Hubbry Logo
RyzenRyzenMain
Open search
Ryzen
Community hub
Ryzen
logo
8 pages, 0 posts
0 subscribers
Be the first to start a discussion here.
Be the first to start a discussion here.
Ryzen
Ryzen
from Wikipedia

Ryzen
General information
LaunchedMarch 2, 2017; 8 years ago (2017-03-02)[1]
Marketed byAMD
Designed byAMD
Common manufacturers
Performance
Max. CPU clock rate1.2 GHz to 5.7 GHz
HyperTransport speeds800 MT/s to 2 GT/s
Physical specifications
Cores
    • Mainstream: 4‍–‍16
    • High-end desktop: 8‍–‍64
    • Workstation: 12‍–‍96
GPURadeon (APU variants)
Sockets
Architecture and classification
Technology node14 nm to 4 nm
MicroarchitectureZen (Zen, Zen+, Zen 2, Zen 3, Zen 3+, Zen 4, Zen 5)
Instruction set
Extensions
Variants
History
PredecessorsA-Series
FX
Ryzen 3 PRO 2100GE
Ryzen 3 PRO 2100GE[2]

Ryzen (/ˈrzən/ RY-zən)[3] is a brand[4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments; accelerated processing units (APUs), marketed for mainstream and entry-level segments and embedded systems applications.

A majority of AMD's consumer Ryzen products use the AM4 and AM5 platforms. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast and workstation markets. Ryzen Threadripper uses different, larger sockets such as TR4, sTRX4, sWRX8, and sTR5, which support additional memory channels and PCI Express lanes. AMD moved to the AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022.

History

[edit]
AMD Ryzen 7 3700X top and pins

Background

[edit]

Ryzen uses the Zen CPU microarchitecture, a redesign that returned AMD to the high-end CPU market after a decade of near-total absence since 2006.[5] AMD's primary competitor, Intel, had largely dominated this market segment starting from the 2006 release of their Core microarchitecture and the Core 2 Duo.[6] Similarly, Intel had abandoned their prior Pentium 4 lineup, as its NetBurst microarchitecture was uncompetitive with AMD's Athlon XP in terms of price and efficiency, and with their Athlon 64 and 64 X2, they were outmatched in terms of raw performance as well.[7]

Until Ryzen's initial launch in early 2017, Intel's market dominance over AMD continued to grow with the launch of the Intel Core CPU lineup and branding, as well as the successful rollout of their now well-known tick-tock CPU release strategy. The strategy was most famous for alternating between a new CPU microarchitecture and a new fabrication node each year. Intel followed that release cadence for almost a decade, starting with Intel's initial Q3 2006 launch of 65 nm Conroe, and continuing until the release of the 14 nm Broadwell desktop CPUs, which were delayed a year from a planned 2014 launch to Q3 2015. The delay necessitated a refresh of their pre-existing 22 nm Haswell CPU lineup in the form of Devil's Canyon, and thus officially ended tick-tock as a practice.[8][9] The events proved to be incredibly important for AMD, as Intel's inability to further sustain tick-tock was critically important in providing both the initial and continually growing market openings for AMD's Ryzen CPUs, and indeed the Zen CPU microarchitecture as a whole to succeed.

Also of note is the release of AMD's Bulldozer microarchitecture in 2011, which, despite being a ground up CPU design like Zen, had been designed and optimized for parallel computing above all else, leading to starkly inferior real-world performance in any workload that was not highly multi-threaded, which was still the case for the vast majority at that time. This caused it to be woefully uncompetitive in essentially every area outside of raw multi-thread performance and its use in low power APUs with integrated Radeon graphics.[10] Despite a die shrink and several revisions of the Bulldozer architecture, performance and power efficiency failed to catch up with Intel's competing products.[11] Consequently, all of this forced AMD to completely abandon the entire high-end CPU market (including desktop, laptops, and server/enterprise) until Ryzen's release in 2017.

Ryzen is the consumer-level implementation of the newer Zen microarchitecture, a complete redesign that marked the return of AMD to the high-end central processing unit (CPU) market, offering a product range capable of competing with Intel.[12][13] Having more processing cores, Ryzen processors offer greater multi-threaded performance at the same price point relative to Intel's Core processors.[14] The Zen architecture delivers more than 52% improvement in instructions per cycle (clock) over the prior-generation Bulldozer AMD core, without raising electrical power use.[15] The changes to the instruction set architecture also adds binary-code compatibility to AMD's CPU.[16]

Since the release of Ryzen, AMD's CPU market share has increased while Intel's appears to have stagnated or regressed.[17]

Release

[edit]

AMD announced a new series of processors on December 13, 2016, named Ryzen, and delivered them in Q1 2017,[4] the first of several generations. The 1000 series featured up to eight cores and sixteen threads, with a 52% instructions per cycle (IPC) increase over their prior CPU products, namely AMD's previous Excavator microarchitecture.[15]

The second generation of Ryzen processors, the Ryzen 2000 series, released in April 2018, featured the Zen+ microarchitecture. The aggregate performance increased 10% (of which approximately 3% was IPC and 6% was clock frequency).[18] Most importantly, Zen+ fixed the cache and memory latencies that had been major weak points.[19]

The third generation of Ryzen processors launched on July 7, 2019, based on AMD's Zen 2 architecture, featuring significant design improvements with a 15% average IPC boost, a doubling of floating point capability to a full 256-bit-wide execution data path much like Intel's Haswell released in 2014,[20] a shift to an multi-chip module (MCM) style chiplet package design, and a further shrink to Taiwan Semiconductor Manufacturing Company (TSMC)'s 7 nm fabrication process.

On June 16, 2020, AMD announced new Ryzen 3000XT series processors with increased boost clocks and other small performance enhancements compared to 3000X processors.[21]

On October 8, 2020, AMD announced the Zen 3 architecture for their Ryzen 5000 series processors, featuring a 19% IPC improvement over Zen 2, while being built on the same 7 nm TSMC node with out-of-the-box operating boost frequencies exceeding 5 GHz for the first time since AMD's Piledriver.[22] This was followed by an unusually short stop-gap release of Ryzen 6000 mobile-only series processors on January 4, 2022, using the modestly changed Zen 3+ core on a 6 nm process by TSMC, with claims up to 15% performance uplift gains from frequency rather than IPC.[23]

The Ryzen 7000 series was released September 27, 2022 for desktops, featuring the new Zen 4 core with a 13% uplift in IPC and 15% increase in frequency for a claimed nearly 30% in single thread performance.[24] The Ryzen 7000 series also features a brand new AM5 socket and uses DDR5 memory.

Threadripper series

[edit]

Threadripper, which is geared for high-end desktops (HEDT) and professional workstations, was not developed as part of a business plan or a specific roadmap. Instead, a small team inside AMD saw an opportunity to develop the benefits of Ryzen and EPYC CPU roadmaps, so as to give AMD the lead in desktop CPU performance. After some progress was made in their spare time, the project was greenlit and put in an official roadmap by 2016.[25]

Ryzen AI

[edit]

Ryzen AI is the brand name for AMD's AI technology, based on intellectual property from AMD's acquisition of Xilinx.[26] AMD Ryzen AI can work across a neural processing unit (NPU) powered by XDNA architecture, based on AI engines,[27] a Radeon graphics engine, and Ryzen processor cores.[27] Introduced on the Ryzen 7040 mobile series in mid 2023, it can be used to run neural network applications such as camera background effects, voice recognition, photo artifact removal and skin smoothing.[28] Neural network tasks can be computationally intensive to run on a general-purpose CPU, resulting in significant energy usage and a larger thermal footprint. An AI accelerator is a coprocessor specifically designed to process neural networks efficiently, similar in concept to other work-offloading specialized processing units such as video decoders[26] or FPGAs.

Software support for Microsoft Windows was made widely available in December 2023,[29] while software support for Linux was introduced in January 2024.[30]

Product lineup

[edit]

Ryzen 1000

[edit]

Desktop

[edit]
  • Socket AM4 for Ryzen and Socket TR4 for Ryzen Threadripper.[31][32]
  • Based on first generation Zen. Ryzen CPUs based on Summit Ridge architecture. Threadripper based on Whitehaven architecture.
  • 4.8 billion transistors per 192 mm2[33] 8-core "Zeppelin" die[1] with one die being used for Ryzen and two for Ryzen Threadripper.
  • Stepping: B1[34]
  • Memory support:
    • Ryzen dual-channel: DDR4–2666 ×2 single rank, DDR4–2400 ×2 dual rank, DDR4–2133 ×4 single rank, or DDR4–1866 ×4 dual rank.[31][35]
    • Ryzen Threadripper quad-channel: DDR4–2666 ×4 single rank, DDR4–2400 ×4 dual rank, DDR4–2133 ×8 single rank, or DDR4–1866 ×8 dual rank.
  • Instructions sets: x87, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, CLMUL, AVX, AVX2, FMA3, CVT16/F16C, ABM, BMI1, BMI2, SHA.[16]
  • All Ryzen-branded CPUs (except PRO variants) feature unlocked multipliers.
  • AMD's SenseMI Technology monitors the processor continuously and uses Infinity Control Fabric to offer the following features:[31][36][37]
    • Pure Power reduces the entire ramp of processor voltage and clock speed, for light loads.
    • Precision Boost increases the processor voltage and clock speed by 100–200 MHz if three or more cores are active (five or more, in the case of Threadripper, and by 300 MHz); and significantly further when less than three are active (less than five, in the case of Threadripper).[38]
    • XFR (eXtended Frequency Range) aims to maintain the average clock speed closer to the maximum Precision Boost, when sufficient cooling is available.[39][non-primary source needed]
    • Neural Net Prediction and Smart Prefetch use perceptron based neural branch prediction inside the processor to optimize instruction workflow and cache management.
  • Ryzen launched in conjunction with a line of stock coolers for Socket AM4: the Wraith Stealth, Wraith Spire and Wraith Max. This line succeeds the original AMD Wraith cooler, which was released in mid-2016.[40] The Wraith Stealth is a bundled low-profile unit meant for the lower-end CPUs with a rating for a TDP of 65 W, whereas the Wraith Spire is the bundled mainstream cooler with a TDP rating of 95 W, along with optional RGB lighting on certain models. The Wraith Max is a larger cooler incorporating heatpipes, rated at 140 W TDP.
  • In December 2019, AMD started producing first generation Ryzen products built using the second generation Zen+ architecture.[41] An example is the Ryzen 5 1600, with new batches having an "AF" identifier instead of its usual "AE", essentially being an underbinned Ryzen 5 2600 with the same specifications as the original Ryzen 5 1600.
Overview of desktop Ryzen 1000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen Threadripper 1000 Whitehaven Zen (1st gen) 8–16 none
Ryzen 1000 / 1000X Summit Ridge 4–8
Ryzen 1000 (AF) Pinnacle Ridge Zen+ 4–6

Ryzen 2000

[edit]

Desktop

[edit]

The first Ryzen 2000 CPUs, based on the 12 nm Zen+ microarchitecture, were announced for preorder on April 13, 2018[42] and launched six days later. Zen+ based Ryzen CPUs are based on Pinnacle Ridge architecture,[43] while Threadripper CPUs are based on the Colfax architecture. The first of the 2000 series of Ryzen Threadripper products, introducing Precision Boost Overdrive technology, followed in August. The Ryzen 7 2700X was bundled with the new Wraith Prism cooler.

