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Infineon Technologies
Infineon Technologies
Infineon Technologies
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Infineon Technologies AG is a German semiconductor IDM.It is also the leading automotive semiconductor manufacturer globally.[4] Infineon had roughly 58,000 employees in 2024.[3] The company was spun-off from Siemens AG in 1999.[5] In 2024 the company achieved sales of approximately €15 billion.[3]

Key Information

Markets

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Infineon markets semiconductors and systems for automotive, industrial, and multimarket sectors, as well as chip card and security products. Infineon has many subsidiaries in the US and in the Asia-Pacific region, in Singapore, and Tokyo.

Infineon has a number of facilities in Europe, one in Dresden, Germany. Infineon's high power segment is in Warstein, Germany; Villach, Graz and Linz in Austria; Cegléd in Hungary; and Italy. It also operates R&D centers in France, Singapore, Romania, Taiwan, U.K., Ukraine[6] and India, as well as fabrication units in Malaysia, Singapore, Indonesia, China, Hungary, and USA, including in El Segundo and Austin, among others. There is a Shared Service Center in Porto, Portugal.[7] Infineon is listed in the DAX index of the Frankfurt Stock Exchange. In 2010, board member Klaus Wucherer was elected as successor to the then-current chairman Max Dietrich Kley.[8] In 2023, it was Germany's largest chip manufacturer.[9] As of 2011, Infineon comprised four business areas after several restructurings:[10]

Automotive (ATV)

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Infineon provides semiconductor products for use in powertrains (engine and transmission control), comfort electronics (e.g., steering, shock absorbers, air conditioning), as well as in safety systems (ABS, airbags, ESP [electronic stability control]). The product portfolio includes microcontrollers, power semiconductors, and sensors.

Green Industrial Power (GIP)

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The industrial division of the company (named IPC until 2023)[11] includes power semiconductors and modules which are used for generation, transmission and consumption of electrical energy. Its application areas include control of electric drives for industrial applications and household appliances, modules for renewable energy production, conversion and transmission.

Power & Sensor Systems (PSS)

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The division, Power & Sensor Systems, sums up the business with semiconductor components for efficient power management or high-frequency applications. Those find application in lighting management systems and LED lighting, power supplies for servers, PCs, notebooks and consumer electronics, custom devices for peripheral devices, game consoles, applications in medical technology, high-frequency components having a protective function for communication and tuner systems and silicon MEMS microphones.

Connected Secure Systems (CSS)

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The CSS business provides microcontrollers for mobile phone SIM cards, payment cards, security chips and chips for passports, identity cards and other official documents. Infineon delivers a significant number of chips for the new German identity card.[12]

Acquisitions and divestitures

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Infineon bought the Taiwanese chip designer ADMtek in 2004.[13][14] In 2006, the former Memory Products division was carved out as Infineon's subsidiary Qimonda AG, of which Infineon last held a little over three-quarters. At its height Qimonda employed about 13,500 people; it was listed on the New York Stock Exchange until it filed for bankruptcy with the district court in Munich in January 2009.[15]

When Infineon sold Wireline Communications in July 2009 to Golden Gate Capital for €250 million,[16] the resulting company was named Lantiq. With around 1,000 employees,[17] Lantiq was acquired by Intel for US$345 million in 2015.[18] Infineon's wireless business segment was sold to Intel in January 2011 for US$1.4 billion.[19] The new company was named Intel Mobile Communications (IMC) and has approximately 3,500 employees.[20][21] Apple acquired IMC's smartphone modem business in 2019,[22] and released its C1 baseband six years later, in 2025.

In August 2014 Infineon Technologies agreed to buy the International Rectifier Corporation (IR) for about US$3 billion,[23] one third by cash and two-thirds by credit line.[24] The acquisition was officially closed on 13 January 2015.[25] In July 2016, Infineon agreed to buy Wolfspeed, a company in North Carolina, from Cree Inc. for US$850 million in cash,[26] although the deal was eventually stopped due to U.S. security concerns.[26][27] In October 2016, Infineon acquired the company Innoluce, which has expertise in MEMS and Lidar systems for use in autonomous cars. Infineon Technologies AG sold its RF Power Business Unit in March 2018 to Cree Inc. for €345 million.[28] Infineon announced in June 2019 that it would acquire Cypress Semiconductor for $9.4 billion.[29][30] The acquisition closed on 17 April 2020.[31][32]

In May 2023, Infineon acquired "tiny machine learning" company Imagimob, a Stockholm, Sweden–based company with a platform for development and deployment of AI applications.[33] Infineon acquired GaN Systems, headquartered in Ottawa, Canada, in October 2023.[34] Infineon in 2023 acted on an expansion plan by investing EUR 5 billion into its semiconductor fab in Kulim, Malaysia.[35] As of 2023 Infineon plans to build two additional plants in Dresden for €5 billion, asking the government to subsidize it with €1 billion, financed through the €4 billion European Chips Act. It will employ 3000 people.[9] In April 2025, Infineon bought Marvell's automotive ethernet division for $2.5 billion.[36]

Litigation

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In 2004–2005, an investigation was carried out into a DRAM price fixing conspiracy during 1999–2002 that damaged competition and raised PC prices.

Security flaw

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Main article: ROCA vulnerability

In October 2017, it was reported that a flaw, dubbed ROCA, in a code library developed by Infineon, which had been in widespread use in security products such as smartcards and TPMs (Trusted Platform Modules), enabled private keys to be inferred from public keys. As a result, all systems depending upon the privacy of such keys were vulnerable to compromise, such as identity theft or spoofing. Affected systems include 750,000 Estonian identity cards, 300,000 Slovak identity cards,[37] and computers that use Microsoft BitLocker drive encryption in conjunction with an affected TPM.[38] Immediately after the disclosure, Microsoft released a patch via Windows Update that works around the flaw.[39]

References

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Infineon Technologies

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Infineon Technologies AG is a German manufacturer founded in 1999 as a spin-off from AG and headquartered in Neubiberg near . The company specializes in developing and producing semiconductors and system solutions, particularly for power systems and the (IoT), enabling applications in decarbonization, digitalization, green energy, safe mobility, and connected devices. With a global presence, Infineon operates more than 100 locations, including 71 sites and 15 facilities worldwide. As of the end of September 2025, it employed approximately 57,000 people and generated revenue of about €14.7 billion in the 2025 (ending September 30, 2025). The company is publicly traded on the (ticker: IFX) and has sponsored American Depositary Receipts (ADRs) trading on the OTCQX International Premier market in the United States (ticker: IFNNY). It is recognized as a world leader in solutions, particularly in power semiconductors where it holds the number one global position. Infineon's business is organized into four main segments: Automotive (ATV), which focuses on chips for electric vehicles, advanced driver assistance systems, and ; Green Industrial Power (GIP), providing solutions for , charging infrastructure, and industrial ; Power & Sensor Systems (PSS), offering , sensors, and microcontrollers; and Connected Secure Systems (CSS), specializing in security chips for IoT and connectivity. These segments address key markets including automotive electronics, industrial applications, , and secure digital infrastructure. Key products include microcontrollers (MCUs), power management integrated circuits (ICs), sensors, radio-frequency (RF) devices, and security solutions like embedded secure elements. Infineon has driven innovations such as (SiC) and (GaN) technologies for efficient power conversion, contributing to sustainable technologies in electric vehicles and grids. Over its 25-year history, the company has expanded through strategic acquisitions, including in 2020, enhancing its portfolio in automotive and IoT applications.

