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Scanning acoustic microscope
Scanning acoustic microscope
Scanning acoustic microscope
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A US penny scanned in an acoustic microscope at 50 MHz

A scanning acoustic microscope (SAM) is a device which uses focused sound to investigate, measure, or image an object (a process called scanning acoustic tomography). It is commonly used in failure analysis and non-destructive evaluation. It also has applications in biological and medical research. The semiconductor industry has found the SAM useful in detecting voids, cracks, and delaminations within microelectronic packages.

History

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The first scanning acoustic microscope (SAM), with a 50 MHz ultrasonic lens, was developed in 1974 by R. A. Lemons and C. F. Quate at the Microwave Laboratory of Stanford University.[1] A few years later, in 1980, the first high-resolution (with a frequency up to 500 MHz) through-transmission SAM was built by R.Gr. Maev and his students at his Laboratory of Biophysical Introscopy of the Russian Academy of Sciences.[2] First commercial SAM ELSAM, with a broad frequency range from 100 MHz up to 1.8 GHz, was built at the Ernst Leitz GmbH by the group led by Martin Hoppe and his consultants Abdullah Atalar (Stanford University), Roman Maev (Russian Academy of Sciences) and Andrew Briggs (Oxford University.)[3][4]

Since then, many improvements to such systems have been made to enhance resolution and accuracy. Most of them were described in detail in the monograph Advanced in Acoustic Microscopy, Ed. by Andrew Briggs, 1992, Oxford University Press and in monograph by Roman Maev, Acoustic Microscopy Fundamentals and Applications, Monograph, Wiley & Son - VCH, 291 pages, August 2008, as well as recently in.[5]

C-SAM versus other techniques

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There are many methods for failure analysis of damages in microelectronic packages, including laser decapsulation, wet etch decapsulation, optical microscopy, and SEM microscopy. The problem with most of these methods is the fact that they are destructive. This means it’s possible that the damage itself will be done during preparation. Also, most of these destructive methods need time-consuming and complicated sample preparation. So, in most cases, it is important to study damages with a non-destructive technique. And unlike other non-destructive techniques such as X-Ray, CSAM is highly sensitive to the elastic properties of the materials it travels through. For example, CSAM is highly sensitive to the presence of delaminations and air-gaps at sub-micron thicknesses, so it is particularly useful for inspection of small, complex devices.[6]

Physics principle

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The technique makes use of the high penetration depth of acoustic waves to image the internal structure of the specimen. So, in scanning acoustic microscopy either reflected or transmitted acoustic waves are processed to analyze the internal features. When the acoustic wave propagates though the sample it may be scattered, absorbed or reflected at media interfaces. Thus, the technique registers the echo generated by the acoustic impedance (Z) contrast between two materials. Scanning acoustic microscopy works by directing focused sound from a transducer at a small point on a target object. Sound hitting the object is either scattered, absorbed, reflected (scattered at 180°) or transmitted (scattered at 0°). It is possible to detect the scattered pulses travelling in a particular direction. A detected pulse informs of the presence of a boundary or object. The `time of flight' of the pulse is defined as the time taken for it to be emitted by an acoustic source, scattered by an object and received by the detector, which is usually coincident with the source. The time of flight can be used to determine the distance of the inhomogeneity from the source given knowledge of the speed through the medium.

Based on the measurement, a value is assigned to the location investigated. The transducer (or object) is moved slightly and then insonified again. This process is repeated in a systematic pattern until the entire region of interest has been investigated. Often the values for each point are assembled into an image of the object. The contrast seen in the image is based either on the object's geometry or material composition. The resolution of the image is limited either by the physical scanning resolution or the width of the sound beam (which in turn is determined by the frequency of the sound).

Methodology

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Different types of analysis modes are available in high-definition SAM. The main three modes are A-scans, B-scans, and C-scans. Each one provides different information about the integrity of the sample’s structure.[6]

The A-scan is the amplitude of the echo signal over ToF. The transducer is mounted on the z-axis of the SAM. It can be focused to a specific target layer located in a hard-to-access area by changing the z-position with respect to the sample under testing that is mechanically fixed.[6]

The B-scan provides a vertical cross section of the sample with visualization of the depth information. It is a very good feature when it comes to damage detection in the cross section.[6]

The C-scan is a commonly used scanning mode, which gives 2D images (slices) of a target layer at a specific depth in the samples; multiple equidistant layers are feasible through the X-scan mode.[6]

Pulse-reflection method

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2D or 3D-dimensional images of the internal structure become available by means of the pulse-reflection method, in which the impedance mismatch between two materials leads to a reflection of the ultrasonic beam. Phase inversion of the reflected signal can allow for discrimination of the delamination (acoustic impedance almost zero) from inclusions and particles, but not from air bubbles, which show same impedance behavior as delamination.[6]

The higher the impedance mismatch at the interface, the higher the intensity of the reflected signal (more brightness in the 2D image), which is measured by the echo amplitude. In the case of an interface with air (Z = 0), total reflection of the ultrasonic wave occurs; therefore, SAM is highly sensitive to any entrapped air in the sample under testing.[6]

In order to enhance the insertion of the acoustic wave into the specimen both the acoustic transducer and the sample are immersed in a coupling media, typically water, to avoid the high reflection at air interfaces.