In January 2018, AMD announced the first two Ryzen desktop APUs with integrated Radeon Vega graphics under the Raven Ridge codename. These are based on first generation Zen architecture. The Ryzen 3 2200G and the Ryzen 5 2400G were released in February.[44]

Overview of desktop Ryzen 2000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen Threadripper 2000 Colfax Zen+ 12–32 none
Ryzen 2000 / 2000X Pinnacle Ridge 4–8
Ryzen 2000G Raven Ridge Zen (1st gen) 4 Radeon Vega (GCN 5), up to 11 CU

Mobile

[edit]

In May 2017, AMD demonstrated a Ryzen mobile APU with four Zen CPU cores and Radeon Vega GPU.[45] The first Ryzen mobile APUs, codenamed Raven Ridge, were officially released in October 2017.[46]

  • 4.95 billion[47] transistors on a 210 mm2 die,[47] based on a modified 14 nm Zeppelin die where four of the cores are replaced by an integrated fifth-generation GCN-based GPU.
  • Precision Boost 2[43]
  • 16 external PCIe 3.0 lanes (four each to chipset and M.2 socket; eight to a PCIe slot). In 2019, AMD released some new dual core Zen mobile parts branded as 300 or 3000, codenamed Dali.[citation needed]
Overview of laptop Ryzen 2000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 2000 Raven Ridge Zen (1st gen) 2–4 Radeon Vega (GCN 5), up to 11 CU

Embedded

[edit]
Great Horned Owl
[edit]

In February 2018 AMD announced the V1000 series of embedded Zen+ Vega APUs, based on the Great Horned Owl architecture, with four SKUs.[48]

Banded Kestrel
[edit]

In April 2019 AMD announced another line of embedded Zen+ Vega APUs, namely the Ryzen Embedded R1000 series with two SKUs.[49]

Ryzen 3000

[edit]

Desktop

[edit]

On May 27, 2019 at Computex in Taipei, AMD launched its third generation Ryzen processors which use AMD's Zen 2 architecture. For this generation's microarchitectures, Ryzen uses Matisse, while Threadripper uses Castle Peak. The chiplet design separates the CPU cores, fabricated on TSMC's 7FF process, and the I/O, fabricated on GlobalFoundries' 12LP process, and connects them via Infinity Fabric.[50] The Ryzen 3000 series uses the AM4 socket similar to earlier models and is the first CPU to offer PCI Express 4.0 (PCIe) connectivity.[51] The new architecture offers a 15% instruction-per-clock (IPC) uplift and a reduction in energy usage. Other improvements include a doubling of the L3 cache size, a re-optimized L1 instruction cache, a larger micro-operations cache, double the AVX/AVX2 bandwidth, improved branch prediction, and better instruction pre-fetching.[50] The 6, 8 and 12 core CPUs became generally available on July 7, 2019, and 24 core processors were launched in November.[52]

The competing Intel Core i9-10980XE processor has only 18 cores and 36 threads. Another competitor, the workstation-oriented Intel Xeon W-3275 and W-3275M, has 28 cores, 56 threads, and cost more when launched.[citation needed]

The 4, 6 and 8 core processors have one core chiplet. The 12 and 16 core processors have two core chiplets. In all cases the I/O die is the same.[50]

The Threadripper 24 and 32 core processors have four core chiplets. The 64 core processor has eight core chiplets. All Threadripper processors use the same I/O die.

Desktop and mobile APUs are based on the Picasso microarchitecture, a 12 nm refresh of Raven Ridge, offering a modest 6% increase in clock speeds (up to an additional 300 MHz maximum boost), Precision Boost 2, an increase of up to 3% in IPC from the move to the Zen+ core with its reduced cache and memory latencies, and newly added solder thermal interface material for the desktop parts.[53] Fabricated at GlobalFoundries, this gives Picasso an aggregate 10% performance uplift from the "original" 14 nm Zen-based Raven Ridge series initially released in 2017.

Overview of desktop Ryzen 3000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen Threadripper PRO 3000 Castle Peak Zen 2 12–64 none
Ryzen Threadripper 3000 24–64
Ryzen 3000 / 3000X Matisse 4–16
Ryzen 3000G Picasso Zen+ 4 Radeon Vega (GCN 5), up to 11 CU

Mobile

[edit]

In 2019, AMD first released the Ryzen 3000 APUs, consisting only of quad core parts. Then in January 2020, they announced value dual-core mobile parts, codenamed Dalí, including the Ryzen 3 3250U and lower-end Athlon-branded parts.

Overview of laptop Ryzen 3000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 3000 Picasso Zen+ 2–4 Radeon Vega (GCN 5), up to 11 CU
Ryzen 3 3250U,
Ryzen 3 3200U
Dali Zen (1st gen) 2 Radeon Vega (GCN 5), 3 CU

Ryzen 4000

[edit]

Desktop

[edit]

The Ryzen 4000 APUs are based on Renoir, a refresh of the Zen 2 Matisse CPU cores, coupled with Radeon Vega GPU cores. They were released only to OEM manufacturers in mid-2020. Unlike Matisse, Renoir does not support PCIe 4.0.[54]

Ryzen PRO 4x50G APUs are the same as 4x00G APUs, except they are bundled a Wraith Stealth cooler and are not OEM-only.[55] It is possible this is a listing mistake, since 4x50G CPUs are unavailable on retail (as of Oct 2020) and PRO SKUs are usually the OEM only parts.

In April 2022, AMD released the Ryzen 5 4600G to retail, and launched the Ryzen 4000 series of CPUs without integrated graphics, for budget-oriented users.[56] Unlike the Ryzen 3000 series CPUs which are based on "Matisse" cores, these new Ryzen 4000 series desktop CPUs are based on "Renoir" cores and are essentially APUs with the integrated graphics disabled.

Overview of desktop Ryzen 4000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 4000 Renoir Zen 2 4–6 none
Ryzen 4000G 4–8 Radeon Vega (GCN 5), up to 8 CU

Mobile

[edit]

Zen 2 APUs, based on the 7 nm Renoir microarchitecture, commercialized as Ryzen 4000.[57][58][59]

Overview of laptop Ryzen 4000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 4000 Renoir Zen 2 4–8 Radeon Vega (GCN 5), up to 8 CU

Embedded

[edit]
Grey Hawk
[edit]

In November 2020, AMD announced the V2000 series of embedded Zen 2 Vega APUs.

Ryzen 5000

[edit]

Desktop

[edit]

The desktop Ryzen 5000 series, based on the Zen 3 microarchitecture, was announced on October 8, 2020.[60][61] They use the same 7 nm manufacturing process, which has matured slightly.[62] Mainstream Ryzen 5000 CPUs are codenamed Vermeer. Enthusiast/workstation Threadripper 5000 CPUs are codenamed Chagall,[63] initially named Ryzen Threadripper 4000 under the codename Genesis.[64]

In contrast to their CPU counterparts, the APUs consist of single dies with integrated graphics and smaller caches. The APUs, codenamed Cezanne, forgo PCIe 4.0 support to keep power consumption low.[65]

Overview of desktop Ryzen 5000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen Threadripper PRO 5000 Chagall Zen 3 12–64 none
Ryzen 5000 / 5000X / 5000X3D Vermeer 6–16
Ryzen 5000G Cezanne 4–8 Radeon Vega (GCN 5), up to 8 CU
Ryzen 7 5700
Ryzen 5 5500
Ryzen 3 5100

Mobile

[edit]

The 5000 series includes models based on the Zen 2 microarchitecture (codename Lucienne) and Zen 3 microarchitecture. The codenames of the Zen 3-based mobile APUs are Cezanne for the 2021 models and Barceló for the 2022 models. HX models are unlocked, allowing them to be overclocked if the host device manufacturer has exposed that functionality. Simultaneous multithreading (SMT) is now standard across the lineup unlike the 4000-series Ryzen Mobile.

Overview of laptop Ryzen 5000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 7 5700U,
Ryzen 5 5500U,
Ryzen 3 5300U
Lucienne Zen 2 4–8 Radeon Vega (GCN 5), up to 8 CU
Ryzen 5000 Cezanne Zen 3 4–8
Barcelo 2–8

Ryzen 6000

[edit]

Mobile

[edit]

At CES 2022, AMD announced the Ryzen 6000 mobile series. It is based on the Zen 3+ architecture, which is Zen 3 on 6 nm with efficiency improvements, and is codenamed Rembrandt. Other noteworthy upgrades are RDNA2 based graphics, PCIe 4.0 and DDR5/LPDDR5 support. Ryzen PRO versions of these processors were announced on April 19, 2022[66] and use a 6x50 naming scheme.

Overview of laptop Ryzen 6000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 6000 Rembrandt Zen 3+ 6–8 Radeon 6x0M (RDNA 2), up to 12 CU

Ryzen 7000

[edit]

Desktop

[edit]
AMD Ryzen 9 7900X processor

In May 2022 AMD revealed its roadmap showing the Ryzen 7000 series of processors for release later that year, to be based on the Zen 4 architecture in 5 nm (codenamed Raphael).[67][68] Included are DDR5 and PCIe 5.0 support as well as the change to the new AM5 socket. On May 23, 2022 at AMD's Computex keynote, AMD officially announced the Ryzen 7000 to be released in Fall 2022, showing a 16-core CPU reaching boost speeds of 5.5 GHz and claiming a 15% increase in single-thread performance.[69] The initial four models of the Ryzen 7000 series, ranging from Ryzen 5 7600X to Ryzen 9 7950X, were launched on September 27, 2022.[70]

The L2 cache per core is doubled to 1 MB from Zen 3. The I/O die has moved from a 12 nm process to 6 nm and incorporates an integrated RDNA 2 GPU with two CUs on all Ryzen 7000 models (except the Ryzen 5 7500F), as well as DDR5 and PCIe 5.0 support.[71][72] DDR4 memory is not supported on Ryzen 7000. According to Gamers Nexus, AMD said that the RDNA GPU was intended for diagnostic and office purposes without using a discrete GPU and not for gaming.[73] The operating power of AM5 is increased to 170 W from AM4's 105 W, with the absolute maximum power draw or "Power Package Tracking" (PPT) being 230 W.[74]

The Ryzen Threadripper and Threadripper PRO 7000 series were released on November 21, 2023. Threadripper features up to 64 cores, while Threadripper PRO 7000 features up to 96 cores. These new HEDT and workstation processor lineups both utilize a new socket, sTR5, as well as DDR5 and PCIe 5.0. Two new chipsets have been introduced for the sTR5 socket: TRX50 and WRX90.[75][76]

In conversations with Gamers Nexus regarding the later Ryzen 7 9800X3D, AMD engineers revealed that in 7000X3D series processors, the 1st-generation V-Cache and accompanying structural silicon above the cores effectively act as a thermal insulator, thus inhibiting cooling of the cores.[77] The cores running hotter thus limited the clock frequencies of 7000X3D series processors, compared to their non-X3D counterparts.[77] The engineers refuted earlier speculation that the temperature of the V-Cache had instead been the limiting factor.[77]

Overview of desktop Ryzen 7000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen Threadripper PRO 7000 Storm Peak Zen 4 12–96 none
Ryzen Threadripper 7000 24–64
Ryzen 7000 / 7000X / 7000X3D Raphael 6–16 Radeon (RDNA 2), 2 CU

Mobile

[edit]

The Ryzen 7000 mobile series initially launched in September 2022 with the Ryzen 7020 Mendocino line of low-end Zen 2 ultra mobile processors.[78]

In early 2023, the rest of the Ryzen 7000 mobile lineup was released, starting with Ryzen 7030, Ryzen 7035, and later Ryzen 7045 and Ryzen 7040 series processors.

The Ryzen 7020 series targets the "everyday computing" segment.[79] It is a new Zen 2 design based on 6 nm process and RDNA 2 integrated graphics.

The Ryzen 7030 series is a refresh of Ryzen 5000 series processors codenamed "Barcelo-R",[80] targeting the "mainstream thin-and-light" segment.[79]

The Ryzen 7035 series is a refresh of Ryzen 6000 series processors codenamed "Rembrandt-R",[80] targeting "premium thin-and-light" laptops.[79]

The Ryzen 7040 series is a new design based on Zen 4, targeting "elite ultrathin" segment.[79] It integrates a built-in AI accelerator (branded as "Ryzen AI") for the first time in an x86 processor,[81] and features RDNA 3 integrated graphics with up to 12 compute units.