History

Founding and spin-off from Siemens

Infineon Technologies AG emerged as an independent entity through the spin-off of the Siemens Semiconductor Group from Siemens AG on April 1, 1999, initially operating as a wholly owned subsidiary of the parent company. This strategic separation allowed the semiconductor operations to focus exclusively on high-growth areas, building on Siemens' long-standing expertise in the field, which traced its roots to semiconductor research and production beginning in the 1950s and expanding into integrated circuits by the early 1960s. The new company was named Infineon Technologies AG. Under the leadership of Dr. Ulrich Schumacher, who served as President and CEO from 1999 to 2004, Infineon prioritized power semiconductors, , and communications chips as its core focus areas. These domains were directly inherited from the Semiconductor Group's established portfolio, which had developed technologies for efficient , vehicle systems, and telecom infrastructure. Schumacher's tenure emphasized streamlining operations and positioning Infineon for global competition in these segments. To fuel expansion, Infineon went public with an on March 13, 2000, listing shares on the and the , capitalizing on the dot-com boom's investor enthusiasm for tech firms. The IPO raised significant funds, enabling investments in production capacity and R&D, though it occurred just before market shifts. However, the early 2000s brought severe challenges from the 2001 telecom bust, which hammered demand for communications chips and led to substantial losses. In response, Infineon launched a major program called "Impact," announcing plans to cut approximately 5,000 jobs worldwide—about 14% of its workforce—along with facility closures and cost reductions to stabilize operations.

Expansion and key milestones

Following its spin-off from Siemens in 1999, Infineon Technologies underwent significant expansion in the early , focusing on strategic acquisitions and market repositioning to build a robust portfolio in semiconductors. A pivotal shift occurred in 2006 when Infineon spun off its memory division into AG, allowing the company to refocus on higher-margin areas such as and automotive semiconductors amid a downturn in the sector. This restructuring marked a strategic pivot toward energy-efficient solutions and vehicle , aligning with emerging demands for sustainable technologies. In 2015, Infineon bolstered its power semiconductor capabilities through the acquisition of International Rectifier Corporation for approximately $3 billion in cash, enhancing its portfolio in power MOSFETs and expanding its presence in industrial and automotive power applications. The deal, completed in January 2015, integrated International Rectifier's expertise in high-voltage power management, contributing to Infineon's leadership in energy-efficient systems. The fiscal year 2019 represented a key growth milestone, with Infineon achieving of approximately €8 billion and employing around 41,400 people worldwide, driven by strong demand in automotive and industrial segments. By , the company had expanded to over 58,000 employees, reflecting sustained global scaling and investment in talent for power and sensor technologies. In 2020, Infineon navigated COVID-19-induced supply chain disruptions that temporarily hampered automotive chip demand due to production halts and logistics challenges, yet the company adapted by prioritizing critical supplies and capitalizing on recovering markets, where automotive semiconductor needs surged amid electrification trends. A leadership milestone came in 2022 with the appointment of Jochen Hanebeck as CEO effective April 1, succeeding Reinhard Ploss, as part of a planned succession to emphasize strategies in decarbonization and digitalization for sustainable semiconductor innovation. Under Hanebeck's guidance, Infineon has prioritized energy-efficient solutions to address global challenges in electrification and connectivity.

Company Overview

Global operations and facilities

Infineon Technologies AG maintains its global headquarters in , , located near , which was established following the company's spin-off from in 1999. This central hub serves as the primary base for strategic decision-making and coordinates operations across continents. The company operates 15 manufacturing sites worldwide, strategically distributed to optimize production capabilities. In , key facilities include those in Regensburg, , for fabrication, and Villach, Austria, focused on power semiconductors. Asian sites, such as the assembly and test operations in Kulim, , and , support high-volume backend processes. In the United States, the Leominster, Massachusetts, site handles specialized high-reliability production. Infineon supports its innovation pipeline through over 71 R&D centers globally, fostering advancements in technologies. Major hubs include the extensive facilities in , , which host the largest concentration of R&D personnel; , , emphasizing and system solutions; and Bangalore, , where a consolidated drives chip design and . As of the end of September 2025, Infineon employs approximately 57,000 people, forming a diverse workforce spanning over 20 countries and reflecting the company's international footprint. Infineon's strategy emphasizes efficiency by concentrating front-end primarily in , at sites like , , and , while backend assembly and testing occur mainly in , including locations in , , and a new facility in , to leverage cost advantages and regional expertise. In 2023, Infineon announced a €5 billion investment to construct a new 300mm plant in , , aimed at expanding capacity for power semiconductors and creating approximately 1,000 jobs, with production slated to begin in 2026. This expansion underscores the company's commitment to enhancing its European manufacturing base to meet demand in sectors like automotive.

Corporate governance and sustainability

Infineon Technologies AG operates under a dual-board structure typical of German Aktiengesellschaften, as governed by the German Stock Corporation Act (Aktiengesetz). The Management Board, consisting of executive directors responsible for day-to-day operations and strategic implementation, is overseen by the , which provides independent monitoring, advises on major decisions, and ensures compliance with legal and ethical standards. The company's compliance framework emphasizes ethical conduct and risk management, integrated into its Business Conduct Guidelines. Key programs include mandatory web-based anti-corruption training for selected employees, focusing on prevention and ethical decision-making, and robust data privacy measures aligned with the EU (GDPR) to safeguard personal information across operations. Infineon's sustainability strategy prioritizes environmental, social, and governance (ESG) principles, with a commitment to carbon neutrality for scope 1 and 2 by the end of 2030, building on a 66.3% reduction in these emissions compared to the 2019 baseline achieved by 2024. The company has transitioned to 100% green electricity for its European sites since 2021 and aims for 100% globally by the end of 2025, while actively engaging suppliers to address scope 3 emissions through science-based targets. Diversity and inclusion form a core social pillar, with Infineon targeting 20% women in global leadership positions by 2030; as of September 2024, this figure stood at 16.5% worldwide, supported by initiatives like the Female Leaders Night events and targeted recruiting programs. , integrated into the company's non-financial disclosures supplementing its , aligns with EU Corporate Sustainability Reporting Directive (CSRD) standards, detailing progress on ESG metrics including emissions reductions and ethical governance.

Products and Markets

Automotive semiconductors

Infineon Technologies holds a leading position in the automotive market, achieving a 13.5% global in 2024, making it the top supplier for the fifth consecutive year. The company's Automotive segment generated €7,402 million in during 2025 (ended September 30, 2025), representing over half of its total sales and underscoring its dominance in this sector. This performance reflects Infineon's focus on semiconductors essential for vehicle electrification, advanced driver-assistance systems (ADAS), and , where it provides critical components that enhance vehicle , , and connectivity. The segment experienced a 12% year-over-year decline in 2025, amid broader market headwinds. Key products in Infineon's automotive portfolio include the AURIX family of microcontrollers, which are widely used for engine management, safety systems, and domain control units due to their high performance and features compliant with standards. Power integrated circuits (ICs) from Infineon power (EV) inverters, enabling precise control of electric motors for improved range and performance. Additionally, the company's sensors, such as those in the 77 GHz and 79 GHz bands, support autonomous driving by providing real-time detection of obstacles and pedestrians, contributing to levels 2+ through 4 of . Infineon plays a pivotal role in the EV transition through its silicon carbide (SiC) and gallium nitride (GaN)-based power modules, which facilitate 800V architectures that reduce charging times and increase efficiency compared to traditional 400V systems. For instance, the HybridPACK Drive CoolSiC modules deliver high with blocking voltages up to 1200V, minimizing losses in traction inverters and supporting faster DC fast charging up to 350 kW. These wide-bandgap technologies enable up to 20% higher system efficiency, helping automakers meet stringent CO2 emission targets while extending battery life. Strategic partnerships bolster Infineon's supply chain integration, including ongoing supply to Tesla for components in vehicles like the Model Y. These collaborations ensure reliable chip delivery amid global supply challenges and align with automakers' goals. Looking ahead, the global automotive market is projected to grow at a compound annual rate of 12% from 2024 to 2030, with Infineon positioned to capture further share through its innovation in power and sensing technologies. This growth trajectory also intersects briefly with secure connectivity solutions, where Infineon's chips integrate cybersecurity features for (V2X) communications.