In the pulse-wave mode, a lens having good focusing properties on an axis is used to focus the ultrasonic waves onto a spot on the specimen and to receive the reflected waves back from the spot, typically in less than 100 ns. The acoustic beam can be focused to a sufficiently small spot at a depth up to 2–3 mm to resolve typical interlaminar cracks and other critical crack geometries. The received echoes are analysed and stored for each point to build up an image of the entire scanned area. The reflected signal is monitored and sent to a synchronous display to develop a complete image, as in a scanning electron microscope.

Applications

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- Fast production control - Standards : IPC A610, Mil-Std883, J-Std-035, Esa, etc - Parts sorting - Inspection of solder pads, flip-chip, underfill, die-attach - Sealing joints - Brazed and welded joints - Qualification and fast selection of glues, adhesive, comparative analyses of aging, etc - Inclusions, heterogeneities, porosities, cracks in material

Medicine and biology

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SAM can provide data on the elasticity of cells and tissues, which can give useful information on the physical forces holding structures in a particular shape and the mechanics of structures such as the cytoskeleton.[7][8] These studies are particularly valuable in investigating processes such as cell motility.[9][10]

Some work has also been performed to assess penetration depth of particles injected into skin using needle-free injection [11]

Another promising direction was initiated by different groups to design and build portable hand-held SAM for subsurface diagnostics of soft and hard tissues [12][5] and this direction currently in the commercialization process in clinical and cosmetology practice.

See also

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References

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Revisions and contributorsEdit on WikipediaRead on Wikipedia

Scanning acoustic microscope

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from Grokipedia
A scanning acoustic microscope (SAM) is a non-destructive instrument that employs focused ultrasonic waves to probe and visualize the subsurface features, defects, and mechanical properties of opaque materials, such as metals, composites, and biological tissues, achieving resolutions from micrometers to sub-micrometers depending on the operating frequency. The concept of acoustic microscopy originated in the late 1930s when Soviet physicist Sergei Yakovlevich Sokolov proposed using high-frequency sound waves (around 3 GHz) for magnified imaging, though early experiments in the 1940s yielded only low-resolution images due to technological limitations. The first practical scanning acoustic microscope was developed in 1973 by R. A. Lemons and C. F. Quate at , utilizing a mechanically scanned focused beam of at frequencies up to 100 MHz to achieve 10-micrometer resolution on non-transparent samples. Subsequent advancements, including higher frequencies (up to 2 GHz) and improved transducers, have enhanced resolution to as fine as 0.7 micrometers while enabling three-dimensional imaging. In operation, a piezoelectric generates short bursts of radiofrequency , which are focused by an acoustic lens (often ) through a medium like onto the sample; the reflected or transmitted echoes, resulting from mismatches (Z = ρc, where ρ is and c is speed), are detected to form contrast in the image. The sample is raster-scanned mechanically or electronically, and the processed signals produce C-scan (horizontal cross-sections) or B-scan (vertical) images, with time-gating allowing depth selectivity by analyzing echo arrival times. Key components include the , acoustic lens, matching layer for impedance optimization, and signal processor, operating typically at 5–2000 MHz to balance (up to several millimeters at low frequencies) and resolution (limited by λ = c/f and ). SAM excels in applications requiring inspection of hidden flaws, such as detecting voids, cracks, and delaminations in , composites, and welds without surface preparation, as well as characterizing elastic properties in materials like and biological samples like cell membranes. Its advantages include deep penetration into opaque media (unlike ), non-invasiveness, and sensitivity to mechanical contrasts, making it valuable in , failure analysis, and biomedical research for imaging soft tissues or stress distributions. However, trade-offs exist between resolution and penetration, with high frequencies attenuating quickly (e.g., 0.025 mm depth at 1 GHz), and imaging speed limited to 2–8 minutes per scan in standard setups.

Overview

Definition and capabilities

A scanning acoustic microscope (SAM) is a non-destructive device that employs high-frequency ultrasonic waves, typically in the range of 5 MHz to 2 GHz, to visualize internal structures and surface features of samples by raster-scanning a focused acoustic beam across the specimen. In operation, a piezoelectric generates short ultrasonic pulses that are focused onto the sample via a lens; the reflected echoes from mismatches or the transmitted waves are then detected and processed to construct two-dimensional or three-dimensional images based on signal , time-of-flight, or phase. This technique, first demonstrated by R. A. Lemons and C. F. Quate in , enables detailed examination of opaque materials in fields such as and . SAM's key capabilities include the detection of subsurface defects such as voids, cracks, and delaminations in non-transparent hard materials, as well as elastic and biological samples, by exploiting variations in acoustic impedance. It can also quantify acoustic properties like sound velocity and attenuation, providing insights into material density, elasticity, and viscoelasticity. Resolution depends on the operating frequency and coupling medium, achieving lateral resolutions below 1 μm (e.g., 0.7 μm at 2 GHz) and axial resolutions around 1 μm, allowing sub-micrometer-scale imaging of internal features. Among its advantages, SAM is entirely non-invasive, permitting repeated inspections without sample alteration, and it excels at penetrating non-metallic materials where optical methods fail due to opacity or . The system supports multiple coupling modes, including immersion in liquids like water for optimal transmission, waterless liquid coupling, or air-coupled configurations for sensitive samples, with scanning times in traditional setups ranging from 2 to 8 minutes, while modern high-speed systems can complete comprehensive subsurface analysis in seconds.