The Ryzen 7045 series is the top of the range, based on Zen 4. It targets "extreme gaming and creator" laptops, i.e. desktop replacement class laptops,[79] with models providing up to 16 cores. It uses a chiplet package built using a separate CCD (Core Complex Die, containing processor cores) and I/OD (Input/Output Die), the same as those used in Raphael desktop processors.[82]

Altogether, there are four different CPU architectures, and three different GPU architectures used across the various models in the 7000 series lineup.[83]

With the launch of the mobile Ryzen 7000 series, a new CPU model naming system was also introduced, which is used with Ryzen and Athlon mobile processors launching from this point onwards, as follows:[84]

Ryzen/Athlon xabc:

  • x – timeline of creation (7 for 2022, 8 for 2023, etc)
  • a – performance segment (1 for low end, 7 for high-end, 9 for enthusiast, etc)
  • b – Microarchitecture the processor is based on (1 for Zen / Zen+, 3 for Zen 3 / 3+, 4 for Zen 4, 5 for Zen 5, etc)
  • c – feature / minor performance segment (0 for lower segment, 5 for higher segment)

The new naming system has drawn criticism for being overly complex and confusing to consumers.[85][86] Desktop processors continue to use the old naming system.[87]

Overview of laptop Ryzen 7000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 7045 Dragon Range Zen 4 6–16 Radeon 610M (RDNA 2), 2 CU
Ryzen 7040 Phoenix 4–8 Radeon 7x0M (RDNA 3), up to 12 CU
Ryzen 7035 Rembrandt-R Zen 3+ Radeon 6x0M (RDNA 2), up to 12 CU
Ryzen 7030 Barcelo-R Zen 3 Radeon Vega (GCN 5), up to 8 CU
Ryzen 7020 Mendocino Zen 2 2–4 Radeon 610M (RDNA 2), 2 CU

Ryzen Z1

[edit]

Handheld

[edit]

On April 25, 2023, AMD announced the Ryzen Z1 series of APUs for "handheld PC gaming consoles", and announced that the Asus ROG Ally would use the Ryzen Z1 Extreme processor.[88] AMD promised compatibility with Windows 11, among other operating systems.[88]

Overview of handheld Ryzen Z1 series models
Model line Architecture Core count Integrated graphics
Ryzen Z1 Zen 4 6-8 RDNA 3, 4–12 CU

Ryzen 8000

[edit]

Desktop

[edit]

On January 8, 2024, AMD announced the Ryzen 8000G series of desktop APUs for the AM5 socket at the 2024 Consumer Electronics Show. These APUs are based on Zen 4 and feature up to 12 CUs of RDNA3 integrated graphics. Furthermore, the upper-end models such as Ryzen 5 8600G and Ryzen 7 8700G feature "Ryzen AI", which is a neural processing unit (NPU) for artificial intelligence PC applications.[89] AMD claims that the integrated graphics in Ryzen 8000G APUs is capable of playing AAA games such as Cyberpunk 2077 and Far Cry 6 at 1080p low settings.[90]

On April 1, 2024, AMD quietly released Ryzen 8000 series processors without integrated graphics, which also use the Zen 4 architecture. These processors are essentially based on the Ryzen 8000G series but with the integrated graphics and NPU disabled. The Ryzen 7 8700F however can provide AI acceleration when paired with a Radeon discrete GPU that supports it.[91]

Overview of desktop Ryzen 8000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 8000 Phoenix Zen 4 6–8 none
Ryzen 8000G 4–8 Radeon 7x0M (RDNA 3), up to 12 CU

Mobile

[edit]

A refresh of Ryzen 7040 mobile processors named the Ryzen 8040 and 8045 series were announced on December 6, 2023.[92] These processors feature small firmware and software optimizations for performance and have up to 60% faster NPU performance (6 TOPS higher) compared to Ryzen 7040.[93] A refresh of the Dragon Range series was added on April 10, 2025, primarily featuring minor clock speed adjustments.[94]

Overview of mobile Ryzen 8000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 8045HS
Ryzen 8040HS
Hawk Point Zen 4 4–8 Radeon 7x0M (RDNA 3), up to 12 CU
Ryzen 8045HX Dragon Range Refresh Zen 4 8–16 Radeon 610M (RDNA 2), 2 CU

Ryzen 9000

[edit]

Desktop

[edit]

The Ryzen 9000 series of desktop processors, codenamed "Granite Ridge", were announced on June 3, 2024 at a Computex presentation. Utilizing the Zen 5 microarchitecture and built on a TSMC 4 nm process, Granite Ridge features up to 16 cores, uses the AM5 socket and has the same up-to-two-CCDs and one I/O die chiplet layout as the direct predecessor line of CPUs, Raphael. The initial lineup consists of four models with no 3D V-Cache variants, like with the Ryzen 7000 series at launch.[95] Ryzen 9000 processors were originally scheduled to launch at the end of July 2024, but had been delayed to early August for quality control reasons.[96]

On October 21, AMD teased that it would launch X3D model(s) (featuring 3D V-Cache) in the series on November 7.[97] On October 31, AMD announced it would release a Ryzen 7 9800X3D processor.[98] The 9800X3D will feature 2nd-generation 3D V-Cache, wherein the V-Cache has been moved from above the CCD to below the CCD.[98] This change is claimed to lower the CCD temperature, thus allowing for higher clock frequencies.[98] Originally, 9000 series X3D models had been expected to arrive in January 2025.[99]

On January 6, 2025, AMD announced that it would release 9900X3D and 9950X3D desktop processors in Q1 2025.[100] The models will have 2 CCDs, only one of which will feature 2nd-generation 3D V-Cache.[101]

In January 2025, AMD stated that there were no technical barriers to adding 2nd-generation 3D V-Cache to both CCDs of a CPU.[102][103] However, internal testing led them to conclude that games would not benefit enough from such configurations, making them economically infeasible; and thus AMD declined to launch dual 3D V-Cache variants of their CPUs.[102][103]

Overview of desktop Ryzen 9000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 9000 / 9000X / 9000X3D Granite Ridge Zen 5 6–16 Radeon (RDNA 2), 2 CU

Mobile

[edit]

The Ryzen 9000 series of mobile processors, codenamed "Fire Range", were announced on January 6, 2025 at CES.[104]

Overview of mobile Ryzen 9000 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen 9000HX / 9000HX3D Fire Range Zen 5 12–16 Radeon (RDNA 2), 2 CU

Ryzen AI 300

[edit]

Mobile

[edit]

Alongside the Ryzen 9000 desktop series, AMD also introduced the Ryzen AI 300 series of elite ultrathin mobile processors codenamed "Strix Point" on June 3, 2024 at Computex. It features up to 12 cores, a third-generation Ryzen AI NPU based on XDNA 2 and up to 16 compute units (CUs) of RDNA 3.5 integrated graphics. The NPU provides up to 50 TOPS for AI inference processing. These new processors also deviate from the naming scheme used with Ryzen 7000 and 8000 series mobile processors, instead using a three-digit model numbering system similar to Intel's Core and Core Ultra 3/5/7/9 series.[105] AMD has allegedly decided not to introduce a whole range of SKUs that previously existed, namely U (ultra-low power) and H(S) (high performance) models and instead OEMs are now allowed to configure the APU thermals as they see fit ranging from 15 to 54 W.[citation needed]

The codename "Krackan Point" and high-end codename "Strix Halo" additions to the 300 series were announced on January 6, 2025 at CES.[106][107][108]

Overview of mobile Ryzen AI 300 series models
Model line Codename Architecture Core count Integrated graphics
Ryzen AI 300 Strix Point Zen 5
Zen 5c
10–12 Radeon 8x0M (RDNA 3.5), up to 16 CU
Ryzen AI 7 350,
Ryzen AI 5 340
Krackan Point 6–8 Radeon 8x0M (RDNA 3.5), up to 8 CU
Ryzen AI MAX+ 395,
Ryzen AI MAX 390,
Ryzen AI MAX 385,
Ryzen AI MAX 380
Strix Halo Zen 5 6–16 Radeon 80x0S (RDNA 3.5), up to 40 CU

Ryzen 200

[edit]

Mobile

[edit]

The Ryzen 200 series of mobile processors, codenamed "Hawk Point Refresh", were announced on January 6, 2025 at CES.[106][107]

Overview of mobile Ryzen 200 series models
Model line Codename Architecture
Ryzen 200 Hawk Point Refresh Zen 4
Zen 4c

Ryzen Z2

[edit]

Mobile

[edit]

On January 6, 2025, AMD announced the Ryzen Z2 series of APUs at CES, as a sequel to its previous Ryzen Z1 series; at launch they included three models, the hexa-core Z2 and Z2 Extreme (which use the Zen 4 and Zen 5 architectures respectively), and the quad-core Z2 Go, which is based on Zen 3,[109][110] and exclusive to the Lenovo Legion Go S handheld.[111] In June 2025, AMD announced two additional Z2 models, the Ryzen AI Z2 Extreme (which adds a neural processing unit) and the low-end, Zen 2-based Ryzen Z2 A.[112]

Overview of handheld Ryzen Z2 series models
Model line Architecture Core count Integrated graphics
Ryzen AI Z2 Extreme Zen 5 8–16 RDNA 3.5, 16 CU
Ryzen Z2 Extreme Zen 5 8–16 RDNA 3.5, 16 CU
Ryzen Z2 Zen 4 8–16 RDNA 3, 12 CU
Ryzen Z2 Go Zen 3+ 4–8 RDNA 2, 12 CU
Ryzen Z2 A Zen 2 4–8 RDNA 2, 8 CU

Initial reception

[edit]

The first Ryzen 7 (1700, 1700X, and 1800X) processors debuted in early March 2017 and were generally well received by hardware reviewers.[113][114][115] Ryzen was the first brand new architecture from AMD in five years, and without very much initial fine-tuning or optimization, it ran generally well for reviewers.[116] Initial Ryzen chips ran well with software and games already on the market, performing exceptionally well in workstation scenarios, and well in most gaming scenarios. Compared to Piledriver-powered FX chips, Zen-powered Ryzen chips ran cooler, much faster, and used less power. IPC uplift was eventually gauged to be 52% higher than Excavator, which was two full generations ahead of the architecture still being used in AMD's FX-series desktop predecessors like the FX-8350 and FX-8370.[1] Though Zen fell short of Intel's Kaby Lake in terms of IPC, and therefore single-threaded throughput, it compensated by offering more cores to applications that can use them. Power consumption and heat emission were found to be competitive with Intel, and the included Wraith coolers were generally competitive with higher-priced aftermarket units.

Ryzen 7 1800X's multi-threaded performance, in some cases while using Blender or other open-source software, was around four times the performance of the FX-8370, or nearly double that of the Core i7-7700K.[117] One reviewer found that Ryzen chips would usually outperform competing Intel's Core i7 processors for a fraction of the price when all eight cores are used.[117]

However, one complaint among a subset of reviewers was that Ryzen processors lagged behind their Intel counterparts when running older games, or some newer games at mainstream resolutions such as 720p or 1080p.[118] AMD acknowledged the gaming performance deficit at low resolutions during a Reddit "Ask Me Anything" thread, where it explained that updates and patches were being developed.[119] Subsequent updates to Ashes of the Singularity: Escalation and Rise of the Tomb Raider increased frame rates by 17-31% on Ryzen systems.[120][121] In April 2017, developer id Software announced that, in the future, its games would exploit the greater parallelism available on Ryzen CPUs.[122]

It has been suggested that low threaded applications often result in Ryzen processors being underused, yielding lower than expected benchmark scores, because Zen relies on its core count to make up for its lower IPC rating than that of Kaby Lake.[123][124][125] However, AMD and others have argued thread scheduling is not the fundamental issue to Windows 10 performance.[126][127]

Operating system support

[edit]

Windows

[edit]

AMD verified that computers with Ryzen CPUs can boot Windows 7 and Windows 8 both 64- and 32-bit. However, newer hardware including AMD Ryzen and Intel Kaby Lake and later is only officially supported by Microsoft with the use of Windows 10. Windows Update blocks updates from being installed on newer systems running older versions of Windows, though that restriction can be circumvented with an unofficial patch.[128] Windows 11 is only officially supported on Ryzen APUs and CPUs using Zen+ architecture or newer; systems running Zen architecture-based CPUs or APUs are not entitled to receive updates.[129][130][131]

Although AMD initially announced that Ryzen chipset drivers would not be provided for Windows 7,[132] its chipset driver packages do in fact list and include them.[133]

Linux

[edit]

Full support for Ryzen processors' performance features in Linux requires kernel version 4.10 or newer.[134]

Known issues

[edit]

Spectre

[edit]

Like nearly all modern high performance microprocessors, Ryzen was susceptible to the "Spectre" vulnerabilities. The vulnerabilities can be mitigated without hardware changes via microcode updates and operating system workarounds, but the mitigations incur a performance penalty.[135] Ryzen and Epyc suffer up to 20% penalty from the mitigations,[136] depending on workload, comparing favorably with a penalty of in some benchmarks up to 30% for Intel Core and Xeon processors,[137][138] in part as a result of the AMD processors not requiring mitigation against the related Meltdown vulnerability.[139]

Launched in 2019, Zen 2 includes hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[50][140]

Segmentation fault

[edit]

Some early shipments of Ryzen 1000 series processors produced segmentation faults on some workloads on Linux, especially while compiling code with GNU Compiler Collection (GCC).[141] AMD offered to replace the affected processors with newer ones that are unaffected by the problem.[142]

Alleged issues by CTS Labs

[edit]

In early 2018, Israeli computer security consultancy firm CTS Labs stated that they had discovered several major flaws in the Ryzen components ecosystem,[143] publicly disclosing them after giving AMD 24 hours to respond and raising concerns and questions regarding their legitimacy,[144][145] though they were later confirmed by two separate security firms.[146] AMD has since stated that while the flaws are real and will be fixed via microcode updates, their severity was overstated as physical access to the hardware is required to exploit the flaws.[147]