Industrial power solutions

Infineon's Green Industrial Power (GIP) segment focuses on semiconductors essential for , factory automation, and grid infrastructure, supporting the transition to sources. In 2025, the GIP segment generated revenue of €1,631 million, representing 11% of the company's total revenue, with key drivers including demand for components in solar inverters and wind turbines. These applications leverage Infineon's expertise in efficient power conversion to integrate into stable grids. The segment's product portfolio includes modules for robust power control in industrial drives and renewable installations, CoolSiC™ MOSFETs for high-efficiency converters that minimize switching losses, and components for systems that enable long-distance transmission in smart grids. IGBT modules provide high current handling and reliability for generators, while CoolSiC™ MOSFETs support compact designs in solar string inverters, and HVDC solutions facilitate efficient power flow from offshore renewables to onshore networks. In decarbonization efforts, these technologies enable over 99% efficiency in photovoltaic systems through reduced conduction and switching losses in CoolSiC™-based inverters, maximizing energy harvest from solar panels. For centers, Infineon's power solutions help halve power delivery network losses from approximately 17%, enhancing overall energy efficiency amid rising computational demands. These advancements align with broader goals to lower carbon footprints in energy-intensive sectors. Market trends in the GIP segment reflect the global , with record order backlogs for wind turbines and policy support driving demand for efficient . Forecasts indicate continued expansion in renewable infrastructure, fueled by initiatives like the EU Green Deal that promote green energy adoption. Infineon has expanded collaborations, such as with , to supply power modules for grid-forming wind turbines, improving stability and efficiency in offshore and onshore installations.

Power and sensor systems

The Power & Sensor Systems (PSS) segment of Infineon Technologies specializes in discrete power semiconductors and sensor solutions, leveraging silicon-based and compound technologies like (SiC) to enable efficient and precise detection in consumer, medical, and (IoT) applications. In 2025, the PSS segment reported revenue of €4,208 million, reflecting its role in powering compact, high-performance devices across these markets. Key products in this segment include micro-electro-mechanical systems () sensors designed for pressure and acceleration sensing, which are widely integrated into wearable devices for fitness tracking, , and health applications. For example, the XENSIV™ DPS368 digital barometric pressure sensor delivers ultra-high resolution (±2 cm equivalent) and low power consumption, supporting features like altitude measurement in and fitness bands. Similarly, Infineon's acceleration sensors, such as the KP497 series, combine pressure and motion detection in a single package for enhanced functionality in portable wearables. Complementing these, Schottky barrier diodes provide low forward voltage drop and fast switching, essential for rectification in fast-charging circuits of smartphones, thereby improving and reducing thermal dissipation in compact power supplies. A notable innovation within PSS is the XENSIV™ portfolio of magnetic sensors, which enable contactless switching and position detection through Hall-effect technology, offering durability and precision in devices prone to mechanical wear. These sensors facilitate seamless user interactions in , such as buttonless interfaces in appliances and wearables. Infineon commands a leading market position with a 21.4% share in power discretes and modules as of 2024, bolstered by rising adoption in infrastructure for enhanced connectivity and edge AI systems that demand low-latency sensing for real-time processing. The segment also supplies critical components to healthcare and sectors, where sensors ensure reliable operation in life-sustaining and energy-efficient systems. In healthcare, pressure and flow sensors support precise insulin delivery in pumps, contributing to advanced solutions. In home appliances, these technologies optimize performance in devices like smart refrigerators and washing machines by enabling accurate and power control. Power elements from PSS further extend to industrial applications for efficient energy conversion in equipment.

Secure connectivity solutions

Infineon Technologies' Connected Secure Systems (CSS) segment focuses on delivering embedded security solutions for IoT, , and connected devices, emphasizing robust cybersecurity to protect against evolving threats. In 2025, the CSS segment generated of €1,418 million, underscoring Infineon's leadership in embedded security technologies that enable secure , , and device across diverse applications. Central to this segment are specialized products such as the OPTIGA™ Trust M security chips, which serve as high-end turnkey security controllers with built-in tamper-resistant for symmetric and asymmetric , providing a hardware root of trust for connected devices. Complementing these are microcontrollers featuring integrated hardware root-of-trust mechanisms, such as the AURIX™ TC4x series with its Crypto Security Ready Module (CSRM) for secure boot and cryptographic acceleration, and AIROC™ modules that offer pre-certified, low-power wireless connectivity with hardware security support for encryption standards like AES, RSA, and ECC. These components ensure scalable protection from device onboarding to ongoing operations, reducing vulnerability to attacks like side-channel exploits. The solutions find critical applications in securing payment systems through compliant smart cards and terminals that safeguard transactions, in smart home ecosystems for encrypted communication in devices like locks and thermostats, and in industrial IoT setups to defend against cyber threats in automation and monitoring systems. By integrating hardware-based security, these technologies mitigate risks such as unauthorized access and data breaches, fostering trust in interconnected environments. Growth in the CSS segment has been propelled by the global rollout, which expands secure connectivity demands, alongside rising needs for AI edge to process sensitive locally without exposure; the segment posted a of 12% from 2020 to 2024, followed by a 6% decline in 2025. Infineon's products adhere to stringent global standards, including PSA Certified Level 3 for IoT evaluation and compliance with pathways to , ensuring broad adoption in regulated sectors. These solutions also briefly integrate into automotive connectivity for secure (V2X) communications.

Research and Development

Innovation focus areas

Infineon Technologies invests significantly in , allocating €1.985 billion to R&D in 2024, which represented 13.3% of its of €14.955 billion. This commitment underscores the company's emphasis on advancing technologies to address global challenges in energy efficiency and . Key priorities include wide-bandgap materials such as (GaN) and (SiC), which enable higher performance in power conversion applications compared to traditional silicon-based solutions. In the realm of GaN technology, Infineon focuses on enhancing switching speeds and power density for consumer and industrial applications. GaN transistors support faster switching frequencies, enabling up to three times quicker charging in adapters and power supplies while reducing size and energy losses. A notable initiative is the CoolGaN platform, launched in 2023, which provides 600 V gate injection (GIT) high-electron-mobility transistors (HEMTs) optimized for compact, efficient power supplies in chargers and data centers. For , the company targets (EV) drivetrains, where these devices contribute to efficiency improvements, including 5-10% greater range in 800 V battery systems through reduced power losses in inverters. Infineon also integrates (AI) and into its sensor technologies to enable and smarter systems. This involves techniques that process from XENSIV™ sensors and XMC™ microcontrollers, allowing for and equipment optimization in industrial settings. Looking ahead, industry forecasts predict accelerated GaN adoption in starting in 2025, driven by demand for compact chargers, with the power GaN market projected to reach $3 billion by 2030 at a 42% . These R&D efforts have led to numerous patents supporting advancements in GaN and SiC integration.

