-technical-overview/
  50. https://www.ust.com/en/insights/ai-in-cadence-innovus-workflows-10x-faster-physical-design-in-2025
  51. https://www.eetimes.com/are-primary-vendor-deals-bad-for-eda/
  52. https://www.cadence.com/en_US/home/tools/custom-ic-analog-rf-design/circuit-simulation.html
  53. https://www.synopsys.com/implementation-and-signoff/ams-simulation/primesim-hspice.html
  54. https://www.ansys.com/products/electronics/ansys-hfss-ic
  55. https://investor.synopsys.com/news/news-details/2025/Synopsys-Completes-Acquisition-of-Ansys/default.aspx
  56. https://www.cadence.com/en_US/home/tools/custom-ic-analog-rf-design/circuit-simulation/spectre-x-simulator.html
  57. https://www.cadence.com/en_US/home/company/newsroom/press-releases/pr/2025/mediatek-adopts-ai-driven-cadence-virtuoso-studio-and-spectre.html
  58. https://www.cadence.com/en_US/home/resources/datasheets/spectre-simulation-platform-ds.html
  59. https://www.researchgate.net/publication/3701491_Overview_of_computer-aided_analysis_tools_for_RFIC_simulation_Algorithms_features_and_limitations
  60. https://www.linkedin.com/pulse/top-simulation-program-integrated-circuit-emphasis-ne3pc/
  61. https://www.mdpi.com/1996-1073/14/22/7729
  62. https://www.cadence.com/en_US/home/resources/white-papers/revolution-by-evolution-getting-to-the-next-technology-breakthrough-in-analog-simulation-wp.html
  63. https://www.cadfem.net/en/cadfem-informs/newsroom/ansys-release/ansys-release-2025-electronics-hf.html
  64. https://www.edn.com/5g-advanced-innovations-add-rf-design-challenges/
  65. https://www.researchgate.net/publication/395149844_A_Review_on_the_Modeling_of_Millimeter-Wave_Transistors
  66. https://www.altium.com/altium-designer
  67. https://www.cadence.com/en_US/home/tools/pcb-design-and-analysis/allegro-x-design-platform.html
  68. https://eda.sw.siemens.com/en-US/pcb/xpedition/
  69. https://www.altium.com/documentation/altium-designer/pcb/defining-layer-stack
  70. https://www.flowcad.de/datasheets/allegro_pcb_router_ds.pdf
  71. https://eda.sw.siemens.com/en-US/pcb/xpedition/enterprise/
  72. https://resources.altium.com/p/pcb-routing-options-maximize-design-adaptability
  73. https://resources.pcb.cadence.com/blog/2020-automated-routing-building-better-routes
  74. https://www.ema-eda.com/ema-resources/blog/top-pcb-design-software-for-2025-emd/
  75. https://eda.sw.siemens.com/en-US/pcb/valor/valor-npi/
  76. https://www.altium.com/capabilities/design/ecad-mcad
  77. https://www.cadence.com/en_US/home/explore/ecad-mcad.html
  78. https://www.altium.com/develop
  79. https://bencor-llc.com/the-future-of-pcb-technology/
  80. https://iwdfsolutions.com/7-key-pcb-design-trends-shaping-2025-and-beyond/
  81. https://github.com/The-OpenROAD-Project/OpenROAD
  82. https://www.yosyshq.com/open-source
  83. https://community.cadence.com/cadence_blogs_8/b/breakfast-bytes/posts/openroad-open-source-eda-from-rtl-to-gdsii
  84. https://openroad-flow-scripts.readthedocs.io/en/stable/
  85. https://ieeexplore.ieee.org/abstract/document/8735573
  86. https://github.com/YosysHQ/nextpnr
  87. https://github.com/google/skywater-pdk
  88. https://www.skywatertechnology.com/sky130-open-source-pdk/
  89. https://github.com/RTimothyEdwards/open_pdks
  90. https://openroad-flow-scripts.readthedocs.io/en/stable/user/FlowVariables.html
  91. https://openroad-flow-scripts.readthedocs.io/en/latest/tutorials/FlowTutorial.html