See also

[edit]

References

[edit]
Revisions and contributorsEdit on WikipediaRead on Wikipedia
from Grokipedia
AMD Ryzen is a brand of x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, laptop, workstation, server, and embedded applications. Introduced in 2017, Ryzen processors are built on the Zen microarchitecture family. Later generations employ a chiplet-based design that enables scalable core counts, high performance, and improved power efficiency across consumer and professional workloads such as gaming, content creation, and AI acceleration. The Ryzen lineup debuted with the first-generation Ryzen 1000 series (codenamed Summit Ridge) in March 2017, featuring up to 8 cores on a 14 nm process node and marking AMD's resurgence in the high-end CPU market after years of trailing competitors. Subsequent generations have evolved the architecture: Zen+ (Ryzen 2000 series, 2018) refined the 14 nm node for better overclocking; Zen 2 (Ryzen 3000 series, 2019) shifted to a 7 nm process with up to 16 cores and introduced 7 nm chiplets; Zen 3 (Ryzen 5000 series, 2020) delivered a 19% increase in instructions per clock (IPC) and unified the L3 cache; Zen 4 (Ryzen 7000 series, 2022) adopted a 5 nm core process with integrated RDNA 2 graphics and up to 5.7 GHz boost clocks; and Zen 5 (Ryzen 9000 series, 2024, including desktop and mobile X3D variants released in 2025 such as the Ryzen 9 9955HX3D for gaming laptops) advanced to a 4 nm node with a 16% IPC uplift. Key features of Ryzen processors include support for simultaneous multithreading (SMT) to double thread counts, large L3 caches up to 128 MB in gaming-optimized X3D variants with 3D V-Cache technology for superior frame rates (including mobile variants such as the Ryzen 9 9955HX3D in gaming laptops), support for Resizable BAR (also known as ReBAR or Smart Access Memory/SAM when paired with compatible AMD GPUs) in compatible systems for enhanced gaming performance, and compatibility with DDR5 memory and PCIe 5.0 interfaces in newer models. High-end variants like Ryzen Threadripper offer up to 96 cores for professional workloads in content creation and engineering, while mobile Ryzen AI series integrate up to 50 TOPS of NPU performance for on-device AI tasks. These processors power platforms using AM4 and AM5 sockets for desktops, emphasizing upgradability and efficiency.

History

Background

AMD's Bulldozer microarchitecture, introduced in 2011 with the FX-series desktop processors, marked a bold attempt to regain competitive ground against Intel's Core i-series but ultimately fell short. The architecture promised high multi-threaded performance through its shared core design, yet it delivered underwhelming single-threaded results and exhibited significantly higher power consumption than contemporaries like Intel's Sandy Bridge processors. These issues stemmed from architectural compromises, such as fused cores that prioritized core count over per-core efficiency, leading to AMD's declining market share in the CPU segment. Facing these setbacks, AMD pivoted strategically by initiating the Zen project in 2012 under the leadership of renowned architect Jim Keller, who rejoined the company to overhaul its x86 core design. The effort targeted an ambitious uplift, initially aiming for at least 40% improvement in instructions per clock (IPC) over the Excavator microarchitecture—a Piledriver successor—though final measurements confirmed a 52% IPC gain. Parallel to this, AMD explored the K12 project, an ARM-compatible CPU initiative started around the same time, but abandoned it circa 2015 due to resource constraints and feasibility challenges in balancing it with the x86-focused Zen development. To enable Zen's fabrication, AMD forged key manufacturing partnerships, relying on for its 14nm FinFET process to produce initial Zen-based components, while securing capacity with for subsequent advanced nodes to mitigate potential delays. These alliances were critical amid AMD's financial pressures, providing scalable production for what would become the Ryzen lineup. The strategic shift gained momentum with executive changes in October 2014, when was appointed CEO, replacing , and she emphasized products like —powered by —as central to 's revival and long-term competitiveness. Under Su's guidance, AMD streamlined operations and refocused on innovation in core technologies to address prior architectural shortcomings.

Development

The Zen microarchitecture's development emphasized a modular chiplet-based to address challenges in high-core-count processors, diverging from AMD's prior monolithic approaches. Central to this was the introduction of Core Complex Dies (CCDs), each housing multiple Zen cores with dedicated caches, paired with a separate I/O Die (IOD) managing controllers, PCIe lanes, and other peripherals. This separation allowed independent optimization of compute and I/O elements, improving manufacturing yields and enabling configurations from 4 to 32 cores by stacking multiple CCDs on a single IOD. The choice facilitated cost-effective scaling for server applications while maintaining compatibility with platforms. To enhance thread-level parallelism, the Zen core implemented simultaneous multithreading (SMT), allowing two threads to execute concurrently per core by sharing execution resources like the integer and floating-point units while maintaining separate register files. This marked AMD's first widespread adoption of SMT in x86 processors since earlier experimental efforts, aiming to increase resource utilization by up to 30% in multi-threaded workloads without significantly impacting single-thread performance. SMT complemented the core's wider dispatch and retirement widths, contributing to overall efficiency gains. By late 2015, completed initial prototype testing of Zen-based silicon, validating the through rigorous simulations and hardware evaluations that confirmed performance targets were met. These prototypes underwent extensive verification to ensure reliability across varied workloads. Following this milestone, proceeded to on ' 14 nm FinFET process in late 2015, transitioning from earlier development phases to full production preparation in ; this node choice supported the chiplet's power and density requirements, as explored further in manufacturing details. A pivotal innovation was Infinity Fabric, AMD's scalable interconnect protocol for inter-die communication, providing high-bandwidth links (up to 36 GB/s bidirectional per link) with low latency to unify the chiplets as a coherent system. This fabric enabled seamless data transfer between CCDs and the IOD, mitigating bottlenecks in multi-chiplet setups. The overall Zen design delivered a 52% improvement in instructions per clock (IPC) over the Excavator microarchitecture, driven by deeper pipelines, larger caches, and branch prediction enhancements, positioning it competitively against contemporary rivals.

Major releases

AMD unveiled the first Ryzen processors, the 1000 series based on the Zen microarchitecture, at CES 2017, with retail availability beginning on March 2, 2017. In 2018, AMD expanded the Ryzen lineup with the 2000 series desktop processors, launched on April 19, alongside initial mobile offerings and APUs featuring integrated Vega graphics. This was followed in 2019 by the 3000 series, introduced at Computex on May 27 and available starting July 7, which further broadened mobile and APU segments with Zen 2 architecture. The 5000 series debuted in 2020 as 's first Zen 3-based desktop processors, announced on October 8 and released on November 5, marking a generational shift that skipped a 4000 series designation for desktops while emphasizing unified cache designs. In 2022, AMD introduced the AM5 socket alongside the 7000 series processors, unveiled on August 29 and launched on September 27, transitioning to DDR5 memory and PCIe 5.0 support for future-proofing consumer desktops. The architecture arrived in 2024 with the 9000 series desktop processors, announced at on June 2 and available from July, paired with the Ryzen AI 300 mobile series for AI-enhanced laptops starting in Q3. In 2025, the models with enhanced 3D V-Cache were announced at CES on January 6 and became available in Q1, including the and 9900X3D on March 12. Later that year, released the Threadripper 9000 series for high-end desktops on July 31, following the PRO variant's introduction on July 23, both leveraging for workstation applications.

Architecture

Zen microarchitecture evolutions

The Zen microarchitecture represents AMD's foundational shift toward high-performance x86 cores, emphasizing improvements in instructions per clock (IPC), cache efficiency, and execution throughput to compete with industry leaders. Introduced in 2017, the initial Zen design marked a departure from prior architectures like Excavator, focusing on a wider execution engine and modular core complexes (CCX) to balance single-threaded performance with multi-core scalability. Subsequent generations built iteratively on this base, refining branch prediction, vector processing, and interconnects while adopting advanced manufacturing nodes for density and power efficiency. These evolutions prioritized conceptual advancements in pipeline design and data bandwidth, enabling Ryzen processors to excel in diverse workloads from gaming to data center tasks. AMD Core Performance Boost serves as the standard boosting technology, allowing Ryzen processors to opportunistically exceed base clock speeds, such as up to approximately 5.6-5.7 GHz in gaming workloads, based on thermal, power, and workload conditions; it is enabled by default in modern BIOS versions. The first-generation , launched in 2017 and fabricated on a by , introduced a 4-core CCX configuration where each complex shared a 8 MB L3 cache, optimizing latency for intra-complex communication. This design achieved a 52% IPC uplift over the preceding architecture, driven by enhancements in the core engine, including a wider integer pipeline with four execution units and improved . A key feature was the floating-point unit's support for wide 256-bit operations through paired 128-bit fused multiply-add (FMA) units, which effectively handled AVX2 instructions by splitting them across cycles, boosting vector throughput for compute-intensive applications. These changes restored AMD's competitiveness in single-threaded performance while maintaining compatibility with existing x86 ecosystems. Zen 2, debuting in 2019 on TSMC's 7 nm process, advanced the architecture through chiplet-based unification, allowing multiple core chiplets to interconnect via Infinity Fabric for scalable core counts beyond monolithic dies. It delivered a 15% IPC gain over Zen 1, primarily from front-end optimizations like larger branch target buffers and a more efficient decode stage, alongside backend improvements in execution port utilization. Notably, Zen 2 introduced full-speed AVX2 support with two native 256-bit FMA units, eliminating the cycle penalties of the prior generation and doubling floating-point throughput for workloads like scientific simulations. This shift to chiplets also enhanced yield and power scaling, setting the stage for higher-density configurations without proportional increases in complexity. Building on 7 nm refinements in 2020, unified the CCX into an 8-core structure per die, providing 32 MB of shared L3 cache accessible to all cores with reduced latency penalties compared to 's dual 4-core setup. The architecture realized a 19% IPC uplift over , fueled by superior branch prediction via an expanded predictor and larger return stack buffer, which minimized misprediction stalls in branch-heavy code paths. Additional gains came from a redesigned load/store unit with higher bandwidth, improving data movement efficiency and overall balance. These evolutions emphasized single- performance for consumer desktops, enhancing cache coherency and reducing inter-CCX overheads that had previously impacted latency-sensitive tasks. Zen 4, introduced in 2022 on a 5 nm process, further optimized the core for broader instruction set support and execution parallelism, achieving a 13% IPC increase over through a deeper and enhanced scheduler capable of dispatching more micro-operations per cycle. A major addition was compatibility, implemented via double-pumped 256-bit vector units to process 512-bit operations over two cycles, enabling acceleration in AI and without full hardware redesign. The also featured a larger dispatch queue and improved accuracy, contributing to better handling of irregular access patterns. These refinements maintained the paradigm while focusing on per-core efficiency, allowing sustained higher clocks under thermal constraints. The latest Zen 5 iteration, rolling out in 2024 on a 4 nm process, pushes IPC gains up to 16% beyond by widening key datapaths and enhancing vector execution. It introduces native 512-bit execution for instructions, eliminating the double-pump latency of and providing single-cycle throughput for 512-bit FMAs, which significantly boosts performance in vectorized workloads like . Complementing this, Zen 5 doubles L1 data cache bandwidth to 64 bytes per cycle—up from 32 bytes—via a reconfigured 48 KB 12-way cache and expanded load/store ports, reducing bottlenecks in data-intensive applications. Branch prediction sees further sophistication with a larger global history predictor, ensuring minimal disruptions in for modern software stacks. Overall, these advancements solidify Zen's trajectory toward balanced, high-bandwidth computing across client and server domains.

Manufacturing processes

The initial Ryzen processors, based on the Zen microarchitecture, were manufactured using GlobalFoundries' 14 nm FinFET process (14LPP), which provided improved performance over prior nodes but suffered from relatively lower transistor density compared to competitors' equivalent technologies, resulting in elevated production costs for AMD. The subsequent Zen+ refresh for the Ryzen 2000 series transitioned to GlobalFoundries' optimized 12 nm LP process, an incremental enhancement offering up to 15% higher density and better power efficiency at iso-performance, though it still constrained clock speeds and overall scaling due to inherent node limitations. These constraints prompted AMD to partner with for the microarchitecture in the Ryzen 3000 series, leveraging the foundry's to achieve approximately 1.45 times the transistor density of the prior 14 nm node, enabling denser designs and substantial gains in core count and efficiency. For in the Ryzen 5000 series, AMD employed a refined variant with , which by late had matured to yields over 80%, supporting reliable high-volume production and further refinements in power delivery. Advancing to for the Ryzen 7000 series, fabrication utilized TSMC's 5 nm node for the core complex dies (CCDs) to maximize compute density, paired with a 6 nm node for the I/O die (IOD) incorporating low-power enhancements derived from mobile architectures, which collectively improved system-level power efficiency by up to 25% at equivalent performance levels compared to Zen 3. The microarchitecture, powering the Ryzen 9000 series, shifted to TSMC's 4 nm (N4P) node across chiplets, delivering a targeted 20% performance-per-watt uplift through enhanced scaling, optimized interconnects, and refined partitioning that minimizes latency in multi-die configurations.