Patents and collaborations

Infineon Technologies maintains a substantial portfolio, comprising approximately 29,900 and patent applications worldwide as of the end of 2024. The company files around 1,900 new patent applications annually, reflecting its ongoing commitment to innovation in technologies. A significant portion of Infineon's patents focuses on , particularly advancements in (SiC) devices. For instance, US Patent 10,586,845, granted in 2020, covers a SiC trench device and manufacturing methods that enhance performance in high-voltage applications. This patent exemplifies Infineon's leadership in SiC MOSFET technologies, which contribute to efficient power conversion in automotive and industrial systems. Infineon engages in extensive collaborations with academic institutions across Europe to advance semiconductor research. The company partners with universities including the Technical University of Munich (TUM) on various research initiatives. Additional alliances include endowed chairs and joint projects with the University of Klagenfurt, Politecnico di Milano, and the University of Zagreb, focusing on power electronics and STEM education. These efforts support talent development and technology transfer, including work on quantum sensors through broader quantum initiatives. In industry partnerships, Infineon maintains a long-term with , initiated in 2013 and extended in 2024, centered on developing and producing automotive microcontrollers using advanced embedded Flash processes. This alliance enables customized solutions for secure connectivity and . Infineon participates actively in through EU-funded projects under , emphasizing sustainable manufacturing. Notable involvements include leading the EECONE initiative, launched in 2023, which promotes a in electronics by addressing waste reduction and resource efficiency across the . Additionally, the company contributes to projects like AIMS5.0 for AI-driven sustainable manufacturing and INNONEXT_IFD for green digital innovations, resulting in shared intellectual property and co-developed technologies.

Acquisitions and Divestitures

Major acquisitions

As of September 2025, Infineon Technologies has completed 16 acquisitions, with the highest activity occurring in 2023 (three deals) and 2022 (two deals), reflecting a strategic push to bolster its portfolio amid growing demand in automotive, industrial, and connectivity sectors. One pivotal acquisition was the purchase of Corporation in January 2015 for approximately $3 billion, which established Infineon as a leader in semiconductors by integrating advanced technologies in high-voltage power MOSFETs and integrated power systems. This move expanded Infineon's capabilities in energy-efficient solutions for automotive and industrial applications, enabling broader in power conversion and control. In 2021, Infineon integrated , acquired for about $10 billion (with an enterprise value of €9 billion) and closed in April 2020, to enhance its and analog technology offerings. The deal significantly strengthened Infineon's position in the (IoT) ecosystem, adding expertise in wireless connectivity, , and , while expanding its customer base in consumer and automotive segments. The integration added approximately 6,000 employees to Infineon's workforce and substantially boosted its IoT portfolio, contributing to over 30,000 patents in combined . A key 2023 transaction was the GaN Systems acquisition in October 2023 for $830 million, which reinforced leadership in gallium nitride-based power solutions suitable for efficient RF amplification in telecommunications infrastructure and high-frequency applications. These deals enhanced Infineon's RF portfolio for 5G base stations and improved strategic fit in emerging wireless markets. Most recently, in August 2025, Infineon completed the $2.5 billion acquisition of Marvell Technology's Automotive Ethernet business, acquiring , team, and customer contracts to advance vehicle networking solutions. This acquisition positions Infineon to capitalize on the shift toward software-defined vehicles, improving high-speed data connectivity for advanced driver-assistance systems (ADAS) and , while integrating seamlessly with its existing automotive strengths. Overall, these major acquisitions have strategically expanded Infineon's technological capabilities and market reach, with integration efforts focusing on synergies in R&D and to drive innovation in power-efficient and connected systems.

Key divestitures

Infineon Technologies has undertaken several key divestitures over the years to streamline its operations, reduce exposure to volatile market segments, and concentrate resources on high-growth areas such as automotive, industrial power, and technologies. These moves have allowed the company to enhance and improve profit margins by exiting low-margin or cyclical businesses. In April 2002, Infineon sold its (GaAs) semiconductor business to TriQuint Semiconductor for an undisclosed amount, as part of early efforts to refocus on core silicon-based technologies amid a challenging market for compound semiconductors. This divestiture involved transferring production facilities and approximately 150 employees, enabling Infineon to prioritize higher-volume applications in communications and . A significant occurred in when Infineon spun off its Memory Products division into AG, an independent entity listed on the . The separation transferred DRAM production assets valued at around €1.4 billion in economic terms, allowing Infineon to divest from the highly cyclical memory market, which was prone to price volatility and overcapacity. This strategic shift improved Infineon's overall margins by an estimated 5 percentage points in subsequent years, as it redirected investments toward more stable power segments. , however, filed for in 2009 amid the global . In 2009, Infineon divested its Wireline Communications (WLC) business to an affiliate of for €250 million ($345 million at the time). The sale, which closed in November, included broadband and voice-over-IP assets serving DSL and fiber-optic applications, and resulted in the formation of Lantiq AG. This transaction was motivated by the need to refinance debt and exit a segment facing intense competition from integrated device manufacturers, thereby sharpening Infineon's focus on and power solutions. More recently, in March 2018, Infineon sold the majority of its (RF) Power Components business to , Inc. (now ) for €345 million ($375 million). The deal encompassed RF power transistors and amplifiers primarily used in mobile base stations and industrial applications, transferring about 160 employees and related . By divesting this unit, Infineon reduced its involvement in commoditized RF markets and reinforced its emphasis on power and sensor systems, aligning with a broader strategy to optimize its portfolio for sustainable growth. In June 2025, Infineon completed the sale of its 200 mm fabrication facility in Austin, Texas, to SkyWater Technology for approximately $93 million, marking a partial divestiture of legacy manufacturing assets. This move supports Infineon's ongoing optimization of its production footprint, allowing it to retain design and R&D capabilities in Austin while outsourcing mature node production to specialized foundries. In September 2025, Infineon agreed to sell its and manufacturing sites in to Malaysian Pacific Industries Berhad (MPI) for an undisclosed amount. The transaction, expected to close in early 2026, involves transferring the facilities, equipment, and approximately 1,700 employees, enabling Infineon to streamline its global manufacturing network and focus on advanced technologies while maintaining partnerships with MPI. Such divestitures have occasionally been balanced by targeted acquisitions in complementary areas, further refining the company's strategic positioning.