Types and variants

Scanning acoustic microscopes (SAMs) are primarily categorized into reflection-mode, transmission-mode, and hybrid configurations based on how acoustic signals are detected. In reflection-mode, also known as pulse-echo SAM, a single emits ultrasonic pulses and receives the echoes reflected from internal interfaces or defects within the sample, enabling non-destructive imaging of subsurface features in opaque materials. Transmission-mode SAM employs separate : one to transmit the through the sample and another to detect the transmitted signal on the opposite side, which is particularly useful for assessing material homogeneity and thickness in thin samples. Hybrid systems combine both modes, using dual for simultaneous reflection and transmission to provide complementary contrast mechanisms for comprehensive defect analysis. A prominent variant is C-mode scanning acoustic microscopy (C-SAM), which focuses on constant-depth imaging by electronically gating the reflected signals at predefined depths, producing planar slices that highlight defects in layered structures like microelectronic packages without interference from overlying or underlying features. This mode excels in detecting delaminations and voids at specific interfaces, making it ideal for in semiconductor manufacturing. SAM variants also differ by operating and medium to balance resolution and . High-frequency SAMs, operating up to several GHz, provide sub-micron surface imaging with enhanced resolution for fine-scale features but limited penetration due to increased . In contrast, low-frequency systems (typically 5-30 MHz) enable deeper penetration, up to 15 mm in materials like polymers, suitable for inspecting thick or highly attenuating samples. methods include immersion setups, where the sample is submerged in a liquid medium like for efficient ; contact modes, using direct transducer-sample interface with a for higher signal strength; and air-coupled variants, which avoid physical contact for delicate or large samples but require specialized transducers to overcome air's low mismatch. Specialized forms extend SAM capabilities for advanced applications. Scanning near-field acoustic microscopy (SNAM) achieves nanoscale resolution by operating in the near-field regime, where the transducer tip interacts closely with the sample surface to map topography and mechanical properties beyond diffraction limits. Photoacoustic variants integrate optical excitation to generate acoustic waves via light absorption, creating hybrid imaging systems that combine molecular specificity from photoacoustics with SAM's structural contrast for biomedical and material studies. SAM types have evolved from early two-dimensional scanners, which provided planar images via raster scanning, to three-dimensional tomographic systems, such as the scanning tomographic acoustic (STAM) developed in the , and more recent high-speed 3D systems, which reconstruct volumetric data through multi-angle or depth-resolved acquisitions for enhanced visualization of complex internal geometries. Recent advancements as of include high-speed wide-field systems achieving imaging speeds up to 50 Hz and AI-driven methods for enhancing resolution in live cell .

Historical Development

Early inventions and foundations

The concept of an acoustic microscope was first proposed in the late 1930s by Soviet physicist Sergei Yakovlevich Sokolov, who envisioned using focused ultrasonic waves at frequencies up to 3 GHz to image opaque materials with resolutions approaching those of optical microscopy, leveraging the short wavelengths of sound in solids or liquids. Following World War II, ultrasonic techniques saw rapid development for non-destructive testing in industrial applications, such as flaw detection in metals, which established the feasibility of generating and detecting high-frequency acoustic waves for imaging purposes. These early ideas were driven by the need to visualize internal structures in thick, opaque biological tissues, where optical methods failed due to strong light absorption and , limiting penetration to superficial layers. Early experiments in the by Sokolov yielded only low-resolution images due to technological limitations. The landmark invention of the scanning acoustic microscope occurred in 1973–1974, when R. A. Lemons and C. F. Quate at constructed the first operational device, employing a 160 MHz bonded to a lens to focus in a transmission mode for imaging biological samples. This system scanned the sample mechanically in a raster pattern through the focused beam in a water-immersion setup, detecting transmitted acoustic power with a piezoelectric receiver to form images on a cathode-ray tube display. Key foundational challenges included managing in water, which at gigahertz frequencies could exceed 100 dB/mm and restrict depth to tens of micrometers, necessitating careful control of and frequency to balance resolution and penetration. Initial resolutions achieved were around 10 μm, sufficient to resolve subcellular features in biological specimens but highlighting the trade-offs in early designs.

Key advancements and commercialization

In the 1980s, significant resolution enhancements in (SAM) were achieved through the adoption of higher ultrasonic frequencies, reaching up to 2 GHz, which enabled finer spatial detail in subsurface structures. This shift was complemented by the development of advanced focused transducers featuring numerical apertures exceeding 1, allowing for sub-micron lateral resolution in liquid-coupled environments by concentrating acoustic energy more effectively. These improvements marked a transition from early experimental setups to more practical tools for material characterization, building on the foundational 1973 invention to address limitations in penetration depth versus detail. Key technological milestones in the 1980s included the development of C-mode scanning acoustic microscopy (C-SAM) by Lawrence W. Kessler at Sonoscan, specifically tailored for non-destructive inspection of semiconductor devices to detect delaminations and voids without disassembly. By the 1990s, integration of techniques advanced SAM capabilities, enabling real-time imaging through efficient amplitude and phase analysis of reflected acoustic signals, which improved contrast and reduced processing times for industrial applications. Commercialization accelerated in the with the introduction of the first production SAM systems, including the ELSAM model by Ernst Leitz (now part of ) operating up to 1.8 GHz and Olympus instruments like the UH3 for high-resolution scans. By the 2000s, the technology saw substantial market growth in non-destructive testing sectors, driven by companies such as Sonix Inc., which launched its first PC-based SAM in 1987 and expanded into packaging inspection, and PVA TePla, which developed automated inspection systems for bonded structures. Recent developments through 2025 have incorporated for enhanced image analysis, such as models like ESRGAN and SwinIR to upscale low-resolution acoustic scans and automate defect detection in complex materials. Portable air-coupled SAM systems have emerged for in-situ applications, eliminating liquid coupling to enable non-contact inspections in field environments like components. Additionally, hybrid modalities combining SAM with photoacoustic or optical techniques have advanced multimodal , providing complementary acoustic and optical contrasts for biomedical and materials evaluation.