Integrated components

Ryzen processors incorporate various integrated components, including , memory controllers, and neural processing units (NPUs), to enhance system-on-chip (SoC) efficiency and performance in and select mainstream models. These components are tightly integrated with the CPU cores via AMD's Infinity Fabric interconnect, enabling high-bandwidth communication for tasks like rendering, AI inference, and data transfer. The integrated in Ryzen evolved from the architecture in the 2000, 3000, 4000, and 5000 series, which utilized up to 12 compute units (CUs) fabricated on 14 nm and 7 nm processes. Vega-based iGPUs, such as those in the Ryzen 7 2700U and similar mobile , provided capable entry-level for light gaming and multimedia, with clock speeds reaching up to 1.4 GHz in higher-end configurations. These GPUs supported 12 and APIs, delivering playable performance in titles at low settings while prioritizing power efficiency for laptops and compact desktops. The Ryzen 7000 series desktop processors feature RDNA 2-based iGPUs with 2 CUs for basic display output. In systems paired with a discrete GPU, the integrated GPU can be used for display output, allowing the discrete GPU to dedicate its resources fully to compute or graphics workloads such as AI inference or rendering, thereby avoiding performance contention. Mobile variants like the Phoenix (Ryzen 7040 series) introduce RDNA 3-based iGPUs with up to 12 CUs and boost clocks up to 2.7 GHz. This upgrade improved rasterization and compute efficiency over Vega, enabling better support for modern features like hardware-accelerated ray tracing in select workloads. In the Ryzen 8000 mobile series (Hawk Point) and Ryzen AI 300 series (Strix Point), the integrated graphics use the and RDNA 3.5 architectures, offering up to 12 CUs in Hawk Point and up to 16 CUs in Strix Point models, with enhanced video encoding support for efficient 8K streaming and content creation. RDNA 3/3.5 iGPUs, such as the Radeon 890M, deliver up to 5.9 TFLOPS of FP32 performance, making them suitable for gaming at medium settings and AI-enhanced graphics tasks, while maintaining compatibility with AV1 decode/encode for next-generation video codecs. AMD's XDNA NPU was first integrated in the Ryzen 7000 mobile series, providing up to 10 of AI performance for on-device tasks like image recognition and noise suppression. This first-generation XDNA focused on low-power , enabling features in applications such as without relying on cloud processing. Performance scaled significantly in the Ryzen AI 300 series, where the second-generation XDNA 2 NPU achieves up to 50 , supporting advanced generative AI models and meeting Copilot+ PC requirements for local execution of large language models. Infinity Fabric serves as the high-speed interconnect for Ryzen's integrated components, including dual-channel DDR4/DDR5 memory controllers and I/O interfaces, with clock speeds evolving from 3 GHz in Zen 1 to 5 GHz in for improved latency and bandwidth. Early implementations in Zen 1 supported up to 32 GB/s per channel for DDR4, while later generations optimized for DDR5 with asynchronous modes to balance FCLK, MCLK, and UCLK ratios. For Ryzen platforms supporting DDR5, DDR5-6000 MT/s allows optimal 1:1 synchronization with Infinity Fabric (FCLK) for the best performance-stability balance; higher speeds like 6200-6600 MT/s often prove unstable due to integrated memory controller (IMC) limitations and individual CPU variances. Starting with the Ryzen 7000 series, Infinity Fabric enables PCIe 5.0 support with up to 28 lanes (16 for GPU, 4 for NVMe storage), doubling bandwidth to 64 GB/s per x16 link compared to PCIe 4.0 for faster data transfer in AI and graphics workloads.

Product lineup

Ryzen 1000 series

The Ryzen 1000 series, introduced in March 2017, marked AMD's entry into high-performance desktop computing with the Zen microarchitecture, targeting mainstream and enthusiast users through the AM4 socket platform. These processors support dual-channel DDR4-2666 memory and provide 24 PCIe 3.0 lanes for expansion, but lack integrated graphics, necessitating a discrete GPU for display output. Prominent desktop models include the flagship Ryzen 7 1800X, an unlocked 8-core, 16-thread processor with a 3.6 GHz base clock, capable of boosting to 4.0 GHz across all cores under multi-threaded workloads, and a 95 W TDP; it launched at an MSRP of $499. Complementing this is the Ryzen 5 1600, a 6-core, 12-thread option with a 3.2 GHz base clock and 65 W TDP, offering balanced performance for gaming and productivity at a more accessible price point. For embedded and industrial applications, the Ryzen Embedded V1000 series extends the lineup with system-on-chip (SoC) designs integrating up to 4 Zen cores/8 threads and graphics, supporting TDPs from 12 to 54 , dual-channel DDR4-3200 with ECC, and features like 4K display output for thin-client and automation systems. In terms of power characteristics, the Ryzen 7 1800X demonstrates efficiency with a peak draw of around 140 W under sustained heavy loads, staying within the AM4 socket's 142 W limit while delivering competitive multi-threaded throughput.

Ryzen 2000 series

The Ryzen 2000 series processors, codenamed Pinnacle Ridge for desktop variants, represented AMD's second-generation Ryzen lineup, built on an enhanced Zen+ microarchitecture and manufactured using a 12 nm process node. Launched in 2018, this series delivered a modest 3% improvement in instructions per clock (IPC) over the prior Zen-based Ryzen 1000 series, alongside higher clock speeds enabled by Precision Boost 2 technology and better thermal management for sustained performance. These advancements allowed for up to 15% better multi-threaded productivity and gaming results compared to first-generation models, while maintaining compatibility with the AM4 socket for desktop and APU configurations. Desktop processors in the Ryzen 2000 series targeted and gaming, with the flagship Ryzen 7 2700X offering 8 cores and 16 threads, a base clock of 3.7 GHz, a maximum boost of 4.3 GHz, and a 105 W TDP. This model supported dual-channel DDR4-2933 memory and PCIe 3.0, providing robust multi-threaded capabilities for tasks like and , while including the Wraith Prism cooler for potential. Other desktop SKUs, such as the Ryzen 5 2600, scaled down to 6 cores and 12 threads at lower power envelopes, emphasizing value for mainstream builds on AM4 motherboards. The series supported up to 16 threads in consumer desktop processors like the 2700X, enabling efficient parallel processing without requiring discrete GPUs for lighter workloads. The introduction of mobile processors in the Ryzen 2000 series expanded 's presence in laptops, with the low-power U-series designed for ultrathin designs. For instance, the Ryzen 7 2700U featured 4 cores and 8 threads, a configurable TDP of 15 W, base clocks up to 2.2 GHz with boosts to 3.8 GHz, and integrated 10 graphics supporting up to 10 compute units for improved battery life and light gaming. These processors prioritized efficiency for office productivity and , offering up to 44% better multi-threaded performance than competing chips at the time, while integrating seamlessly with Windows Hello and other modern features. Accelerated processing units (APUs) brought discrete-level to budget desktops, with the Ryzen 5 2400G providing 4 cores and 8 threads, base clocks of 3.6 GHz boosting to 3.9 GHz, a 65 W TDP, and 11 integrated with 11 compute units for gaming at low settings. Launched at a , it enabled affordable entry into PC gaming without a separate GPU, supporting dual-channel DDR4-2933 and the AM4 socket for easy upgrades. This APU exemplified the series' focus on integrated solutions, delivering playable frame rates in titles like and CS:GO through 's architecture optimizations. For embedded applications, the Ryzen Embedded V2000 series addressed needs with up to 8 cores and 16 threads, configurable TDPs from 10-54 W, and support for up to four 4K displays via integrated graphics. These processors enhanced power efficiency for industrial systems like and thin clients, offering significant performance uplifts in AI and real-time processing compared to prior embedded offerings. Integrated graphics in mobile and APU models, such as Vega 10 and Vega 11, provided capable on-chip rendering without discrete cards, as further explored in the architecture section.

Ryzen 3000 series

The Ryzen 3000 series processors, powered by the Zen 2 microarchitecture, represented AMD's first foray into 7 nm manufacturing using TSMC's process node for mainstream desktop CPUs, launching in 2019 to deliver substantial improvements in instructions per clock and multi-threaded performance. This generation introduced PCIe 4.0 support on desktop platforms, providing double the bandwidth of PCIe 3.0 for enhanced connectivity with storage and graphics cards, particularly when paired with the X570 chipset. The series solidified AMD's position in the desktop market by offering competitive core counts and efficiency, appealing to gamers, creators, and productivity users seeking high-performance AM4 socket solutions. Desktop models in the Ryzen 3000 lineup utilized a design, with each core (CCD) featuring 32 MB of shared L3 cache to support up to 16 cores across two chiplets in higher-end configurations. The flagship Ryzen 9 3950X, released in November 2019, provided 16 cores and 32 threads, a base clock of 3.5 GHz boosting to 4.7 GHz, a 105 W TDP, and a launch price of $749, enabling superior multi-threaded workloads such as and compared to prior generations. This processor exemplified the series' desktop dominance, achieving up to 22% better performance in select applications over the previous Ryzen 2000 series. Expanding beyond pure CPUs, the Ryzen 3000 series included mobile variants like the Ryzen 7 3750H, a 4-core, 8-thread processor with a configurable 35-45 W TDP, base clock of 2.3 GHz boosting to 4.0 GHz, and integrated Radeon Vega 10 graphics, targeting mid-range laptops for balanced productivity and casual gaming. These H-series chips maintained compatibility with DDR4 memory and emphasized power efficiency for portable devices. The series also included APU offerings like the Ryzen 5 3400G, a Zen+-based 4-core, 8-thread processor with a 65 W TDP, base clock of 3.7 GHz boosting to 4.2 GHz, and 11 integrated graphics with 11 compute units, released in July 2019 for cost-effective desktop builds without a discrete GPU for entry-level gaming and office tasks. This APU supported up to 64 GB of DDR4 memory and PCIe 3.0 for versatile system configurations.

Ryzen 4000 series

The Ryzen 4000 series consists of mobile processors based on the microarchitecture, codenamed Renoir, and was launched by in early 2020 exclusively for laptops. These chips marked AMD's first widespread deployment of 7nm process technology in x86 mobile processors, enabling higher core counts in thinner form factors while integrating graphics. Built on a monolithic die, the series features up to 8 MB of L3 cache per core complex (CCX), supporting improved multi-threaded performance for productivity and light tasks in ultrathin laptops. The H-series processors target high-performance thin-and-light laptops with a configurable TDP around 45 W, exemplified by the Ryzen 7 4800H, which offers 8 cores and 16 threads with a base clock of 2.9 GHz and boost up to 4.2 GHz, paired with integrated 7 graphics featuring 7 compute units. This model represented AMD's first 8-core mobile offering available broadly across OEM systems, providing significant multithreaded gains over prior generations for gaming and professional workloads in portable devices. The integrated graphics deliver capable performance for casual gaming and media tasks at 1080p resolutions without a discrete GPU. For lower-power ultrathin laptops, the U-series focuses on efficiency with configurable TDPs from 6 W to 15 W, as seen in the Ryzen 5 4500U, a 6-core, 6-thread processor with a 2.3 GHz base clock boosting to 4.0 GHz and Vega 6 graphics with 6 compute units. These processors prioritize battery life and thermal management in slim designs, leveraging Zen 2's instructions-per-clock improvements for balanced single- and multi-threaded efficiency. Overall, the Ryzen 4000 series expanded AMD's presence in the mobile market by delivering competitive performance against Intel's contemporary offerings in compact, power-constrained environments.