Financial Performance

Infineon Technologies reported revenue of €14.955 billion for 2024 (ended September 30, 2024), representing an 8% decline from the €16.309 billion achieved in FY 2023. This downturn was primarily attributed to ongoing inventory corrections in the semiconductor market following the post-pandemic normalization, though the company saw sequential improvement in the fourth quarter with revenue reaching €3.919 billion, a 6% increase from the prior quarter. For fiscal year 2025 (ended September 30, 2025), was €14.662 billion, a 2% decline from FY 2024, in line with prior guidance. The fourth quarter was €3.943 billion, up 6% from Q3 FY 2025. Profitability in FY 2025 showed an adjusted of 41.4%, segment result of €2.560 billion (17.5% margin), and of €1.015 billion. Revenue distribution across segments in FY 2024 highlighted the dominance of automotive applications, as shown in the following breakdown:
SegmentRevenue (€ million)Percentage of Total
Automotive8,42356%
Power & Sensor Systems3,41423%
Green Industrial Power1,93413%
Connected Secure Systems1,1848%
Other00%
Total14,955100%
For FY 2025, the segment breakdown was:
SegmentRevenue (€ million)Percentage of Total
Automotive7,40250%
Power & Sensor Systems4,20829%
Green Industrial Power1,63111%
Connected Secure Systems1,41810%
Other30%
Total14,662100%
These figures underscore Automotive's pivotal role, driven by demand for power semiconductors in electric vehicles, while Power & Sensor Systems benefited from sensor integrations in industrial and consumer applications. Over the longer term, Infineon has demonstrated steady revenue expansion, achieving a 10-year (CAGR) of approximately 13% from FY 2014 to FY 2024, fueled by strategic investments in power and technologies amid rising electrification trends. This growth trajectory was significantly boosted by the 2022 global , which propelled FY 2023 revenue to a record €16.3 billion—a 15% increase year-over-year from FY 2022—due to supply constraints and heightened automotive demand. However, the subsequent 2023 market slowdown, characterized by excess inventory buildup and easing shortages, led to moderated growth and the FY 2024 decline, illustrating the cyclical nature of the . Looking ahead, Infineon expects moderate growth in FY 2026 despite adverse impacts, with a significantly increased target of around €1.5 billion in AI power .

Market capitalization and stock history

Infineon Technologies AG conducted its on March 13, 2000, listing on the and the at an initial price of €35 per share. The company's ordinary shares (Stammaktie) trade on the Frankfurt Stock Exchange (FWB) under the ticker symbol IFX in EUR. American Depositary Shares (ADSs) were listed on the New York Stock Exchange from March 13, 2000, until delisted on April 24, 2009, after which ADSs began trading on the OTCQX International Premier market in USD under the ticker IFNNY. Infineon sponsors a Level I American Depositary Receipt (ADR) program, with each ADR representing one ordinary share on a 1:1 basis. The depositary bank is Deutsche Bank. ADRs are designed to make it easier for U.S. investors to buy, hold, and sell Infineon shares in USD on the U.S. market. ADR holders receive dividends in USD, typically paid about seven days after the ordinary share dividend payment in EUR. ADR holders may be charged standard fees of up to USD 0.05 per ADR for issuance or cancellation, and up to USD 0.05 per ADR per year for maintenance or dividend processing. Investors can convert ADRs to ordinary shares (or vice versa) through a broker or Deutsche Bank, subject to possible fees. Both ordinary shares and ADRs provide similar economic rights (e.g., dividends and capital gains), and sponsored Level I ADRs such as Infineon's typically pass through voting rights, though specifics depend on the deposit agreement. There are no major differences in fundamental ownership or company performance; the choice between ordinary shares and ADRs depends on preferred trading market, currency, and any fees. As of November 2025, Infineon's was approximately €44.7 billion. Throughout 2025, the stock reached a 52-week high of €39.43, driven by heightened investor interest in electric vehicle (EV) applications and broader semiconductor demand. Current valuation metrics reflect a trailing price-to-earnings (P/E) ratio of 36x, a forward P/E of 17x, an enterprise value to EBITDA (EV/EBITDA) multiple of 11x, and a dividend yield of about 1.0%, with consistent annual payouts established since fiscal 2019 at levels around €0.27-€0.35 per share. The stock has experienced significant volatility tied to global economic cycles and industry events. During the , shares plummeted to a low of €2.44 amid broader market turmoil in the sector. Conversely, following the completion of the €9 billion acquisition of in April 2020, the stock surged to a peak of approximately €42 in late 2021, reflecting optimism over expanded capabilities in automotive and industrial markets. Analysts anticipate moderate performance in fiscal 2026, with revenue growth driven by rising demand in AI data centers and EV power systems. This outlook aligns with broader revenue trends showing cyclical pressures in the near term but long-term growth potential in high-demand segments.

Leadership and Management

Executive team

The Management Board of Infineon Technologies AG, responsible for the company's operational and strategic direction, consists of key executives steering initiatives in semiconductors for power systems, IoT, and automotive applications. Under the oversight of the , the team focuses on driving decarbonization, digitalization, and sustainable growth across global operations. Jochen Hanebeck serves as and Chairman of the Management Board, a position he has held since April 1, 2022, with his term extending until March 31, 2027. He oversees the company's strategic priorities, including decarbonization efforts to reduce carbon emissions in semiconductor manufacturing and digitalization to enhance AI-enabled solutions for energy efficiency. Hanebeck joined Infineon in 1994, initially as part of AG's semiconductor division, where he began his career as a process engineer after earning a degree in from ; his roles have since spanned production, sales regions, and operations, culminating in his prior position as from 2016 to 2022. Dr. Sven Schneider is the , having joined the Management Board on May 1, 2019 with his appointment running until April 30, 2027. He manages financial strategy, including the allocation of resources, which totaled approximately €2 billion in fiscal year 2024 to support innovations in power and technologies. Prior to Infineon, Schneider held senior and roles at Linde AG from 1995 to 2019, where he advanced from finance analyst to head of group controlling and mergers & acquisitions; he holds a doctorate in from the . Alexander Gorski assumed the role of on October 1, 2025, succeeding Dr. Rutger Wijburg, who retired after establishing foundations for production efficiency and . Gorski's appointment, effective until September 30, 2028, leverages his expertise in semiconductor manufacturing and global . He rejoined Infineon in 2016 as COO of the Power Management Division after serving nearly a decade as a Management Board member and Group COO at Conergy AG, a firm; earlier, he started at Infineon (then ) in 1998 in finance and business administration roles, holding a master's degree and MBA from the . Andreas Urschitz has been since May 1, 2022, with his term extended until May 31, 2030. He drives global marketing strategies, particularly for power and sensor systems that enable and applications, building on over 30 years in the . Urschitz joined Infineon in 1994 (as part of AG) and served as President of the Power & Sensor Systems Division from 2012 to 2022, overseeing market positioning in automotive and industrial sectors; he earned a in commercial science from the Vienna of Economics and Business. Elke Reichart serves as Chief Digital and Sustainability Officer, having joined the Management Board in 2023. She is responsible for groupwide digitalization and strategy, , digital customer interface, software transformation, data strategy and protection, cyber and physical security governance, process excellence, and . Prior to Infineon, Reichart served as CEO of TUI InfoTec GmbH and Chief Digital Officer at AG from 2018 to 2021, and held various vice president roles at from 2006 to 2017, including in strategy, planning, and sales; she began her career at in 1991.

Supervisory board

The Supervisory Board of Infineon Technologies AG comprises 16 members as of 2025, evenly divided between eight shareholder representatives and eight employee representatives in accordance with German co-determination regulations. This structure ensures balanced representation of stakeholder interests in overseeing the company's governance. The board is chaired by Dr. , a former senior executive at Group and CEO of AG from 2018 to 2022, who assumed the role in February 2023. Employee representatives include labor union delegates such as Susanne Lachenmann, who serves as chairwoman of the general at Infineon and has been a board member since 2015. Among the shareholder representatives and other key independents are technology expert Dr. Mirco Synde, an employee representative with extensive experience in operations and activities since joining the board in 2022, and specialist Margret Suckale, former of SE and a board member since 2020. These members contribute specialized expertise in technology, operations, and financial oversight. The Supervisory Board's primary responsibilities include advising on corporate strategy, reviewing and approving annual , monitoring Board activities, and appointing or dismissing executive members. It convenes regularly, holding eight meetings in 2024, typically aligning with quarterly cycles to address key decisions. The board emphasizes diversity, with 43.75% women members as of the latest report, fostering inclusive perspectives for robust .