Physical Principles

Acoustic wave generation and propagation

In scanning acoustic microscopy, acoustic waves are generated using piezoelectric transducers that convert electrical signals into mechanical vibrations, producing longitudinal or shear waves in the ultrasonic frequency range of 10 MHz to 2 GHz. These transducers typically consist of materials like zinc oxide or lithium niobate, excited by radiofrequency pulses to emit short bursts of sound energy. The generated waves propagate initially as plane waves through a solid rod, such as sapphire, before entering the coupling medium. Wave propagation in media relevant to SAM is characterized by the , which varies significantly between liquids and solids; for example, it is approximately 1480 m/s in , the common coupling fluid, and 5000–6000 m/s in typical solids like metals or ceramics. during propagation arises from absorption and mechanisms, quantified by the α=α0fn\alpha = \alpha_0 f^n, where ff is the frequency and n≈2n \approx 2 for viscous losses in fluids like . Higher frequencies exacerbate , limiting in both the coupling medium and the sample. Focusing of the acoustic beam is achieved using spherical transducers or acoustic lenses, often formed by a curved interface between a high-velocity solid (e.g., ) and the coupling fluid, resulting in spot sizes on the order of λ/2\lambda / 2, where the λ=c/f\lambda = c / f and cc is the in the medium. occurs beyond the focal point, with near-field and far-field zones influencing resolution; at 1 GHz in , λ≈1.5 μ\lambda \approx 1.5 \, \mum, enabling sub-micrometer focusing. For wave-sample interactions, small defects scatter energy via when their size is much smaller than λ\lambda, while reflection and transmission at interfaces depend on mismatch, defined as Z=ρcZ = \rho c, where ρ\rho is and cc is ; larger mismatches yield stronger reflections. This impedance governs the amplitude coefficients for normal incidence, with the reflection coefficient R=(Z2−Z1)/(Z2+Z1)R = (Z_2 - Z_1)/(Z_2 + Z_1).

Imaging contrast and resolution

In scanning acoustic microscopy (SAM), image contrast arises primarily from the interaction of with material interfaces, governed by differences in Z=ρvZ = \rho v, where ρ\rho is and vv is sound speed. Amplitude contrast is determined by the at an interface between two media, given by R=Z2−Z1Z2+Z1R = \frac{Z_2 - Z_1}{Z_2 + Z_1}, which quantifies the fraction of incident wave intensity reflected due to impedance mismatch; for example, a large mismatch between a soft medium like and a stiff solid enhances reflectivity and thus contrast in defect detection. Phase contrast, meanwhile, stems from time-of-flight delays in the reflected echoes, expressed as Δt=2dc\Delta t = \frac{2d}{c}, where dd is the depth to the reflector and cc is the sound speed in the medium; this delay enables depth-resolved imaging by gating signals at specific times, revealing subsurface features through variations in propagation path lengths. Resolution also varies with medium; immersion in allows higher NA but requires liquid contact, while air-coupling avoids this but suffers from transmission losses and low NA. Spatial resolution in SAM is fundamentally limited by acoustic wavelength and focusing geometry, with a trade-off involving frequency: higher frequencies improve resolution but increase attenuation, reducing penetration depth. Lateral resolution, the minimum resolvable distance in the plane perpendicular to the beam axis, is approximated by δ≈0.6λNA\delta \approx 0.6 \frac{\lambda}{NA}, where λ=cf\lambda = \frac{c}{f} is the , ff is the operating , and NANA is the of the acoustic lens (typically NA=sin⁡θNA = \sin \theta, with θ\theta the half-angle of the lens ); for instance, at 100 MHz in (c ≈ 1480 m/s, λ ≈ 15 μm) and NA ≈ 1, this yields approximately 9 μm lateral resolution in immersed configurations. In air-coupled setups, resolution is typically hundreds of micrometers due to much lower effective NA from acoustic impedance mismatch. Axial resolution, along the beam direction, depends on the temporal width of the acoustic pulse τ\tau, given by δz≈cτ2\delta_z \approx \frac{c \tau}{2}; shorter pulses (achieved via transducers) enhance this to below 10 μm, though practical limits arise from dispersion in heterogeneous media. Acoustic lens effects play a critical role in SAM imaging, particularly in defocus scenarios used for material characterization. In uniform media, the lens focuses waves to a diffraction-limited spot, but heterogeneous samples introduce aberrations that distort the , broadening the focal volume and reducing contrast; these effects are mitigated by operating in immersion with matched indices or through post-processing corrections. Defocus curves, known as V(z) profiles, capture the received signal voltage V(z)V(z) as the lens-to-sample distance zz varies, modeled as V(z)=A(z)cos⁡(ϕ(z))V(z) = A(z) \cos(\phi(z)), where A(z)A(z) is the amplitude decay (from and spreading) and ϕ(z)\phi(z) is the phase shift (from interference of direct reflections and leaky surface waves); oscillations in V(z) at intervals Δz=λ2(1−cos⁡θc)\Delta z = \frac{\lambda}{2(1 - \cos \theta_c)}, with θc\theta_c the critical angle, allow extraction of elastic properties like sound speed and via fitting to theoretical models. Common imaging artifacts in SAM include speckle noise, arising from coherent interference of scattered waves from microscopic inhomogeneities within the sample, which produces a granular texture that obscures fine details and reduces ; this is particularly pronounced in high-frequency, high-NA setups and can be suppressed through spatial or filtering techniques. In immersion-based systems, critical angle reflections occur when incident rays exceed the angle for (θc=sin⁡−1(c1/c2)\theta_c = \sin^{-1}(c_1 / c_2)), generating evanescent waves or surface modes that cause unwanted or ghosting in images; for water-solid interfaces, θc\theta_c is small (around 15–20° for many metals), limiting the usable and necessitating lens designs with controlled angular acceptance to minimize these distortions.