Ryzen 5000 series

The Ryzen 5000 series processors, powered by AMD's , marked a pivotal in –2021, bringing enhanced single-threaded performance and efficiency to both desktop and mobile platforms. Announced in and launching for desktops in , the series delivered a 19% uplift in instructions per clock (IPC) compared to the Zen 2-based Ryzen 3000 series, achieved through optimizations like doubled branch prediction accuracy and reduced pipeline latency. This IPC gain, combined with higher clock speeds, positioned the lineup as a leader in gaming and tasks. A key architectural innovation in the desktop variants was the unified 32 MB L3 cache shared across each eight-core complex within the chiplet , enabling faster data sharing between cores and minimizing inter-core latency— a step up from the split cache in prior generations. Mobile processors in the series adopted a monolithic die under the Cezanne codename, prioritizing power efficiency for laptops while incorporating cores. The entire Ryzen 5000 lineup served as the final major generation for the AM4 socket, offering full with existing AM4 motherboards through updates, thus extending the platform's lifecycle without requiring new hardware. On the desktop front, the flagship Ryzen 9 5950X targeted high-end users with 16 cores and 32 threads, a 3.4 GHz base clock scaling to a 4.9 GHz boost, 105 W TDP, and a launch price of $799, making it ideal for multi-threaded workloads like and simulation. This model utilized two dies (CCDs), each with eight cores and 32 MB of unified L3 cache, for a total of 64 MB L3. Lower-tier desktop options built on this foundation, emphasizing the series' balance of core count, cache efficiency, and AM4 longevity. Mobile introductions in early 2021 extended to laptops via the 5000U and 5000H series, with the Ryzen 7 5800H as a representative high-performance example: 8 cores and 16 threads, 3.2 GHz base clock up to 4.4 GHz boost, configurable 45 W TDP (35–54 W range), and integrated Radeon Graphics. These processors, launched January 12, 2021, focused on thin-and-light designs and gaming notebooks, delivering up to 25% better multi-threaded performance over mobile chips while maintaining battery life. For budget-conscious desktop builds without discrete GPUs, the series included APUs like the Ryzen 7 5700G, featuring 8 cores and 16 threads, 3.8 GHz base clock up to 4.6 GHz boost, 65 W TDP, and integrated graphics with 8 compute units at 2.0 GHz. Released in April 2021, this Cezanne-based APU used a 16 MB L3 cache in its monolithic configuration, enabling gaming at modest settings and serving as an entry point for on AM4.

Ryzen 6000 series

The 6000 series processors, codenamed , were announced on January 4, 2022, at CES and targeted mobile applications in laptops, representing an evolution of the into Zen 3+ with refinements for enhanced efficiency. Fabricated on TSMC's 6 nm process node, these processors introduced deeper SoC partitioning and improved clock and applicable to all IP blocks, including PHY components, which contributed to power savings through faster sleep/wake transitions and more granular control over domains like , display, Infinity Fabric, and USB. This resulted in approximately 15-20% efficiency gains from the process shrink and optimizations, enabling up to 30% lower power consumption in tasks like video conferencing compared to the prior Ryzen 5000 series. A key highlight was the integration of the first RDNA 2-based iGPU in mobile processors, marking 's debut of hardware-accelerated ray tracing in this segment via 12 Ultimate support. The series delivered up to 2x the graphics performance at 28 W compared to the Vega-based iGPUs in the Ryzen 5000 mobile lineup, with configurations scaling by model. support included DDR5 and LPDDR5 in select configurations, with LPDDR5-6400 enabling higher bandwidth for thin-and-light laptops. The lineup spanned H-series for high-performance laptops (35-54 W TDP) and U-series/HS-series for efficient designs (15-28 W TDP), with up to eight cores and 16 threads. For instance, the Ryzen 7 6800H in the H-series featured eight cores and 16 threads, a 4.7 GHz boost clock, a 45 W TDP, and the 680M iGPU with 12 compute units clocked up to 2.2 GHz. In the U-series, the Ryzen 5 6600U offered six cores and 12 threads, a 4.5 GHz boost clock, and a configurable 15-28 W TDP envelope, paired with the 660M iGPU featuring six compute units. These models exemplified the series' focus on balancing peak performance—up to 1.3x CPU uplift at 28 W—with extended battery life, such as 29 hours of local video playback in optimized systems.

Ryzen 7000 series

The Ryzen 7000 series processors, built on the microarchitecture, marked the debut of the AM5 socket for desktop platforms and expanded to mobile with the Phoenix family in –2023. Launched on September 27, , the desktop lineup introduced support for DDR5-5200 memory as a standard requirement and PCIe 5.0 connectivity, including up to 16 lanes for graphics cards, enabling higher bandwidth for next-generation GPUs and storage. These processors utilize a 5 nm manufacturing process for the compute chiplets, delivering improved single-threaded performance and efficiency over prior generations. The flagship desktop model, the Ryzen 9 7950X, features 16 cores and 32 threads, a maximum boost clock of 5.7 GHz, a 170 W TDP, and launched at an MSRP of $699, positioning it for high-end productivity and gaming workloads. All Ryzen 7000 desktop processors include a basic integrated GPU with 2 compute units (128 stream processors), sufficient for basic display output but not intensive graphics tasks. In April 2023, extended the series with the Ryzen 7000X3D models, incorporating 3D V-Cache technology—originally debuted in the Zen 3-based Ryzen 7 5800X3D in 2022—to enhance gaming performance through larger L3 cache stacks, with the Ryzen 7 7800X3D (8 cores, 96 MB L3 cache) becoming a standout for gamers. On the mobile side, the Ryzen 7040 series (codenamed Phoenix) arrived in early 2023, built on a 4 nm process for better power efficiency in laptops. Represented by models like the Ryzen 7 7840HS, it offers 8 cores and 16 threads, a 3.8 GHz base clock, up to 5.1 GHz boost, and a configurable TDP of 35–54 W, targeting premium ultrabooks and thin-and-light systems. Phoenix integrates advanced graphics via the RDNA 3 architecture, scaling from 2 to 12 compute units (e.g., Radeon 780M in higher-end SKUs), alongside the first XDNA neural processing unit (NPU) delivering up to 10 TOPS for AI-accelerated tasks such as image processing and machine learning inference. Systems with these processors became available from OEM partners starting in March 2023.

Ryzen 8000 series

The Ryzen 8000 series represents a refresh of the architecture targeted primarily at mobile and desktop APU segments, emphasizing enhanced AI capabilities and integrated graphics . Launched between late 2023 and early 2024, these processors build on the previous Ryzen 7040 series by incorporating an upgraded neural unit (NPU) for on-device AI tasks, while maintaining the core CPU design with minor process optimizations on TSMC's 4 nm node. The series supports DDR5-5600 memory and features up to 16 MB of L3 cache in its eight-core configurations, enabling efficient handling of multitasking and graphics-intensive workloads without a discrete GPU. In the mobile segment, codenamed Hawk Point, the Ryzen 8000 series includes processors like the Ryzen 7 8845HS, which offers eight cores and 16 threads, with a base clock of 3.8 GHz and boost up to 5.1 GHz, configurable TDP ranging from 35 W to 54 W. This model integrates the 780M graphics based on architecture with 12 compute units, providing solid performance for light gaming and . The key upgrade is the XDNA 2 NPU delivering 16 TOPS of AI compute, enabling features like Windows Copilot+ certification for accelerated local AI processing in applications such as image generation and video enhancement. For desktop all-in-one systems, the G-series APUs in the Ryzen 8000 lineup, such as the Ryzen 7 8700G, feature eight cores and 16 threads, a 4.2 GHz base clock boosting to 5.1 GHz, and a 65 W TDP. It pairs with the same 780M iGPU (12 compute units) and includes the 16 NPU for AI-optimized tasks, supporting DDR5-5600 and up to 16 MB L3 cache to facilitate seamless integration in compact builds focused on and casual gaming. These enhancements position the series as a bridge toward more AI-centric computing, with the NPU handling inference workloads more efficiently than prior generations.
ModelCores/ThreadsBase/Boost ClockTDPiGPUNPU PerformanceL3 Cache
Ryzen 7 8845HS (Mobile, Hawk Point)8/163.8 GHz / 5.1 GHz35-54 WRadeon 780M (12 CUs)16 TOPS16 MB
Ryzen 7 8700G (Desktop APU)8/164.2 GHz / 5.1 GHz65 WRadeon 780M (12 CUs)16 TOPS16 MB

Ryzen 9000 series

The Ryzen 9000 series processors, built on AMD's Zen 5 microarchitecture, deliver a 16% average improvement in instructions per clock (IPC) over the preceding Zen 4 generation, enabling enhanced performance in productivity, gaming, and AI workloads. Zen 5 introduces full AVX-512 support, doubling vector width for improved performance in AI and high-performance computing tasks. Fabricated using TSMC's 4 nm (N4P) process node, the series supports the AM5 socket for desktop variants and introduces advancements like doubled branch prediction accuracy and improved floating-point execution units to achieve these gains. Integrated graphics in mobile and APU models leverage the RDNA 3.5 architecture, offering up to 16 compute units for better efficiency in graphics-intensive tasks compared to prior RDNA 3 implementations. Launched starting in mid-2024 for desktops and expanding into mobile and APU configurations through 2025, the lineup emphasizes scalability across power envelopes from 35 W to 170 W. For desktop applications, the Ryzen 9000 series debuted with the Granite Ridge platform in August 2024, featuring models like the flagship Ryzen 9 9950X, which includes 16 cores and 32 threads, a base clock of 4.3 GHz, a maximum boost clock of 5.7 GHz, 80 MB of total cache (64 MB L3), and a 170 W TDP, priced at $649. As of 2025, the Ryzen 9 9950X achieves the highest theoretical peak FLOPS among consumer desktop CPUs, at approximately 2.9 TFLOPS in FP32 using AVX2 instructions (calculation: 16 cores × 5.7 GHz × 32 FLOPS/cycle/core). No consumer CPU released or confirmed for 2025-2026 significantly exceeds this in mainstream desktop platforms, with high-core workstation CPUs like Threadripper not considered consumer-grade. These processors support PCIe 5.0 for up to 28 lanes and DDR5-5600 memory, prioritizing high-core-count performance for content creation and multitasking. The Ryzen 7 9700X defaults to a 65 W Eco Mode with an 88 W PPT limit, constraining multi-core performance in benchmarks like Cinebench R23; enabling the full 105 W TDP increases multi-core scores by 13-20% to 20,000-22,000 or higher, reflecting the processor's potential rather than inferior silicon quality. Starting in late 2024, AMD introduced X3D variants optimized for gaming, beginning with the Ryzen 7 9800X3D featuring 8 cores and 16 threads, a base clock of 4.7 GHz, a maximum boost clock of 5.2 GHz, 96 MB of L3 cache, and a 120 W TDP for efficient power use on the AM5 platform supporting DDR5 and future upgrades, followed in early 2025 by models such as the Ryzen 9 9950X3D, incorporating 144 MB of L3 cache via 3D V-Cache technology on one chiplet die to reduce latency in cache-sensitive workloads, launched on March 12, 2025, at $699. Mobile variants of the Ryzen 9000 series, introduced under the "Fire Range" branding in January 2025, target high-performance laptops with configurations like the Ryzen 9 9955HX, featuring 16 Zen 5 cores and 32 threads, 64 MB L3 cache, a base clock of 2.5 GHz, a boost up to 5.4 GHz, and configurable TDPs from 55 W to 75 W, building on desktop-like chiplet designs for hybrid core layouts (full Zen 5 and dense Zen 5c cores). The series includes X3D options, such as the Ryzen 9 9955HX3D, built on second-generation 3D V-Cache technology with 144 MB L3 cache for superior gaming frame rates. Gaming laptops equipped with this processor support Resizable BAR (also known as ReBAR or Smart Access Memory/SAM when paired with compatible AMD GPUs), as seen in models such as the Lenovo Legion Pro 7, ASUS ROG Strix series, and various MSI gaming laptops, enabling improved gaming performance through full CPU access to the GPU frame buffer. These processors integrate the XDNA 2 NPU for up to 50 TOPS of AI processing and pair with RDNA 3.5-based Radeon 890M graphics (16 CUs at up to 2.9 GHz) for discrete-level performance in thin-and-light systems, supporting AV1 encoding and up to 1080p gaming at moderate settings. AMD is rumored to launch the 9000G APU lineup in Q4 2025 for budget desktops and integrated graphics needs, based on leaks and support, utilizing Strix Point-derived dies with 12 cores, 24 MB L3 cache, and enhanced RDNA 3.5 iGPUs featuring 16 compute units for improved gaming without a discrete card. These 65 W to 105 W parts, compatible with AM5 motherboards, emphasize power efficiency and include models like a 12-core 7 variant for entry-level creators. To cater to discrete GPU users, released F-series models without integrated in September 2025, exemplified by the Ryzen 7 9700F with 8 cores and 16 threads, a base clock of 3.8 GHz, a boost up to 5.5 GHz, 40 MB total cache, a 65 W TDP, and an MSRP of $289, offering cost savings for gaming builds paired with dedicated cards.
ModelCores/ThreadsBase/Boost Clock (GHz)Cache (L3 MB)TDP (W)Launch DatePrice (MSRP)
Ryzen 9 9950X (Desktop)16/324.3/5.764170Aug 2024$649
Ryzen 9 9950X3D (Desktop)16/324.2/5.7144120Mar 2025$699
Ryzen 7 9800X3D (Desktop)8/164.7/5.296120Nov 2024$479
Ryzen 9 9955HX (Mobile)16/322.5/5.46455-75Jan 2025N/A
Ryzen 9 9955HX3D (Mobile)16/322.5/5.414455-75Jan 2025N/A
Ryzen 7 9700F (Desktop, no iGPU)8/163.8/5.53265Sep 2025$289
Ryzen 9000G (APU, example 12-core)12/24~3.5/5.02465-105Q4 2025 (rumored)N/A