  92. https://www.quora.com/What-are-the-pros-and-cons-of-using-open-source-EDA-tools
  93. https://github.com/The-OpenROAD-Project/OpenROAD-flow-scripts
  94. https://ecssria.eu/2025_5
  95. https://www.zerotoasiccourse.com/post/year_update_2024/
  96. https://www.researchgate.net/publication/347688459_Building_OpenLANE_a_130nm_openroad-based_tapeout-proven_flow
  97. https://fossi-foundation.org/blog/2025-08-17-librelane
  98. https://yosyshq.readthedocs.io/projects/yosys/en/stable/introduction.html
  99. https://panda.deib.polimi.it/?page_id=31
  100. https://janders.eecg.utoronto.ca/pdfs/legup_journal.pdf
  101. https://github.com/YosysHQ/yosys
  102. https://re.public.polimi.it/bitstream/11311/998432/1/TCADHLSEVAL2016.pdf
  103. https://janders.eecg.utoronto.ca/pdfs/ACM_TECS_journal.pdf
  104. https://www.epfl.ch/labs/lsi/page-13100-en-html/eda-for-quantum-computing/
  105. https://www.researchgate.net/publication/345775471_Automated_Bug_Detection_for_High-level_Synthesis_of_Multi-threaded_Irregular_Applications
  106. http://opencircuitdesign.com/magic/
  107. https://www.klayout.de/
  108. https://vlsicad.ucsd.edu/Publications/Conferences/370/c370.pdf
  109. https://skywater-pdk.readthedocs.io/
  110. https://github.com/oscc-ip/nangate
  111. https://thegrenze.com/pages/servej.php?fn=8.pdf&name=Comparative%2520Analysis%2520of%2520Open-Source%2520EDA%2520Tool%2520forVLSI%2520Physical%2520Design&id=1143&association=GRENZE&journal=GIJET&year=2022&volume=8&issue=2
  112. https://www.ifte.de/mitarbeiter/lienig/ISPD24_Krinke_pp137_142.pdf
  113. https://www.klayout.de/doc/manual/drc_basic.html
  114. https://skywater-pdk.readthedocs.io/en/main/verification.html
  115. https://openroad.readthedocs.io/en/latest/
  116. https://www.researchgate.net/publication/395877266_AiDRC_Accelerating_Detailed_Routing_by_AI-Driven_Design_Rule_Violation_Prediction_and_Checking
  117. https://xyce.sandia.gov/
  118. https://ngspice.sourceforge.io/
  119. https://qucs.sourceforge.net/
  120. https://xyce.sandia.gov/about-xyce/
  121. https://www.mos-ak.org/silicon_valley_2022/presentations/Keiter_Xyce_AWG_MOS-AK_Dec_7_2022.pdf
  122. https://www.osti.gov/servlets/purl/1592255
  123. https://xyce.sandia.gov/news/
  124. https://github.com/Xyce/Xyce
  125. https://knowm.org/simulating-xyce-openmodels-memristor-models-with-qucs-s-and-xyce/
  126. https://ngspice.sourceforge.io/osdi.html
  127. https://vlsiarchitect.com/ng-spice-open-source-simulator-tool/
  128. https://av.tib.eu/media/52408
  129. https://ngspice.sourceforge.io/roadmap.html
  130. https://qucs-s-help.readthedocs.io/en/legacy/BasSim.html
  131. https://github.com/Qucs/qucs/wiki
  132. https://ra3xdh.github.io/
  133. https://forum.kicad.info/t/more-layers-of-conductors-required/48327
  134. https://www.linkedin.com/posts/autocuro_kicad-just-got-ai-powered-automation-10-activity-7392916360827351040-Sq-e
  135. https://www.trendforce.com/news/2025/06/02/news-china-revenue-at-risk-as-u-s-curbs-slam-eda-giants-impact-on-synopsys-cadence-and-more/
  136. https://www.silicon.co.uk/e-regulation/china-chip-design-620616
  137. https://press.siemens.com/global/en/pressrelease/siemens-closes-mentor-graphics-acquisition
  138. https://www.ema-eda.com/ema-resources/blog/top-eda-companies/
  139. https://www.synopsys.com/verification/debug/verdi.html
  140. https://www.cadence.com/en_US/home/tools/custom-ic-analog-rf-design.html