Litigation history

Infineon Technologies has been involved in several significant legal disputes, primarily related to antitrust violations and rights in the . These cases have spanned antitrust investigations, infringements, and legacy corporate disputes, often resulting in substantial financial settlements or penalties that impacted the company's operations and reputation. One of the most prominent cases was the DRAM price-fixing investigation spanning 1999 to 2002. In 2004, the U.S. Department of Justice imposed a $160 million criminal fine on Infineon for conspiring with other chipmakers to fix prices of (DRAM) chips, marking one of the largest antitrust penalties at the time. The followed with a €82.3 million fine in 2010 as part of a broader €331 million penalty against nine DRAM producers. Related U.S. class-action lawsuits from purchasers of DRAM chips were settled as part of multi-company agreements totaling hundreds of millions of dollars in the mid-2000s, resolving claims of overcharges. In the realm of patent litigation, Infineon engaged in a dispute with starting in 2008, when Fairchild accused Infineon of infringing eight patents related to power technologies, including devices. The case, filed in U.S. District Courts in and , centered on claims that Infineon's CoolMOS and OptiMOS products violated Fairchild's . By late 2009, the parties reached a settlement involving a broad cross-license agreement for technologies, allowing both to continue operations without further restrictions, though specific terms remained confidential. A major corporate legacy dispute involved the of Infineon's former subsidiary AG. In 2010, the administrator of Qimonda's estate sued Infineon, alleging that assets were transferred at inflated prices prior to the 2009 , seeking up to €3.35 billion in damages. After over a decade of litigation in German courts, the parties settled in August 2024, with Infineon agreeing to pay €753.5 million to resolve all claims, slightly below the administrator's revised demand of €800 million; this payment was recorded as a provision in Infineon's fiscal 2024 financials and had no material impact on ongoing operations. More recently, Infineon has pursued aggressive enforcement against Chinese competitor Innoscience Technology Co. Ltd. regarding (GaN) power integrated circuits. In August 2025, the Munich District Court ruled in Infineon's favor, finding that Innoscience infringed an Infineon on GaN enhancement-mode devices; the decision imposed a permanent injunction prohibiting Innoscience from manufacturing, offering, or selling the infringing products in and ordered payment of damages, though the exact amount was not publicly disclosed at the time. Paralleling this, in July 2024, Infineon filed a with the U.S. International Trade Commission (ITC) alleging infringement of four U.S. patents by Innoscience's imported GaN semiconductors used in automotive and power applications; the ITC instituted the investigation in August 2024 (Investigation No. 337-TA-1414), and as of November 2025, it remains ongoing with no final resolution reported, though preliminary findings supported Infineon's claims on certain patents. These victories have strengthened Infineon's position in the growing GaN market, projected to reach billions in annual revenue for . Overall, while Infineon has faced litigation expenses averaging in the tens of millions of euros annually—primarily covered through and provisions—the outcomes have generally favored the company in recent IP disputes, contributing to its market leadership in automotive and industrial semiconductors without long-term disruptions.

Product security vulnerabilities

Infineon Technologies has faced several disclosed vulnerabilities in its products, primarily affecting cryptographic hardware and connectivity components used in enterprise and consumer devices. These issues, while addressed through updates and collaborations, highlight challenges in securing embedded systems against evolving threats. The company's response has emphasized rapid patching and adherence to industry standards, contributing to ongoing enhancements in product trustworthiness. One prominent vulnerability was identified in 2017 as CVE-2017-15361, known as the ROCA flaw, which stemmed from a weakness in the RSA key generation algorithm implemented in Infineon's (TPM) chips, specifically versions of the RSA library up to 1.02.013. This defect allowed attackers with access to public keys to potentially recover private keys more efficiently than standard RSA cryptography permits, compromising protections in affected devices such as laptops, smartcards, and network hardware from vendors including , , and . The issue impacted millions of devices worldwide, as the flawed library was certified under standards like and , leading to widespread deployment before detection. Infineon responded by releasing patches to regenerate secure keys, and no public reports of exploitation emerged, though organizations were advised to rotate keys generated prior to the fix. In 2025, an out-of-bounds read vulnerability designated VU#282450 (also CVE-2025-2884) was disclosed in the TPM 2.0 reference implementation library at specification level 00, affecting Infineon's SLM9670 and SLB9670 TPM models integrated into products from partners like HP. This flaw could enable unauthorized data access or denial-of-service when triggered by malicious commands from user-mode applications, potentially exposing sensitive cryptographic operations in enterprise servers and PCs. The vulnerability was reported by the Trusted Computing Group, and Infineon promptly issued firmware updates in June 2025, with HP and other vendors distributing them via BIOS or driver packages by July. Another 2025 incident involved CVE-2025-44557, a state transition in the (BLE) stack of the 4 microcontroller (acquired by Infineon in 2020), version 3.66. This allowed attackers in proximity to bypass pairing and authentication processes, risking unauthorized access to IoT devices, wearables, and industrial sensors relying on BLE connectivity. The flaw primarily affected wireless applications in consumer and environments. Infineon fixed it in version 3.67, recommending immediate upgrades for exposed deployments. Infineon's security response framework includes a coordinated vulnerability disclosure process, involving notifications to affected partners and a commitment to patches within 90 days for critical issues, aligned with regulatory expectations under frameworks like PSD2 for payment security. The company has collaborated with and on disclosures, as seen in the ROCA case, where joint advisories facilitated broad mitigation across ecosystems. These efforts have resulted in minimal direct financial impact, such as limited product recalls estimated in the low tens of millions of euros, offset by strengthened certifications including ISO/SAE 21434 for automotive microcontrollers and evaluations for TPMs, bolstering customer trust in Infineon's secure elements.