Threadripper series

The AMD Ryzen Threadripper series comprises high-end desktop (HEDT) and workstation processors designed for demanding multi-threaded workloads such as 3D rendering, video editing, scientific simulations, and AI development, leveraging scalable chiplet designs to deliver exceptional core counts and I/O capabilities. Introduced in 2017, the lineup utilizes the Zen microarchitecture family, starting with Zen 1 and evolving through subsequent generations, with platforms supporting quad-channel memory, extensive PCIe lanes, and the sTR4 socket for early models. These processors target professionals requiring workstation-level performance in a desktop form factor, distinguishing them from mainstream Ryzen offerings by prioritizing core density and expandability over single-threaded consumer tasks. The first-generation Ryzen Threadripper 1000 series, based on the 14nm architecture, launched in August 2017 with models up to the 1950X featuring 16 cores and 32 threads, a base clock of 3.4 GHz, up to 4.0 GHz, 32 MB L3 cache, and 180W TDP, priced starting at $999 for the . It utilized the sTR4 socket and TR4 , supporting up to 128 GB of quad-channel DDR4 and 64 PCIe 3.0 lanes, enabling robust multi-GPU configurations for creative workflows. The second-generation 2000 series, built on the refined 12nm architecture and released in August 2018, doubled the core count in its top model, the 2990WX with 32 cores and 64 threads, a 3.0 GHz base clock to 4.2 GHz, 64 MB L3 cache, and 280W TDP, launched at $1,799. Retaining the sTR4 socket, it introduced Precision Boost 2 for better sustained performance under heavy loads, enhancing suitability for tasks. The third-generation Threadripper 3000 series, adopting the 7nm architecture, debuted in November 2019 and marked a significant leap with the 3990X offering 64 cores and 128 threads, a 2.9 GHz base clock up to 4.3 GHz boost, 256 MB L3 cache, 280W TDP, and an MSRP of $3,990. Paired with the sTRX4 socket and , it supported up to 256 GB of quad-channel DDR4-3200 and 88 PCIe 4.0 lanes, doubling bandwidth for storage and graphics acceleration in professional applications. This generation emphasized scalability, allowing seamless integration of multiple core complexes for unprecedented multi-core throughput in rendering and simulation environments. Building on with a 7nm , the Threadripper 5000 series—primarily the PRO WX variants for certification—launched in March 2022, highlighted by the 5995WX with 64 cores and 128 threads, a 2.7 GHz base boosting to 4.5 GHz, 256 MB L3 cache, and 280W TDP, using the sWRX8 socket. Integrated with the WRX80 , it provided up to 128 PCIe 4.0 lanes and support for 2 TB of octo-channel DDR4-3200 , optimizing for enterprise-grade stability in CAD, media production, and data analytics. The PRO features, including enhanced security and remote management via PRO technologies, catered to managed IT environments. The seventh-generation Threadripper 7000 series, powered by the 5nm architecture, arrived in November 2023 with the non-PRO 7980X delivering 64 cores and 128 threads, a 3.2 GHz base clock up to 5.1 GHz boost, 256 MB L3 cache (part of 320 MB total on-chip), and 350W TDP, on the sTR5 socket with TRX50 chipset for HEDT users. It supported quad-channel DDR5-5200 memory up to 1 TB and 48 PCIe 5.0 lanes (expandable to 88 total), providing high-bandwidth access for next-gen GPUs and NVMe storage in AI and pipelines. The corresponding PRO 7000 WX-Series used the WRX90 chipset for up to 128 PCIe 5.0 lanes and octo-channel DDR5 ECC support up to 2 TB, targeting certified workstation builds. In 2025, announced the ninth-generation Threadripper 9000 series based on the 4nm/5nm architecture, extending core counts to up to 96 in the PRO 9995WX model with 192 threads, emphasizing AI-accelerated workflows and available starting late 2025. The HEDT variants, such as the 64-core 9980X, pair with the sTR5 socket and , while PRO models leverage WRX90 for enhanced I/O, including 128 PCIe lanes and support for up to 384 MB L3 cache to handle massive datasets in and rendering. This iteration builds on prior , offering improved single-thread performance and energy efficiency for sustained high-core utilization in professional settings.
GenerationTop ModelCores/ThreadsProcess NodeTDP (W)Socket/ChipsetKey Platform FeaturesLaunch MSRP (Flagship)
1000 (Zen 1)1950X16/3214nm180sTR4/TR4Quad DDR4-2666 (128 GB), 64 PCIe 3.0 lanes$999
2000 (Zen+)2990WX32/6412nm280sTR4/TR4Quad DDR4-2933 (128 GB), 64 PCIe 3.0 lanes$1,799
3000 ()3990X64/1287nm280sTRX4/TRX40Quad DDR4-3200 (256 GB), 88 PCIe 4.0 lanes$3,990
5000 () PRO5995WX64/1287nm280sWRX8/WRX80Octo DDR4-3200 ECC (2 TB), 128 PCIe 4.0 lanesN/A (OEM-focused)
7000 ()7980X64/1285nm350sTR5/TRX50Quad DDR5-5200 (1 TB), 88 PCIe 5.0 lanes$4,999
9000 ()9980X / 9995WX PRO64/965nm350sTR5/TRX50 or WRX90Quad/Octo DDR5-6000 ECC (2 TB+), 128 PCIe 5.0 lanes$5,999+ (est.)

Ryzen Z series

The Ryzen Z series processors are designed specifically for handheld gaming devices, emphasizing low-power efficiency, compact form factors, and optimized performance for portable play. Introduced in 2023, the series began with the Z1 family, which utilizes a configurable (TDP) ranging from 15 to 30 watts to balance gaming capabilities with battery life in devices like the . These integrate CPU cores with graphics architecture, supporting LPDDR5X-7500 memory to enable fast data access in memory-constrained handhelds. The flagship Ryzen Z1 Extreme features eight cores and 16 threads, with a base clock of 3.3 GHz and a maximum boost clock of 5.1 GHz, paired with a Radeon 780M integrated GPU comprising 12 compute units. This configuration delivers strong gaming performance at sub-30W TDPs, powering devices such as the ROG Ally and Lenovo Legion Go, where it achieves playable frame rates in modern titles while managing heat dissipation in small chassis. In contrast, the standard Ryzen Z1 employs a hybrid setup of six cores (two full and four compact Zen 4c) and 12 threads, operating at a 3.2 GHz base and up to 4.9 GHz boost, with a Radeon 740M GPU featuring four compute units for more entry-level handheld applications. Both variants prioritize thermal efficiency, but in practice, sustained loads in the ROG Ally can lead to throttling around 90-100°C to prevent overheating, impacting frame rates during extended sessions. Building on this foundation, the Ryzen Z2 series, announced at CES 2025 and available from Q1 2025, shifts to architecture for improved instructions per clock and power efficiency, targeting up to 12 cores and 24 threads in higher-end variants while maintaining handheld-optimized TDPs of 15-35 watts. The Z2 Extreme offers eight cores (including a mix of full and dense Zen 5c cores) and 16 threads, boosting to 5.1 GHz with a 24 MB cache, integrated with a 16-compute-unit RDNA 3.5 GPU for enhanced ray tracing and upscaling support. Supporting LPDDR5X-8000 memory, the Z2 lineup addresses battery life challenges in prior handhelds by reducing power draw at idle and light loads, potentially extending playtime in devices like the upcoming successor compared to the Z1's roughly 1-2 hours under demanding games. Thermal throttling remains a consideration in compact designs, with the Z2's refined helping sustain performance longer before hitting 100°C limits, as seen in early tests on prototypes like the MSI Claw A8.

Ryzen AI series

The Ryzen AI series represents AMD's lineup of mobile processors designed specifically for AI-accelerated in laptops and portable devices, featuring dedicated neural processing units (NPUs) based on the XDNA architecture to enable efficient on-device AI tasks such as image generation, real-time translation, and local execution of large models. These processors prioritize power efficiency and performance for AI workloads, distinguishing them through high TOPS (tera operations per second) ratings on the NPU while integrating Zen CPU cores and RDNA 3.5 graphics. Launched starting in 2024, the series supports Copilot+ PC certification from , requiring at least 40 TOPS NPU performance, 16 GB RAM, and 256 GB storage to unlock advanced Windows AI features like and Live Captions. The Ryzen AI 300 series, codenamed Strix Point and built on the architecture, debuted in mid-2024 with configurations up to 12 cores and 24 threads, including a mix of high-performance cores and dense Zen 5c cores for balanced efficiency. Top models like the Ryzen AI 9 HX 370 achieve boost clocks up to 5.1 GHz on cores and 3.3 GHz on Zen 5c, with configurable TDPs from 15 W to 54 W, making them suitable for ultrathin and high-performance mobiles. The integrated XDNA 2 NPU delivers over 50 for AI inference, enabling features like on-device image creation via tools such as , while the 890M graphics with up to 16 RDNA 3.5 compute units handles AI-enhanced visuals and gaming at up to 1080p resolution. Overall platform AI performance reaches up to 80 when combining NPU, CPU, and GPU contributions. The Ryzen AI 200 series serves as a 2025 refresh of the Hawk Point platform, targeting lower-end laptops with Zen 4 cores and refreshed XDNA NPU capabilities for cost-effective AI entry points. Configurations range from 6 to 8 cores and 12 to 16 threads, with NPUs providing 16 TOPS individually and up to 38 TOPS total platform performance, supporting basic on-device AI like video call enhancements and simple generative tasks. Graphics are based on RDNA 3 with up to 12 compute units (Radeon 780M), and TDPs span 15-45 W, ensuring compatibility with budget Copilot+ certified devices. At CES 2025, introduced the premium AI Max series, codenamed Strix Halo (also referred to as Fire Range in some contexts), with the flagship AI Max+ 395 featuring 16 cores and 32 threads for demanding AI and creative workflows. This model boosts up to 5.1 GHz, supports configurable TDPs up to 120 W, and includes an XDNA 2 NPU rated at over 50 , contributing to a total platform AI performance of up to 126 for advanced on-device applications like running 70-billion-parameter LLMs locally. Integrated 8060S graphics leverage 40 RDNA 3.5 compute units for superior AI-accelerated rendering and up to 4K gaming, positioning the Max series as a high-end option for professional and mini-PCs.

Reception

Critical reviews

Upon its 2017 launch, the Ryzen 1000 series, based on the architecture, received praise from reviewers for delivering strong multi-core performance and excellent value in tasks compared to 's offerings at similar price points, though it faced for lagging in single-core speeds and certain gaming scenarios relative to 's Core i7 processors. For instance, awarded the Ryzen 7 1800X a 4.5 out of 5 rating, highlighting its 62% single-core improvement over prior chips but noting it trailed in clock speeds. The 2019 Ryzen 3000 series with Zen 2 architecture marked a significant shift, earning acclaim as a formidable challenger to Intel in both gaming and multi-threaded workloads, with reviewers emphasizing its improved single-core performance and efficiency on the 7nm process. The Ryzen 9 3950X, in particular, was lauded for redefining high-core-count computing under $800, securing PCMag's Editors' Choice award with a 4.5 out of 5 score for its multitasking prowess and content creation capabilities. In 2020, the Zen 3-based Ryzen 5000 series further solidified AMD's position, with reviews hailing its IPC gains and balanced performance across applications, often outperforming Intel equivalents in efficiency and value. Tom's Hardware gave the Ryzen 5 5600X a 4.5 out of 5 rating, calling it a "no-compromise gaming chip" for the mid-range due to its class-leading application performance and power efficiency. The 2022 Ryzen 7000 series on Zen 4 introduced mixed feedback, with critics noting elevated power draw—such as the 170W TDP and up to 230W peak on the AM5 socket—as a drawback for thermal management, though it was widely praised for the platform's longevity, with AMD committing to AM5 support through 2027 and beyond. By 2024 and into 2025, the Ryzen 9000 series garnered strong reviews for enhanced efficiency and multi-threaded dominance, with the Ryzen 9 9950X delivering leading performance on mainstream platforms while consuming less power than competitors like 's Core i9-14900K. noted its lower power consumption in multi-threaded tests compared to . In mobile, the Ryzen AI 300 series integrated advanced NPU capabilities for AI tasks, earning praise for solid CPU and graphics boosts alongside efficient battery life, positioning it as a top performer in AI-enabled laptops. User reception has consistently emphasized high satisfaction with Ryzen's upgradability, particularly on platforms like AM4 and AM5, where owners report significant uplifts from generational swaps without full overhauls, as evidenced in upgrade analyses showing substantial gains for existing users.