Instrumentation and Operation

System components

A scanning acoustic microscope (SAM) typically consists of several integrated hardware and software elements designed to generate, focus, and process for high-resolution imaging. The core hardware includes the and lens assembly, which serve as the primary means for acoustic beam control, while the scanning mechanism enables precise positioning. Supporting electronics handle signal generation and acquisition, and software facilitates and user interaction. The transducer is the central component responsible for converting electrical signals into and vice versa, utilizing piezoelectric materials such as (LiNbO₃), zinc oxide (ZnO) films, lead magnesium niobate-lead titanate (PMN-PT), , or piezoelectric ceramics. These materials generate short ultrasonic pulses at frequencies ranging from 5 MHz to over 2 GHz, with ZnO particularly suited for operations above 100 MHz to achieve resolutions as fine as 0.7 μm in . The attached lens, often concave or featuring a matching layer and a (Al₂O₃) cylinder for wave delivery, focuses the acoustic beam through at the lens-coupling medium interface, typically , enabling penetration depths up to 15 mm at lower frequencies like 5 MHz while balancing resolution and depth. Zoned lens designs further optimize focusing for specific applications. The scanning mechanism employs piezoelectric stages or electromagnetic actuators, such as linear or DC motors, to perform raster or spiral scanning in an X-Y plane, with optional Z-axis control for depth adjustment. These systems achieve positioning resolutions down to 15 nm via high-precision encoders, allowing pixel-by-pixel interrogation of samples immersed in a coupling fluid tank. Stepper motors or piezoelectric translators ensure stability during scans, supporting inspection times from seconds to minutes depending on area and resolution. Signal encompass a pulser-receiver unit that generates nanosecond-width electrical pulses to excite the , followed by amplification and of the reflected echoes. High-speed A/D converters, often sampling at up to 2 GS/s with 1 GHz bandwidth, capture time-of-flight data, while time-gating circuits isolate specific echo depths to reduce and enhance contrast. These components process , phase, and time-domain signals in pulse-echo or transmission modes, enabling detection of variations. Software and control systems integrate these elements through user interfaces for parameter selection, such as gain, focus depth, and scanning speed, while executing image reconstruction algorithms. Common outputs include B-scans for cross-sectional views, C-scans for planar maps at fixed depths, and A-scans for raw waveforms, with additional modes like D-scan or 3D reconstructions derived from volumetric data. Automated processing handles histogram analysis and defect highlighting based on signal thresholds.

Scanning methodologies

In scanning acoustic microscopy (SAM), the primary data acquisition relies on the pulse-reflection, or echo, method, where a short ultrasonic pulse is generated by the transducer and directed toward the sample. The backscattered echoes from interfaces or defects are captured and analyzed in the time domain to produce various scan types. An A-scan provides a one-dimensional profile of echo amplitude versus time or depth at a single point, enabling identification of layer thicknesses or defect locations. B-scans extend this to a two-dimensional cross-sectional view by scanning along a line, while C-scans create a two-dimensional map of amplitude or time-of-flight at a fixed depth, useful for planar imaging of subsurface features. An alternative approach is the through-transmission method, which employs separate transmitter and receiver transducers positioned on opposite sides of the sample. This configuration measures the attenuation of the acoustic wave passing through the material, providing insights into its acoustic transparency and suitable for detecting defects in thin or low-attenuation samples without relying on reflections. The scanning process typically involves raster scanning, where the transducer or sample is moved in a systematic grid pattern, such as a 512×512 pixel array, to cover the area of interest. Data is acquired at each pixel position, with the pulse repetition frequency (PRF) controlled to ensure echoes from one pulse decay before the next is emitted, preventing overlap and allowing accurate depth resolution; for instance, PRF is adjusted based on sample thickness and acoustic velocity, often in the range of hundreds of kHz to MHz. Vector scanning paths may be used in specialized setups for efficiency, but raster remains standard for comprehensive coverage. Post-acquisition processing enhances image interpretability. Envelope detection is applied to the radiofrequency signals to extract envelopes, generating contrast based on reflection strength for intuitive images. Fourier transforms enable frequency-domain analysis, decomposing signals to highlight content related to material properties or defect sizes. For volumetric visualization, 3D reconstructions are achieved by stacking multiple C-scans acquired at incremental depths, integrating time-gated into a composite model of the sample's internal structure.