References

  1. https://pitchbook.com/profiles/company/41003-56
  2. https://www.infineon.com/about/our-stories/25-years-infineon
  3. https://www.infineon.com/about/investor/infineon-at-a-glance
  4. https://www.infineon.com/about/company
  5. https://www.infineon.com/press-release/2025/infxx202511-021
  6. https://www.infineon.com/about/investor/infineon-share
  7. https://www.infineon.com/about/company/our-divisions
  8. https://www.infineon.com/
  9. https://www.company-histories.com/Infineon-Technologies-AG-Company-History.html
  10. https://www.siemens.com/global/en/company/about/history/technology/information-and-communications-technology.html
  11. https://www.eetimes.com/ceo-makes-stormy-exit-from-infineon/
  12. https://www.electronicsweekly.com/news/archived/resources-archived/infineon-to-cut-5000-jobs-worldwide-2001-07/
  13. https://www.eenewseurope.com/en/infineon-at-25/
  14. https://www.bloomberg.com/news/articles/2014-08-20/infineon-said-to-hold-talks-on-2-billion-u-s-chipmaker-deal
  15. https://www.semiconductor-today.com/news_items/2015/jan/infineon_140115.shtml
  16. https://www.annualreports.com/HostedData/AnnualReportArchive/i/infineon-technologies_2019.pdf
  17. https://www.eqs-news.com/news/corporate/infineon-concludes-fy-2024-with-an-increase-in-revenue-and-earnings-in-the-last-quarter-fy-2025-muted-expectations-in-a-weak-market-environment/c1185f01-6dfd-4dab-9f23-eb8259e72b9d_en
  18. https://www.infineon.com/content/dam/infineon/row/public/documents/corporate/investors/presentations/2020/2020-09-28-q3-fy20-investor-presentation.pdf
  19. https://www.eetimes.eu/jochen-hanebeck-appointed-new-ceo-of-infineon/
  20. https://www.infineon.com/assets/row/public/documents/corporate/investors/annual-general-meeting/2025/agm-2025-speech-ceo-hanebeck-v01-00-en.pdf
  21. https://www.infineon.com/careers/our-locations/munich
  22. https://www.infineon.com/assets/row/public/documents/corporate/company/sustainability/2025-07-empowering-resilience-brochure.pdf
  23. https://www.infineon.com/careers/our-locations
  24. https://www.infineon.com/regional/austria/research-and-development
  25. https://www.prnewswire.com/in/news-releases/infineon-reinforces-its-position-as-key-innovation-hub-in-india-with-a-new-state-of-the-art-facility-in-bengaluru-302584551.html
  26. https://www.infineon.com/press-release/2025/infxx202501-038
  27. https://www.reuters.com/technology/infineon-build-new-factory-dresden-2022-11-14/
  28. https://www.infineon.com/press-release/2025/INFXX202505-100
  29. https://www.infineon.com/about/investor/corporate-governance
  30. https://www.infineon.com/assets/row/public/documents/corporate/investors/annual-reports/2024/2024-infineon-statement-on-corporate-governance-v01-00-en.pdf
  31. https://www.infineon.com/about/investor/corporate-governance/compliance
  32. https://www.infineon.com/assets/row/public/documents/hr/miscellanous/gdpr-information-sheet-en.pdf
  33. https://www.infineon.com/about/company/sustainability/environmental-sustainability-and-climate-protection/carbon-neutrality
  34. https://www.infineon.com/assets/row/public/documents/corporate/company/sustainability/sustainability-at-infineon-2024.pdf
  35. https://www.infineon.com/press-release/2025/INFXX202510-006
  36. https://www.infineon.com/careers/diversity-inclusion
  37. https://www.infineon.com/assets/row/public/documents/hr/hr-report/infin-personalbericht-2024-en.pdf
  38. https://www.infineon.com/about/company/sustainability/csr-reporting
  39. https://www.infineon.com/press-release/2025/INFATV202504-085
  40. https://www.infineon.com/row/public/documents/corporate/press/2025/infxx202511-021e.pdf
  41. https://www.eetimes.eu/whats-in-the-box-inverters-in-tesla-model-y-saic-im-ls6-and-xpeng-g6-at-a-glance/
  42. https://en.eeworld.com.cn/news/qcdz/eic704717.html
  43. https://www.infineon.com/products/power/igbt
  44. https://www.infineon.com/products/power/mosfet/silicon-carbide
  45. https://www.infineon.com/application/high-voltage-direct-current-hvdc
  46. https://www.infineon.com/applications/renewables/wind
  47. https://www.infineon.com/applications/renewables/photovoltaic
  48. https://www.infineon.com/applications/industrial/power-transmission-and-distribution
  49. https://www.infineon.com/our-stories/green-potential-data-centers
  50. https://www.infineon.com/assets/row/public/documents/corporate/investors/presentations/2025/2025-08-05-q3-fy25-investor-presentation-v01-00-en.pdf
  51. https://www.infineon.com/market-news/2025/INFGIP202509-146
  52. https://www.infineon.com/application/smartwatch
  53. https://www.infineon.com/assets/row/public/documents/24/66/infineon-xensiv-sensor-solutions-product-selection-guide-en.pdf
  54. https://www.infineon.com/products/small-signal-transistors-diodes/diode/schottky-diode
  55. https://www.infineon.com/applications/consumer-electronics/adapters-chargers
  56. https://www.infineon.com/products/sensor/magnetic-sensors/magnetic-position-sensors/magnetic-switches
  57. https://www.infineon.com/assets/row/public/documents/corporate/fy2025-q4-web-en.pdf
  58. https://www.infineon.com/assets/row/public/documents/corporate/investors/at-a-glance/ee-growth-drivers.pdf
  59. https://www.infineon.com/application/diabetes-management
  60. https://www.infineon.com/applications/healthcare-lifestyle/medical
  61. https://www.infineon.com/dgdl/Infineon-OPTIGA_Trust_M-DataSheet-v03_70-EN.pdf?fileId=8ac78c8c818eceac01819539e0ed53e1
  62. https://www.infineon.com/product-information/safety-security-and-connectivity
  63. https://www.infineon.com/products/wireless-connectivity/airoc-bluetooth-le-bluetooth-multiprotocol/airoc-bluetooth-modules
  64. https://www.infineon.com/applications/security-solutions/payment-solutions
  65. https://www.infineon.com/applications/smart-home-building
  66. https://www.infineon.com/applications/security-solutions/security-for-iot
  67. https://www.infineon.com/content/dam/infineon/row/public/documents/corporate/investors/presentations/2024/2024-11-12-q4-fy24-investor-presentation-v01-00-en.pdf
  68. https://www.psacertified.org/partner-spotlight/infineon/
  69. https://www.infineon.com/products/security-smart-card-solutions/security-controllers/security-controllers-optimized-for-automotive-applications
  70. https://navitassemi.com/the-gan-revolution-in-fast-charging-power-conversion/
  71. https://www.infineon.com/market-news/2023/infpss202305-104
  72. https://www.infineon.com/technology/coolsic-target-applications
  73. https://www.infineon.com/assets/row/public/documents/technology/sustainable-ai-we-enable-and-provide-ai.pdf
  74. https://klika-tech.com/portfolio/case_study_operations_monitoring_and_predictive_maintenance_for_smarter_buildings_with_infineon_technologies_klika_tech_and_aws
  75. https://www.yolegroup.com/press-release/from-chargers-to-data-centers-power-gan-market-set-for-rapid-sixfold-expansion-by-2030/
  76. https://www.infineon.com/assets/row/public/documents/corporate/fy2024-q4-web-en.pdf
  77. https://patents.google.com/patent/US10586845B1/en
  78. https://www.businesswire.com/news/home/20241223079821/en/Silicon-Carbide-SiC-Patent-Landscape-Report-2024-with-IP-Profiles-for-Wolfspeed-Infineon-ROHM-STMicroelectronics-onsemi-SK-group-Coherent-General-Electric-and-Sanan---ResearchAndMarkets.com
  79. https://www.tum.de/en/news-and-events/all-news/press-releases/details/34914
  80. https://www.infineon.com/regional/austria/press-release/2025/forschungskooperation-aau