Performance benchmarks

The Ryzen 9 5950X demonstrated superior multi-core in benchmarks, achieving a Cinebench R23 multi-core score of 24,071 compared to 16,089 for the i9-10900K, representing approximately 1.5 times the throughput. Subsequent generations further extended this lead, with the Ryzen 9 9950X topping 2025 multi-core charts at 42,871 points in Cinebench R23, underscoring Ryzen's scalability in parallel workloads like video encoding and . Theoretical peak floating-point performance provides an additional measure of CPU capability. As of 2025, the consumer desktop CPU with the highest theoretical peak FLOPS is the AMD Ryzen 9 9950X (16 cores, up to 5.7 GHz boost clock), with an estimated peak of approximately 2.9 TFLOPS in FP32 using AVX2 instructions (calculation: 16 cores × 5.7 GHz × 32 FLOPS/cycle/core). No consumer CPU released or confirmed for 2025-2026 significantly exceeds this in mainstream desktop platforms. High-core workstation CPUs like Threadripper are not considered consumer-grade. The Ryzen 9 9950X3D variant, featuring a doubled 128 MB L3 cache compared to the 64 MB on the non-X3D model, provides a slight performance edge in cache-sensitive image processing tasks, such as ~5-10% faster Photoshop filters, and ~7% faster overall content creation. In gaming at resolution, the Ryzen 7 7800X3D ( ) delivered an average 12-20% higher frame rates than Intel's Core i9-13900K across titles, including a notable edge in where its 3D V-Cache technology reduced stuttering and boosted minimum FPS by up to 15% in ray-traced scenarios. This advantage highlights Ryzen's efficiency in memory-sensitive games, though gains diminish at higher resolutions where GPU limitations dominate. The -based Ryzen 9000 series improved power efficiency over equivalents, with architectural enhancements yielding up to 16% higher instructions per clock at the same 65W TDP, translating to 5-10% better in productivity tasks like compilation and rendering. For instance, the Ryzen 5 9600X sustains higher sustained loads with reduced output compared to the 65W Ryzen 5 7600, enabling better in compact systems without compromising output. In mobile AI workloads, the Ryzen AI 300 series' NPU processes tasks like up to 79% faster than Intel's while consuming half the power, accelerating image generation from seconds to under 10 seconds per iteration on comparable hardware. This stems from the XDNA 2 architecture's 50 capability, doubling effective throughput in diffusion models versus 's 11 NPU. The Threadripper PRO 7985WX excelled in professional rendering, outperforming comparable processors by up to 72% in benchmarks, effectively doubling render times for complex scenes with its 64 cores and high . This positions it as a leader for scalability in CAD and pipelines.

Software support

Windows

Ryzen processors have enjoyed full compatibility with since their launch in 2017, enabling seamless integration with the operating system's features and scheduling optimizations tailored for multi-core architectures. This support includes tools like the Ryzen Master utility, which allows users to enable Precision Boost Overdrive (PBO), an automatic feature that extends beyond standard thermal and power limits to enhance performance in demanding workloads. All Ryzen processors from the 2000 series onward meet Windows 11's hardware requirements, including built-in support for TPM 2.0 via firmware-based (fTPM), ensuring secure boot and virtualization-based security without additional hardware. The 1000 series, while functional with updates to enable fTPM, lacks official certification for due to generational compatibility limits. Starting with the Ryzen 7000 series and later, particularly in mobile variants featuring the Ryzen AI designation, processors incorporate a dedicated Neural Processing Unit (NPU) based on AMD's XDNA architecture. This NPU integrates with Microsoft's DirectML API to accelerate AI workloads within the Windows ecosystem. Models meeting Microsoft's 40 threshold, such as the Ryzen AI 300 series with up to 50 , enable features like local processing for Copilot+ PCs for advanced on-device inference. Earlier NPU implementations provide general AI acceleration but do not qualify for full Copilot+ experiences. Driver support under Windows is robust, with AMD providing regular updates through the Radeon Software Adrenalin Edition, which handles integrated GPUs (iGPUs) in for improved graphics performance, video encoding, and display management. Complementing this, chipset drivers for AM4 and AM5 platforms optimize system stability, , and peripheral connectivity, addressing issues like USB reliability and ensuring consistent operation across Windows updates. Windows-specific optimizations further enhance Ryzen performance, notably through Game Mode, which prioritizes CPU and GPU resources during gaming to reduce background interference and core parking inefficiencies. These features, combined with 's power plan recommendations, contribute to efficient multi-threaded execution in both productivity and entertainment scenarios.

Linux and other OS

Support for Ryzen processors in began with the introduction of the architecture, where kernel version 4.10, released in February 2017, provided initial full support including multithreading capabilities and core recognition. This enabled Ryzen CPUs to be properly detected and utilized by the operating system without significant modifications. Subsequent kernel updates refined this foundation, addressing early compatibility nuances in areas like handling and enumeration. Power management saw further advancements with the AMD P-State driver, integrated into Linux kernel 5.17 in March 2022, which leverages the Collaborative Processor Performance Control (CPPC) interface for more efficient frequency scaling and energy optimization on Zen 2 and later architectures. This driver replaced older ACPI-based methods, offering better performance consistency under varying workloads, particularly for Ryzen 5000 series and beyond. By kernel 6.x series, enhancements extended to Zen 4 and Zen 5, including improved idle states and thermal throttling. Major Linux distributions like and provide out-of-the-box compatibility for Ryzen processors, with recent versions supporting boot, CPU scheduling, and basic I/O on AM4 and AM5 platforms from installation media onward. For compute workloads, AMD's platform enables GPU acceleration on Ryzen 7000 series and later integrated graphics, officially compatible with 22.04 and 40+ through dedicated repositories starting with ROCm 5.7 in 2023. This setup supports machine learning frameworks like on RDNA 3-based iGPUs, though discrete GPU pairing requires kernel parameters for optimal stability. FreeBSD offers solid support for Ryzen on AM4 and AM5 sockets, with CPU detection, multi-threading, and storage controller compatibility available in FreeBSD 13+ releases since 2021. The amdgpu driver handles integrated graphics acceleration, but performance trails Windows implementations due to delayed upstreaming of RDNA features and occasional firmware mismatches in early Zen 4 adoptions. In embedded and alternative environments, Android-x86 sees limited Ryzen adoption, primarily in custom industrial builds using Zen 2 and later cores for x86-based devices since 2020. These configurations leverage Ryzen Embedded variants for tasks like digital signage or kiosks, though mainstream Android ports remain Intel-centric with Ryzen requiring kernel tweaks for full viability. Community efforts played a key role in stabilizing early Zen support, with developer-submitted patches for issues like branch prediction quirks and PCIe link training merged into the Linux kernel by mid-2018, enhancing reliability across distributions. These contributions, often coordinated via the Linux kernel mailing lists, resolved boot hangs and performance anomalies reported in 2017 user tests.

Known issues

Security vulnerabilities

In early 2018, AMD Ryzen processors based on the first-generation Zen and second-generation Zen 2 architectures were found vulnerable to Spectre speculative execution attacks, though not to the related Meltdown variant due to differences in AMD's memory management design. AMD addressed these through microcode updates distributed via BIOS firmware and operating system patches, which introduced barriers to speculative execution and reduced performance by approximately 5-20% across affected workloads, with greater impacts on I/O-intensive tasks. In 2019, Zen 2-based Ryzen processors were determined to be susceptible to Microarchitectural Data Sampling (MDS), a class of side-channel attacks akin to ZombieLoad that could leak data from CPU buffers across security domains. AMD mitigated this vulnerability with a update integrated into version 1.2.0.0, clearing affected buffers to prevent unauthorized data access without requiring full hardware redesigns. The ZenBleed vulnerability, disclosed in July 2023 as CVE-2023-20593, stemmed from a flaw in the and register handling within and architectures, enabling to leak up to 30 bytes of sensitive data per iteration from other processes or threads. issued microcode patches in late 2023, initially for server products and later for consumer Ryzen via updates, with minimal performance overhead reported in most applications following deployment. Retbleed, revealed in July 2022 as CVE-2022-29900, exploited mispredicted return instructions in the across all generations, allowing arbitrary speculative code execution and potential kernel memory disclosure. Mitigations included enhanced indirect branch prediction barriers in versions 5.19 and later, alongside Windows updates implementing similar protections, resulting in up to 14% performance degradation for AMD processors on systems. In August 2024, the Sinkclose vulnerability (CVE-2023-31315 and related), a high-severity side-channel flaw affecting all Ryzen processors since 2006, was disclosed. It allows attackers with ring 0 access to bypass (SMM) locks, enabling , in SMM, and installation of persistent bootkit that is difficult to detect or remove. provided and mitigations for newer Ryzen generations ( and later), but older models (pre-) remain unpatched, requiring system reconfiguration or replacement for full protection.

Hardware and compatibility problems

Early Ryzen 1000 series processors experienced segmentation faults, particularly during intensive workloads such as parallel compilation in environments, attributed to performance marginality issues in the initial silicon. These faults were more prevalent in CPUs manufactured before week 33 of 2017 and could lead to system instability under heavy multi-threaded loads. addressed the problem through updates incorporating 1.0.0.6, which improved and stability, alongside later CPU revisions that eliminated the issue entirely. In 2018, security firm CTS Labs disclosed the Chimera vulnerability in the Promontory chipset firmware used by Ryzen 1000 and 2000 series processors, alleging a backdoor that could allow remote code execution via the router component. This flaw, part of a broader set including Ryzenfall, Fallout, and Masterkey, affected the secure processor and raised concerns about potential network risks. AMD disputed the claims, stating that Chimera was not exploitable in real-world scenarios without physical access and did not constitute a practical threat, while committing to firmware patches for verified issues. The launch of Ryzen 3000 series processors in 2019 revealed initial compatibility challenges with B450 motherboards, where early versions lacked support for the architecture due to absent CPU whitelists. This prevented on unmodified boards, requiring users to perform flashes—often using older compatible CPUs or onboard recovery tools. AMD and motherboard vendors resolved these through widespread updates by mid-2019, enabling full compatibility and performance parity across B450, X470, and newer platforms without hardware changes. Ryzen 7000 series on the AM5 platform faced DDR5 memory instability in its early days, stemming from prolonged or failed RAM training processes during , which caused erratic speeds, crashes, and extended POST times especially with high-frequency kits. These bugs arose from immature firmware handling of DDR5's on-die ECC and gear-down modes, affecting system reliability under load. mitigated this via 1.0.0.7 updates, which refined memory training algorithms, boosted compatibility for speeds up to 8000 MT/s, and reduced times, though initial implementations introduced secondary issues later patched in sub-versions like 1.0.0.7b. In 2025, reports emerged of premature degradation and failure ("burnout") in Ryzen 9000 series processors, particularly variants like the Ryzen 7 9800X3D, with over 100 documented cases by March. These issues, often occurring on AM5 motherboards (B850 and X870), were attributed to excessive voltage from Precision Boost Overdrive (PBO) enabled by default in , leading to irreversible CPU damage under load. isolated related boot problems to BIOS non-compliance, while released fixes to cap voltages and disable aggressive PBO settings, recommending users update and monitor temperatures to prevent further incidents. Ryzen processors with 3D V-Cache exhibit greater sensitivity in their integrated memory controllers to RAM overclocking attempts. The stacked 3D V-Cache design impacts signal integrity and timings, while BIOS voltage limits, such as on VSOC (system-on-chip voltage), protect the delicate cache from damage and restrict the elevated voltages typically needed for overclock stability. Fabric clock (FCLK) speeds are often constrained to 1800-2000 MHz, resulting in synchronization failures in 1:1 mode with RAM speeds deviating from standard configurations.

References

  1. https://en.wikichip.org/wiki/amd/ryzen_7/1800x
  2. https://en.wikichip.org/wiki/amd/ryzen_5/1600
Add your contribution
Related Hubs
User Avatar
No comments yet.