Comparisons with Other Techniques

Versus optical and electron microscopy

Scanning acoustic microscopy (SAM) offers distinct advantages over optical microscopy when imaging opaque or hydrated samples, such as biological tissues, where light scattering severely limits to the surface layer. In contrast, SAM utilizes that propagate through such materials, enabling visualization of subsurface structures without requiring sample transparency or , which is essential for conventional optical techniques to achieve contrast. For example, SAM can image hydrated tissues like or arteries in their native state, revealing speed-of-sound variations indicative of age-related changes, whereas optical microscopy demands , fixation, and dyes like hematoxylin-eosin for comparable detail. Resolution in SAM is typically in the sub-micrometer range (e.g., <1 μm laterally), which is comparable to low-frequency optical but inferior to the diffraction-limited ~200-250 nm achievable with visible in transparent samples. SAM's contrast arises from acoustic impedance mismatches at interfaces, providing mechanical property insights absent in optical 's reliance on variations. Compared to electron microscopy techniques like scanning electron microscopy (SEM) and transmission electron microscopy (TEM), SAM operates in a non-vacuum environment, allowing non-destructive imaging of wet or live samples immersed in liquids, such as deionized water for acoustic coupling. Electron microscopy, however, requires extensive preparation including dehydration, embedding, ultra-thin sectioning for TEM, and conductive coating (e.g., gold sputtering) under high vacuum to prevent charging and enable imaging, which can alter or damage delicate hydrated specimens. While SAM excels in subsurface defect detection, such as cracks or voids up to several millimeters deep at low frequencies (e.g., 15 mm at 5 MHz), without the need for sectioning, electron methods are confined to surface topography in SEM or thin sections in TEM. Ultimately, SAM's resolution (e.g., 0.7 μm at 2000 MHz) falls short of microscopy's nanoscale capabilities (0.1 nm laterally), but it provides unique volumetric information on acoustic properties in opaque, intact samples that neither SEM's topographic nor TEM's compositional contrasts can access noninvasively.

Versus other acoustic imaging methods

(SAM) differs from conventional imaging, such as B-mode, primarily in its use of higher frequencies and focused transducers, enabling microscale resolution. Conventional B-mode typically operates at 2–10 MHz, achieving lateral resolutions on the order of 0.5–1 mm, suitable for macroscopic imaging in diagnostics. In contrast, SAM typically employs frequencies from 5 MHz to over 2 GHz, with higher frequencies (50 MHz to over 1 GHz) yielding lateral resolutions of 1–10 μm and axial resolutions around 24 μm at 50–60 MHz, due to the shorter wavelengths and tight focusing of its single-element transducers. This focused beam in SAM provides superior lateral resolution compared to the broader beam profiles or phased-array configurations in B-mode systems, which prioritize deeper penetration over fine detail. However, SAM's higher frequencies limit penetration depth to millimeters, whereas B-mode excels in imaging structures up to several centimeters deep in soft tissues. Compared to acoustic holography and tomography, SAM offers simpler direct imaging through mechanical point-by-point scanning, producing 2D or 3D maps based on reflected or transmitted echoes without complex phase reconstruction. Acoustic holography records the full wavefront to reconstruct interference patterns, enabling volumetric visualization but requiring computational back-projection and often multiple views, which can complicate surface-specific analysis. Tomography variants, like scanning tomographic acoustic microscopy, extend SAM by incorporating holographic principles for enhanced 3D resolution in opaque materials, but they demand more sophisticated signal processing than standard SAM's raster scanning. SAM is particularly advantageous for surface and near-surface features, where its mechanical scanning avoids the diffraction artifacts common in holographic methods. In relation to photoacoustic microscopy (PAM), SAM relies on purely acoustic excitation from a piezoelectric to probe elastic and mechanical properties, whereas PAM uses laser pulses to generate thermoelastic expansion, detecting subsequent for optical absorption contrast. This makes SAM ideal for mapping and in non-transparent materials, while PAM excels in visualizing distribution or exogenous contrast agents in biological tissues due to its hybrid optical-acoustic nature. Although both achieve comparable resolutions (sub-10 μm laterally), SAM's acoustic-only approach avoids constraints but is less sensitive to molecular-specific . All acoustic methods, including SAM, are inherently limited by wave in heterogeneous media, which increases with frequency and reduces at greater depths. SAM mitigates coupling issues through immersion in a medium, such as , enhancing acoustic transmission compared to air-coupled alternatives in other techniques, though this requires sample compatibility with wet environments. Higher in SAM's GHz-range operations further confines it to thin or low-absorbing samples, a shared challenge that favors lower-frequency methods for bulk .