  141. https://eda.sw.siemens.com/en-US/pcb/hyperlynx/signal-integrity/
  142. https://eda.sw.siemens.com/en-US/pcb/hyperlynx/power-integrity/
  143. https://investor.synopsys.com/news/news-details/2024/Synopsys-Posts-Financial-Results-for-Fourth-Quarter-and-Fiscal-Year-2024/default.aspx
  144. https://www.forbes.com/sites/marcochiappetta/2025/07/18/synopsys-finalizes-ansys-acquisition-to-enable-leading-simulation-enhanced-design/
  145. https://www.synopsys.com/partners/tsmc.html
  146. https://www.cadence.com/en_US/home/company/newsroom/press-releases/pr/2025/cadence-partners-with-tsmc-to-power-next-generation-innovations.html
  147. https://news.siemens.com/en-us/siemens-tsmc-oip-2025/
  148. https://www.synopsys.com/silicon-design.html
  149. https://www.cadence.com/en_US/home/ai/overview.html
  150. https://eda.sw.siemens.com/en-US/ic/verification-and-validation/
  151. https://www.skywatertechnology.com/open-source-asics-take-a-giant-leap-forward-with-first-ever-open-foundry-pdk/
  152. https://opensource.googleblog.com/2023/11/open-source-pdks-joining-linux-foundation-chips-alliance.html
  153. https://github.com/LibrePCB/LibrePCB
  154. https://fossi-foundation.org/
  155. https://abopen.com/news/digital-fossils-a-history-of-free-and-open-source-silicon/
  156. https://opentitan.org/
  157. https://www.thestack.technology/commercial-production-of-opentitan-is-a-risc-v-landmark-2/
  158. https://www.chipsalliance.org/news/improving-the-openlane-asic-build-flow-with-open-source-systemverilog-support/
  159. https://www.swissbit.com/en/company/news-press/research-consortium-sets-standards-in-the-field-of-open-source-hardware/
  160. https://smart-silicon.net/open-source-eda-can-it-lead-a-new-era-of-hardware-design/
  161. https://today.ucsd.edu/story/open-source-semiconductor-chip-design-tool-celebrates-success
  162. https://www.synopsys.com/blogs/chip-design/eda-tools-dso-ai-100-tapeouts.html
  163. https://news.synopsys.com/2023-02-07-AI-designed-Chips-Reach-Scale-with-First-100-Commercial-Tape-outs-Using-Synopsys-Technology
  164. https://www.sciencedirect.com/science/article/abs/pii/S0167926024001263
  165. https://www.cadence.com/en_US/home/tools/digital-design-and-signoff/soc-implementation-and-floorplanning/cadence-cerebrus-ai-studio.html
  166. https://arxiv.org/abs/2305.13823
  167. https://www.synopsys.com/blogs/chip-design/ai-edge-devices-tsmc-n2-silicon-success.html
  168. https://aws.amazon.com/blogs/hpc/seamlessly-burst-eda-jobs-to-aws-using-synopsys-cloud-hybrid-solution/
  169. https://www.acldigital.com/blogs/cloud-eda-semiconductor-design
  170. https://wiki.f-si.org/index.php?title=Making_Open_Silicon_Design_Everywhere:_Using_Cloud-based_Open_Agile_EDA_Platform
  171. https://www.synopsys.com/blogs/chip-design/high-performance-compute-eda-cloud.html
  172. https://techcommunity.microsoft.com/blog/azurearchitectureblog/validating-scalable-eda-storage-performance-azure-netapp-files-and-specstorage-s/4459517
  173. https://www.synopsys.com/blogs/chip-design/fundamentals-of-cloud-computing-and-its-role-in-eda.html
  174. https://www.synopsys.com/blogs/chip-design/comparing-cloud-on-premises-security-chip-design.html
  175. https://www.precedenceresearch.com/cloud-eda-market
  176. https://www.crnasia.com/news/2024/hybrid-cloud/gartner-90-of-organizations-will-adopt-hybrid-cloud-through
Add your contribution
Related Hubs
User Avatar
No comments yet.