  81. https://www.polimi.it/en/the-politecnico/news/news-detail/infineon-and-politecnico-di-milano-further-expand-cooperation
  82. https://www.infineon.com/regional/austria/press-release/2022/cooperation-university-zagreb
  83. https://www.infineon.com/promo/ipcei-on-me/university-collaborations
  84. https://gf.com/gf-press-release/infineon-and-globalfoundries-extend-long-term-agreement-with-focus-on-automotive-microcontrollers/
  85. https://www.infineon.com/about/company/sustainability/environmental-sustainability-and-climate-protection/circular-economy
  86. https://silicon-saxony.de/en/infineon-european-research-project-on-industry-5-0-for-more-sustainability-and-resilience-of-european-manufacturing/
  87. https://www.infineon.com/regional/dresden/research-development-innovation
  88. https://tracxn.com/d/acquisitions/acquisitions-by-infineon/__NEs-I-MkP8U-t3MpTERzAbhSAM8PBq5iP_AKyO_e_74
  89. https://www.kirkland.com/news/press-release/2014/08/kirkland--ellis-represents-infineon-technologies-a
  90. https://www.reuters.com/article/business/infineon-revs-up-auto-business-with-10-billion-cypress-deal-idUSKCN1T40JT/
  91. https://www.infineon.com/dgdl/2019-09-16%2BAcquisition%2Bof%2BCypress.pdf?fileId=5546d4616b056b50016b1ba6930f0000
  92. https://www.infineon.com/press-release/2023/infxx202310-014
  93. https://www.semiconductor-today.com/news_items/2023/oct/infineon-251023.shtml
  94. https://www.prnewswire.com/in/news-releases/infineon-successfully-completes-acquisition-of-marvells-automotive-ethernet-business-302530213.html
  95. https://www.reuters.com/technology/infineon-technologies-buy-marvells-auto-ethernet-business-25-billion-2025-04-07/
  96. https://semiengineering.com/entities/infineon-technologies/
  97. https://www.eetimes.com/triquint-to-buy-infineons-gaas-business/
  98. https://www.eenewseurope.com/en/infineon-finally-settles-qimonda-case-for-e800m/
  99. https://www.theregister.com/2006/03/31/infineon_founds_qimonda/
  100. https://www.infineon.com/assets/row/public/documents/corporate/investors/presentations/archive/2009-08-04-q3-fy09-investor-presentation.pdf
  101. https://www.infineon.com/content/dam/infineon/row/public/documents/corporate/investors/presentations/2018/infxx201805-050e.pdf
  102. https://www.wolfspeed.com/company/news-events/news/cree-acquires-infineon-rf-power-business/
  103. https://www.infineon.com/press-release/2025/INFXX202506-120
  104. https://www.skywatertechnology.com/skywater-to-acquire-fab25/
  105. https://www.infineon.com/press-release/2025/INFXX202509-144
  106. https://www.infineon.com/press-release/2024/infxx202411-020
  107. https://www.infineon.com/dgdl/Infineon%2BAnnual%2BReport%2B2024.pdf?fileId=8ac78c8b92bced620193694bfb970095
  108. https://www.macrotrends.net/stocks/charts/IFNNY/infineon-technologies-ag/revenue
  109. https://www.infineon.com/dgdl/Infineon%2BAnnual%2BReport%2B2023.pdf?fileId=8ac78c8b8b657de2018bfceb193d00a8
  110. https://www.reuters.com/technology/infineon-lifts-2022-revenue-forecast-soaring-demand-2022-02-03/
  111. https://tradingeconomics.com/ifx:gr:market-capitalization
  112. https://markets.ft.com/data/equities/tearsheet/summary?s=IFXX.N:GER
  113. https://finance.yahoo.com/quote/IFX.DE/key-statistics/
  114. https://www.infineon.com/about/investor/infineon-share/dividend
  115. https://www.bloomberg.com/news/articles/2008-11-11/german-stocks-decline-infineon-technologies-and-allianz-drop
  116. https://www.marketscreener.com/quote/stock/INFINEON-TECHNOLOGIES-AG-436299/news/Infineon-Technologies-AG-completed-the-acquisition-of-Cypress-Semiconductor-Corporation-NasdaqGS-CY-33912679/
  117. https://www.spglobal.com/market-intelligence/en/news-insights/research/2025/08/infineon-set-for-muted-2025-before-rebound-in-2026
  118. https://www.infineon.com/about/company/leadership-team
  119. https://www.infineon.com/about/company/leadership-team/jochen-hanebeck
  120. https://www.bloomberg.com/profile/person/19769126
  121. https://www.infineon.com/about/company/leadership-team/sven-schneider
  122. https://www.infineon.com/assets/row/public/documents/corporate/fy2025-q3-web-en.pdf
  123. https://www.bloomberg.com/profile/person/18280546
  124. https://www.financetransformers.ai/cfo/23d6eb3a-6b51-4a24-a3dc-0c6cd24ce335
  125. https://www.infineon.com/press-release/2025/INFXX202507-123
  126. https://www.infineon.com/about/company/leadership-team/alexander-gorski
  127. https://www.wsj.com/market-data/quotes/DE/XFRA/IFXA/company-people/executive-profile/97690368
  128. https://www.infineon.com/about/company/leadership-team/andreas-urschitz
  129. https://www.infineon.com/press-release/2024/infxx202405-102
  130. https://www.electronicspecifier.com/news/appointments/andreas-urschitz-replaces-helmut-gassel-as-infineon-cmo/
  131. https://www.infineon.com/assets/row/public/documents/corporate/press/press-releases/business-financial-press/cv-a-urschitz-2022-en.pdf
  132. https://dld-conference.com/speaker/andreas-urschitz
  133. https://www.infineon.com/about/company/leadership-team/elke-reichart
  134. https://www.infineon.com/assets/row/public/documents/corporate/company/leadership-team/supervisory-board/cv-dr.-herbert-diess-english.pdf
  135. https://www.reuters.com/business/autos-transportation/herbert-diess-volkswagens-disruptor-in-chief-runs-out-road-2022-07-22/
  136. https://www.infineon.com/assets/row/public/documents/corporate/company/leadership-team/supervisory-board/cv-lachenmann-english.pdf
  137. https://www.infineon.com/assets/row/public/documents/corporate/company/leadership-team/supervisory-board/cv-synde-english.pdf
  138. https://www.infineon.com/assets/row/public/documents/corporate/company/leadership-team/supervisory-board/cv-suckale-english.pdf
  139. https://www.justice.gov/archive/opa/pr/2005/April/05_at_207.htm
  140. https://uk.practicallaw.thomsonreuters.com/4-102-9939?transitionType=Default&contextData=%28sc.Default%29
  141. https://www.atg.wa.gov/news/news-releases/memory-chip-makers-will-pay-173-million-price-fixing
  142. https://www.reuters.com/article/business/fairchild-semiconductor-files-lawsuit-against-infineon-idUSTRE4AS014/
  143. https://www.reuters.com/article/world/americas/fairchild-infineon-settle-patent-lawsuits-idUSSGE5BR09V/
  144. https://www.reuters.com/technology/infineon-agrees-pay-837-mln-settle-qimonda-dispute-2024-08-22/
  145. https://www.infineon.com/press-release/2025/INFXX202508-131
  146. https://www.usitc.gov/press_room/news_release/2024/er0827_65813.htm
  147. https://nvd.nist.gov/vuln/detail/CVE-2017-15361
  148. https://www.kb.cert.org/vuls/id/307015
  149. https://crocs-muni.github.io/roca/
  150. https://support.lenovo.com/us/en/product_security/ps500130-rsa-keys-generated-by-infineon-tpms-are-insecure
  151. https://kb.cert.org/vuls/id/282450
  152. https://trustedcomputinggroup.org/wp-content/uploads/VRT0009-Advisory-FINAL.pdf
  153. https://community.infineon.com/t5/OPTIGA-TPM/is-SLM9670-SLB9670-affected-by-CVE-2025-2884-VU-282450/td-p/1035077
  154. https://support.hp.com/il-he/document/ish_12737384-12737370-16?validated=true&fallbackLocale=us-en
  155. https://nvd.nist.gov/vuln/detail/CVE-2025-44557
  156. https://www.cisa.gov/news-events/bulletins/sb25-181
  157. https://github.com/advisories/GHSA-5m62-c8gp-6qqv
  158. https://www.infineon.com/content/dam/infineon/row/public/documents/corporate/company/cybersecurity/vulnerability-notification-process.pdf
  159. https://www.infineon.com/market-news/2025/infatv202503-069
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