Applications

Materials science and non-destructive evaluation

Scanning acoustic microscopy (SAM) is widely employed in for non-destructive evaluation (NDE) of engineered materials, particularly in detecting subsurface defects such as voids, cracks, and delaminations in composite and structures used in components. In multilayered composites, SAM utilizes C-scan imaging at frequencies around 30 MHz to reveal air voids ranging from 10 to 50 µm and delaminations in adhesive layers, ensuring bond integrity without sample destruction. For instance, in -based acoustic stacks mimicking laminates, SAM identifies non-homogeneous epoxy distributions and blisters, correlating these findings with performance metrics like response variations under 4 dB. This capability extends to adhesives in structural s, where C-scan modes map interfacial weaknesses critical for load-bearing applications. SAM also enables detailed material characterization by quantifying acoustic properties that inform elasticity and microstructure. Acoustic and measurements, derived from reflection-mode SAM, map variations in elastic moduli across materials, with reflecting density-elasticity interplay in semiconductors and metals. In semiconductors, SAM assesses flip-chip assemblies by detecting voids in underfill materials, which appear as high-contrast regions in pulse-echo images at 100 MHz, aiding reliability analysis in microelectronic packaging. For metals, SAM visualizes grain boundaries as acoustic impedance discontinuities, facilitating evaluation of microstructural integrity in alloys without sectioning. These mappings prioritize viscoelastic contrasts, using techniques like ultrasound impedance microscopy to achieve resolutions down to 15 µm. In industrial contexts, SAM supports in , particularly since the expansion, by inspecting subsurface flaws in integrated circuits and printed circuit boards (PCBs). It detects delaminations at die-attach interfaces and popcorn cracks from moisture-induced expansion in plastic packages, using 50 MHz transducers for 30 µm resolution . As a standardized NDE tool, SAM aligns with broader non-destructive testing protocols for composites, evaluating bonds in cutting tool inserts like carbide-epoxy systems to prevent failure in high-stress environments. Recent case studies highlight SAM's role in advanced manufacturing evaluations. In additively manufactured metal parts, SAM combined with quantifies influenced by processing parameters, such as power in , revealing pore distributions that correlate with mechanical weaknesses via -enhanced analysis. As of 2024, SAM integrated with enables automated evaluation in additively manufactured parts, improving process monitoring efficiency. For subsurface corrosion in metallic structures, SAM images hidden pitting and beneath coatings, as demonstrated in aluminum alloys, where acoustic reflections from corroded interfaces enable early detection and severity assessment in pipeline analogs. These applications underscore SAM's penetration advantages over optical methods, typically achieving depths up to 15 mm at lower frequencies (with lateral resolutions of tens to hundreds of micrometers) and sub-micron lateral resolution at higher frequencies (with limited penetration depths) for defect sizing.

Biomedical and biological imaging

Scanning acoustic microscopy (SAM) enables high-resolution imaging of biological structures by exploiting differences, providing contrast for s and extracellular matrices in plant and animal tissues. One of the earliest applications in the 1970s involved imaging onion skin cells, as demonstrated in early images at magnifications up to 105x, highlighting boundaries through variations in speed and without the need for or sectioning. This technique has since been extended to animal cells, such as and cancer cells, revealing subcellular features like nuclei and mitochondria with sub-micron resolution (e.g., 1.5 μm lateral at 860 MHz), and measuring viscoelastic properties including speeds of approximately 1534 m/s in living cells. In medical diagnostics, SAM facilitates non-invasive detection of tumors and vascular structures by quantifying acoustic parameters like (SOS) and , which differ significantly between malignant and benign tissues. For instance, SAM discriminates cancer cells in effusion fluids with SOS cutoffs around 1628 m/s (91.7% sensitivity) and attenuation thresholds of 4.29 dB/mm, enabling rapid screening of and without radiation exposure. It also images embryonic development, such as in embryos, assessing acoustic properties to evaluate growth stages non-destructively, and visualizes microstructure, detecting softening due to immobilization with sound speed reductions observable in gradation color images. These capabilities extend to cardiovascular tissues, where SAM maps in plaques via contrasts. SAM supports specific biomedical uses, including studying mechanisms in tissues by monitoring cellular responses, such as a 400% increase in backscatter from cells after cisplatin treatment, indicating structural changes without disrupting viability. In tissue engineering, it evaluates scaffolds for and cell viability from the 2000s onward, imaging oral mucosal equivalents on acellular to track differentiation and mechanical properties non-invasively. A key advantage of SAM in is its ability to perform live imaging in aqueous media at physiological conditions (e.g., 37°C), providing acoustic contrast for soft tissues where or CT imaging lacks sensitivity due to low density differences. This non-ionizing approach preserves sample integrity, allowing time-resolved studies of or , such as thickness changes in cells from 11 μm in to 18.9 μm in .

References

  1. https://pubs.aip.org/aip/apl/article/24/4/163/527610/Acoustic-microscope-scanning-version
  2. https://pmc.ncbi.nlm.nih.gov/articles/PMC7818342/
  3. http://www.soest.hawaii.edu/HIGP/Faculty/zinin/Zi-SAM.html
  4. https://engineering.stanford.edu/about/history/heroes/2012-heroes/calvin-quate
  5. https://arxiv.org/pdf/0904.4832
  6. https://www.openaccessjournals.com/articles/acoustic-microscopy-latest-developments-and-applications.pdf
  7. https://www.sciencedirect.com/science/article/pii/S2215098624002970
  8. https://semiengineering.com/failure-analysis-of-electronic-devices-using-scanning-acoustic-microscopy/
  9. https://www.ksisam.com/acousticmicroscopy-en/technology-transducer.php
  10. https://www.eag.com/techniques/phys-chem/scanning-acoustic-microscopy-sam/
  11. https://www.semitracks.com/reference-material/failure-and-yield-analysis/failure-analysis-package-level/acoustic-microscopy.php
  12. https://ieeexplore.ieee.org/document/4441498
  13. https://www.annualreviews.org/content/journals/10.1146/annurev-bioeng-112823-103134
  14. https://www.mdpi.com/2076-3417/10/19/6757
  15. https://link.springer.com/article/10.1007/BF00694423
  16. https://pmc.ncbi.nlm.nih.gov/articles/PMC12024576/
  17. https://onlinelibrary.wiley.com/doi/abs/10.1002/ima.1850030406
  18. https://www.[researchgate](/page/ResearchGate).net/publication/380085113_Scanning_Acoustic_Microscopy_for_3D_Print_Quality_Control
  19. https://link.aps.org/doi/10.1103/PhysRevX.15.021015
  20. https://www.nde-ed.org/NDETechniques/Ultrasonics/Introduction/history.xhtml
  21. https://apps.dtic.mil/sti/tr/pdf/ADA113874.pdf
  22. https://link.springer.com/content/pdf/10.1007/978-1-4615-1873-0.pdf
  23. https://pubs.aip.org/aip/apl/article/110/5/054102/33338/Gigahertz-scanning-acoustic-microscopy-analysis-of
  24. https://www.soest.hawaii.edu/HIGP/Faculty/zinin/Zi-SAM.html
  25. https://www.meptec.org/Resources/MEPTECreport%2013.3.pdf
  26. https://ui.adsabs.harvard.edu/abs/1991ITUFF..38..141R/abstract
  27. https://www.nytimes.com/1980/08/24/archives/acoustic-microscope-developed-to-study-shallow-depths-of-objects.html
  28. https://www.sonix.com/about/history/
  29. https://www.pvateplaamerica.com/product/scanning-acoustic-microscope/sam-products/sam-1000-2000/
  30. https://iopscience.iop.org/article/10.1088/2632-2153/ad1c30
  31. https://link.springer.com/article/10.1007/s40846-020-00536-5
  32. https://www.europhysicsnews.org/articles/epn/pdf/1991/09/epn19912209p167.pdf
  33. https://www.protocols.io/view/speed-of-sound-and-attenuation-of-sound-images-by-g7upbznvp.html
  34. https://www.classltd.com/sound-velocity-table/
  35. https://www.nature.com/articles/srep40106
  36. https://academic.oup.com/book/32505/chapter/270017923
  37. https://www.sciencedirect.com/topics/engineering/scanning-acoustic-microscopy
  38. https://appmicro.springeropen.com/articles/10.1186/s42649-020-00045-4
  39. https://www.spdevices.com/what-we-do/applications/scanning-acoustic-microscopy
  40. https://doi.org/10.1186/s42649-020-00045-4
  41. https://www.pvateplaamerica.com/product/scanning-acoustic-microscope/operation-principle/
  42. https://www.mbelectronique.fr/Web_PDF/1260_2016110717490949_Microscopie-acoustique_SAM400_Specifications.pdf
  43. https://pubs.aip.org/aip/rsi/article/83/3/035113/354230/Fast-scanning-mode-and-its-realization-in-a
  44. http://www.prostek.com/ch_data/acoulab-sam-intro.pdf
  45. https://www.pvateplaamerica.com/product/scanning-acoustic-microscope/scanning-modes/
  46. https://www.ehiwave.com/key-components-of-acoustic-microscope/
  47. https://www.sciencedirect.com/topics/medicine-and-dentistry/scanning-acoustic-microscopy
  48. https://www.intechopen.com/chapters/50823
  49. https://pmc.ncbi.nlm.nih.gov/articles/PMC3176963/
  50. https://www.feinberg.northwestern.edu/sites/cam/docs/learning-resources/super-resolution-microscopy.pdf
  51. https://pmc.ncbi.nlm.nih.gov/articles/PMC3352184/
  52. https://www.intechopen.com/chapters/51246
  53. https://www.sciencedirect.com/science/article/abs/pii/S0041624X97000620
  54. https://www.spiedigitallibrary.org/conference-proceedings-of-spie/0768/1/Scanning-Tomographic-Acoustic-Microscopy-Principles-And-Recent-Developments/10.1117/12.940277.full
  55. https://link.springer.com/chapter/10.1007/978-1-4615-8210-6_3
  56. https://pmc.ncbi.nlm.nih.gov/articles/PMC4833469/
  57. https://www.sciencedirect.com/topics/pharmacology-toxicology-and-pharmaceutical-science/acoustic-microscopy
  58. https://www.sciencedirect.com/topics/materials-science/scanning-acoustic-microscopy
  59. https://www.ndt.net/article/ndt-review/papers/applsci-10-06757.pdf
  60. https://ntrs.nasa.gov/api/citations/19870014554/downloads/19870014554.pdf
  61. https://www.mdpi.com/2075-4701/11/2/290
  62. https://www.sciencephoto.com/media/10522/view/acoustic-micrograph-of-onion-cells
  63. https://www.researchgate.net/publication/330447992_High-Frequency_Time-Resolved_Scanning_Acoustic_Microscopy_for_Biomedical_Applications
  64. https://www.nature.com/articles/srep15243
  65. https://link.springer.com/chapter/10.1007/1-4020-5721-0_6
  66. https://www.science.org/doi/10.1126/science.188.4191.905
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